Polymer Property : CTE, linear = 25.0 µm/m-°C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	25.0 µm/m-°C @Temperature -55.0 - 288 °C	13.9 µin/in-°F @Temperature -67.0 - 550 °F	Z-Direction; ASTM D3386-94
Rogers Corporation RO3003 Ceramic-Filled PTFE Composite, High Frequency Circuit Material Features and Benefits:
CTE, linear	25.0 µm/m-°C @Temperature 20.0 - 100 °C	13.9 µin/in-°F @Temperature 68.0 - 212 °F	ASTM E-233
UBE UPIMOL® S High Heat Polyimide Shape Description: Ube's UPIMOL is an exceptionally heat-resistant polyimide Shape. This product has the same molecular structure as UPILEX, an ultra-high heat-resistant polyimide film developed by Ub..
CTE, linear	25.0 µm/m-°C @Temperature <=150 °C	13.9 µin/in-°F @Temperature <=302 °F	ISO E 831
Wolf Kunststoff ZEDEX® ZX-410V7T A4T Polymer Alloy, Fiber Reinforced, Friction Modified Main Characteristics: Fiber-reinforced; Friction-modified; Very high stiffness (higher than that of fiber-reinforced PEEK); Very low thermal expansion coefficient; Low friction; High wear resistance..
CTE, linear	25.0 µm/m-°C @Temperature 0.000 - 100 °C	13.9 µin/in-°F @Temperature 32.0 - 212 °F	x direction; IPC TM-650 2.4.24
Arlon DiClad 880 PTFE/Woven Fiberglass Laminate Extremely Low Loss TangentExcellent Dimensional StabilityProduct Performance UniformityBenefits:Electrical Properties are highly uniform across frequencyConsistent Mechanical PerformanceExcellent Ch..
CTE, linear	25.0 µm/m-°C @Temperature 40.0 - 125 °C	13.9 µin/in-°F @Temperature 104 - 257 °F	Post Cured; ASTM E831
Vyncolit INSUL-PLATE™ X-28057-2HT Hole-Fill Powder For Printed Circuit Boards Vyncolit INSUL-PLATE™ Hole-Fill material delivers true reliability and superior performance. This material, in powder form, is specifically suited for Hole-Fill use in glass epoxy, multi-layer and ..