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Vyncolit INSUL-PLATE™ X-28057-2HT Hole-Fill Powder For Printed Circuit Boards

Category Polymer , Thermoset , Epoxy , Filled/Reinforced Thermoset
Manufacturer Vyncolit N.V., Sumitomo Bakelite
Trade Name INSUL-PLATE™
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Vyncolit INSUL-PLATE™ X-28057-2HT Hole-Fill Powder For Printed Circuit Boards.pdf
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Material Notes:
Vyncolit INSUL-PLATE™ Hole-Fill material delivers true reliability and superior performance. This material, in powder form, is specifically suited for Hole-Fill use in glass epoxy, multi-layer and polyimide metal core circuit boards. The material is designed to meet or exceed the higher process and post-cure temperatures required for polyimide prepregs. Vyncolit Hole-Fill powder offers excellent adhesion to the metal core plates while maintaining the required mechanical and electrical properties. In addition, INSUL-PLATE material readily accepts plating with excellent adhesion. Vyncolit monitors the material on a lot-to-lot basis to assure a consistent product and to provide the high reliability required for metal core and multi-layer board applications.Information provided by Sumitomo Bakelite North America, Inc.
Physical Properties Metric English Comments
Density 1.99 g/cc
0.0719 lb/in³
As Molded
Water Absorption 0.060 %

@Temperature 23.0 °C,
Time 86400 sec
0.060 %

@Temperature 73.4 °F,
Time 24.0 hour
ASTM D570
0.20 %

@Temperature 50.0 °C,
Time 173000 sec
0.20 %

@Temperature 122 °F,
Time 48.0 hour
ASTM D570
Linear Mold Shrinkage 0.0060 cm/cm
0.0060 in/in
ASTM D792
Mechanical Properties Metric English Comments
Tensile Strength at Break 51.0 MPa
7400 psi
ASTM D638
Flexural Strength 96.0 MPa
13900 psi
ASTM D790
Flexural Modulus 13.8 GPa
2000 ksi
ASTM D790
Compressive Strength 172 MPa
24900 psi
ASTM D695
Izod Impact, Notched 0.180 J/cm
0.337 ft-lb/in
ASTM D256
Thermal Properties Metric English Comments
CTE, linear 25.0 µm/m-°C

@Temperature 40.0 - 125 °C
13.9 µin/in-°F

@Temperature 104 - 257 °F
Post Cured; ASTM E831
28.0 µm/m-°C

@Temperature 40.0 - 190 °C
15.6 µin/in-°F

@Temperature 104 - 374 °F
Post Cured; ASTM E831
29.0 µm/m-°C

@Temperature 40.0 - 125 °C
16.1 µin/in-°F

@Temperature 104 - 257 °F
As Molded; ASTM E831
Thermal Conductivity 0.630 W/m-K
4.37 BTU-in/hr-ft²-°F
ASTM C518
Maximum Service Temperature, Air 260 °C
500 °F
Glass Transition Temp, Tg 177 °C
351 °F
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+14 ohm-cm
1.00e+14 ohm-cm
ASTM D257
Insulation Resistance 1.00e+15 ohm
1.00e+15 ohm
ASTM D257
Dielectric Constant 5.25

@Frequency 1.00e+6 Hz
5.25

@Frequency 1.00e+6 Hz
dry; ASTM D150
Dielectric Strength 13.7 kV/mm
348 kV/in
short time, dry; ASTM D149
Dissipation Factor 0.0080

@Frequency 1.00e+6 Hz
0.0080

@Frequency 1.00e+6 Hz
dry; ASTM D150
Arc Resistance 180 sec
180 sec
ASTM D495
Processing Properties Metric English Comments
Processing Temperature 143 - 177 °C
290 - 350 °F
Molding
Mold Temperature 143 - 177 °C
289 - 351 °F
Shelf Life >= 6.00 Month

@Temperature 4.44 °C
>= 6.00 Month

@Temperature 40.0 °F
Descriptive Properties Value Comments
Color Black
Form Powder
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