Polymer Property : Thermal Conductivity = 0.630 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.630 W/m-K	4.37 BTU-in/hr-ft²-°F
Trelleborg Emerson & Cuming Stycast® 2754 Two-Component Epoxy Flexible Low-Stress Encapsulant Emerson & Cuming 2754 Stycast® Two-Component Epoxy Flexible Low-Stress EncapsulantDescriptionElectronic embedment and sealing of metals, ceramics, and plastics. Protection of stress sensitive compo..
Thermal Conductivity	0.630 W/m-K	4.37 BTU-in/hr-ft²-°F	ASTM C518
Vyncolit INSUL-PLATE™ X-28057-2HT Hole-Fill Powder For Printed Circuit Boards Vyncolit INSUL-PLATE™ Hole-Fill material delivers true reliability and superior performance. This material, in powder form, is specifically suited for Hole-Fill use in glass epoxy, multi-layer and ..
Thermal Conductivity	0.630 W/m-K	4.37 BTU-in/hr-ft²-°F
Resinlab® EP1296 Highly Filled, Moderately Thixotropic Black Casting Resin Resinlab™ EP1296 is a highly filled, moderately thixotropic black casting resin designed for applications requiring good thermal conductivity, low shrinkage and a low CTE. It was especially formula..