Songhan Plastic Technology Co.,Ltd.

Master Bond EP21TDCS Two Component Silver Conductive Epoxy Adhesive

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Master Bond Inc.
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP21TDCS Two Component Silver Conductive Epoxy Adhesive.pdf
  Online Service   lookpolymers   27660005
Material Notes:
Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver conductive epoxy systems, the EP21TDCS has a one-to-one mix ratio, by weight or volume. The high strength bonds are remarkably adaptable to thermal cycling and resistant to chemicals including water, oil and most organic solvents.
Mechanical Properties Metric English Comments
Adhesive Bond Strength >= 5.86 MPa
>= 850 psi
shear, Al/Al
>= 5.86 MPa
>= 850 psi
shear, Al/Al, after 30 days water immersion
Peel Strength >= 1.75 kN/m
>= 10.0 pli
Thermal Properties Metric English Comments
Thermal Conductivity 1.59 W/m-K
11.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 135 °C
275 °F
Minimum Service Temperature, Air -269 °C
-452 °F
Electrical Properties Metric English Comments
Volume Resistivity <= 0.0010 ohm-cm
<= 0.0010 ohm-cm
Processing Properties Metric English Comments
Cure Time 60.0 - 120 min

@Temperature 93.3 °C
1.00 - 2.00 hour

@Temperature 200 °F
1440 - 2160 min

@Temperature 23.9 °C
24.0 - 36.0 hour

@Temperature 75.0 °F
Pot Life 30 - 40 min
30 - 40 min
50 grams mass
Shelf Life 6.00 Month
6.00 Month
in glass jar
3.00 Month

@Temperature 23.9 °C
3.00 Month

@Temperature 75.0 °F
in syringe
Descriptive Properties Value Comments
Mixing Ratio (A to B) 1/1
Viscosity smooth paste
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