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Polymer Property : Minimum Service Temperature, Air = -452 °F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Minimum Service Temperature, Air | -269 °C | -452 °F | |
| Polikim ULPOLEN® 1000 UHMWPE Standard Standard Ulpolen® 1000 is the universal type primarily preferred on the condition that its technical properties meet operating environment requirements. It is more cost efficient compared to specia.. |
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| Minimum Service Temperature, Air | -269 - -46.1 °C | -452 - -51.0 °F | Average value: -94.4 °C Grade Count:12 |
| Overview of materials for Epoxy, Cast, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Cast, Unreinforced". Each property range of values reported is minimum and maximum values of appr.. |
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| Minimum Service Temperature, Air | -269 - -20.0 °C | -452 - -4.00 °F | Average value: -58.3 °C Grade Count:47 |
| Overview of materials for Epoxy, High Temperature This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Encapsulating, Mineral Filled". Each property range of values reported is minimum and maximum val.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Continuous; DIN 52612 |
| Isoflon PEHD 1000 High Density Polyethylene Products with excellent friction, anti-stick, abrasion and chemical inertia characteristicsVery good impact resistanceNo moisture regainProduct for the food industryInformation provided by Isoflon. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | |
| Master Bond EP21TDCHT-LO Room Temperature Curing, Toughened Two Component Epoxy Master Bond Polymer Adhesive EP21TDCHT-LO is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one .. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | |
| Master Bond EP21TDCNFL Two Component Nickel Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | |
| Master Bond EP21TDCSLO Two Component Silver Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rap.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 100A Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)Kapton® Type A is a lower modulus film, which is conducive to dynamic flex applications.General Kapton® information: Kapton® is synthesized by polymerizing an a.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 100EN Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)Kapton® Type E and EN films have superior dimensional stability, low CHE, a CTE close to copper, and a high modulus. This type is exceptional for applications req.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 100HN Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).General.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 100ZT Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN and HN with superior bondability. Available i.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 200EN Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)Kapton® Type E and EN films have superior dimensional stability, low CHE, a CTE close to copper, and a high modulus. This type is exceptional for applications requ.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 300FPC Polyimide Film, 75 Micron Thickness Film thickness 75 micron (3.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN with improved bondability. Available in thick.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 500A Polyimide Film, 125 Micron Thickness Film thickness 125 micron (5.0 mil)Kapton® Type A is a lower modulus film, which is conducive to dynamic flex applications.General Kapton® information: Kapton® is synthesized by polymerizing an .. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 500FPC Polyimide Film, 125 Micron Thickness Film thickness 125 micron (5.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN with improved bondability. Available in thic.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 500HN Polyimide Film, 125 Micron Thickness Film thickness 125 micron (5.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).Genera.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 500VN Polyimide Film, 125 Micron Thickness Film thickness 125 micron (5.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type HN with added dimensional stability. Available .. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 50EN Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)Kapton® Type E and EN films have superior dimensional stability, low CHE, a CTE close to copper, and a high modulus. This type is exceptional for applications req.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 50FPC Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN with improved bondability. Available in thick.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 50HN Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).General.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 50ZT Polyimide Film, 13 Micron Thickness Film thickness 13 micron (0.5 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN and HN with superior bondability. Available i.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 100FPC Polyimide Film, 25 Micron Thickness Film thickness 25 micron (1.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type VN with improved bondability. Available in thick.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 200KN Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)Excellent processability, CTE close to copper, and a moderately high modulus.General Kapton® information: Kapton® is synthesized by polymerizing an aromatic dianh.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 200HN Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Available in thicknesses from 0.3 mil (7.5 µm) to 5 mil (125 µm).General .. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Maintains properties and flexibility |
| DuPont™ Kapton® 200VN Polyimide Film, 50 Micron Thickness Film thickness 50 micron 2.0 mil)All purpose polyimide film. Can be laminated, diecut, slit, formed, or adhesive-coated. Similar to Kapton® Type HN with added dimensional stability. Available in.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | |
| Master Bond EP21TDC-2LO Two component, highly flexibilized epoxy resin compound Product Description: Master Bond Polymer System EP21TDC-2LO is a two component, highly flexible epoxy resin compound for high performance bonding, sealing, coating, and encapsulation. It is formulat.. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | |
| Master Bond EP42HT-2LO Low Outgassing, Heat Resistant Two Component Epoxy Master Bond Polymer System EP42HT-2LO is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along with outstanding .. |
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| Minimum Service Temperature, Air | -269 °C | -452 °F | Average value: -269 °C Grade Count:31 |
| Overview of materials for Polyimide, Thermoset Film This property data is a summary of similar materials in the MatWeb database for the category "Polyimide, Thermoset Film". Each property range of values reported is minimum and maximum values of appr.. |
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