- HOME
- POLYMER SEARCH
- Thermoset
- Epoxy
- Epoxy Adhesive
- Master Bond EP21TDCHT-LO Room Temperature Curing, Toughened Two Component Epoxy
Master Bond EP21TDCHT-LO Room Temperature Curing, Toughened Two Component Epoxy
| Category | Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive |
| Manufacturer | Master Bond Inc. |
| Trade Name | |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Master Bond EP21TDCHT-LO Room Temperature Curing, Toughened Two Component Epoxy.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Master Bond Polymer Adhesive EP21TDCHT-LO is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one to one mix ratio. Upon curing, the EP21TDCHT-LO offers high shear and peel strength which allows it to be used in a number of demanding situations including temperature cycling, as well as high vibration and mechanical shock. It will bond well to most metals, plastics, rubbers, glass and ceramics.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Viscosity | 60000 - 110000 cP | 60000 - 110000 cP | Part A |
| 70000 - 140000 cP | 70000 - 140000 cP | Part B |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | >= 60 | >= 60 | |
| Tensile Strength | >= 24.1 MPa | >= 3500 psi | |
| Elongation at Break | >= 10 % | >= 10 % | |
| Tensile Modulus | >= 1.21 GPa | >= 175 ksi | |
| Adhesive Bond Strength | >= 16.5 MPa | >= 2400 psi | shear, Al/Al, after 30 days water immersion |
| >= 17.2 MPa | >= 2500 psi | shear, Al/Al | |
| Peel Strength | >= 3.51 kN/m | >= 20.0 pli |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Maximum Service Temperature, Air | 177 °C | 350 °F | |
| Minimum Service Temperature, Air | -269 °C | -452 °F |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 1.00e+14 ohm-cm | 1.00e+14 ohm-cm | |
| Dielectric Constant | 3.8 | 3.8 |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 120 - 180 min @Temperature 93.3 °C |
2.00 - 3.00 hour @Temperature 200 °F |
|
| 2880 - 4320 min @Temperature 23.9 °C |
48.0 - 72.0 hour @Temperature 75.0 °F |
||
| Pot Life | 90 - 120 min | 90 - 120 min | 100 gram mass |
| Shelf Life | 12.0 Month @Temperature 23.9 °C |
12.0 Month @Temperature 75.0 °F |
in unopened containers |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Mixing Ratio (A to B) | 1/1 |
Users viewing this material also viewed the following:
Copyright © lookpolymers.com All Rights Reserved