Polymer Property : Cure Time = 36.0 hour Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	1440 - 2160 min @Temperature 25.0 °C	24.0 - 36.0 hour @Temperature 77.0 °F	Complete Cure Cycle
Northstar Polymers MPP-A47A Liquid Castable Polyurethane MPP-A47A is a room-temperature-cure liquid castable polyurethane system. This ether-base polyurethane system is used in applications such as mold-making, prototyping, production of cast parts, pott..
Cure Time	1440 - 2160 min @Temperature 23.0 °C	24.0 - 36.0 hour @Temperature 73.4 °F
Master Bond EP21TDCS Silver Filled Electrically Conductive Epoxy Compound Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidl..
Cure Time	1440 - 2160 min @Temperature 23.9 °C	24.0 - 36.0 hour @Temperature 75.0 °F
Master Bond EP21TDCS Two Component Silver Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidl..
Cure Time	1440 - 2160 min @Temperature 23.0 °C	24.0 - 36.0 hour @Temperature 73.4 °F
Master Bond EP41S-1 Chemically Resistant Two Component Epoxy System Master Bond Polymer System EP41S-1 is a two component epoxy resin system designed for durable, high performance bonding, sealing, coating and encapsulating. It successfully withstands prolonged imm..
Cure Time	1440 - 2160 min @Temperature 23.0 °C	24.0 - 36.0 hour @Temperature 73.4 °F
Master Bond EP42LV Low Viscosity Chemically Resistant Two Component Epoxy System Master Bond Polymer System EP42LV is a low viscosity room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring outstanding chemical resistance. While EP..
Cure Time	1440 - 2160 min @Temperature 23.9 °C	24.0 - 36.0 hour @Temperature 75.0 °F	85% of maximum strength developed
Master Bond EP30LV Optically Clear, Low Viscosity Epoxy Adhesive Description: Master Bond Polymer System EP30LV is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or mo..
Cure Time	1440 - 2160 min @Temperature 23.0 °C	24.0 - 36.0 hour @Temperature 73.4 °F
Master Bond EP31 High Shear and Peel Strength Room Temperature Curing Epoxy Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4600 psi. In addition, u..
Cure Time	1440 - 2160 min @Temperature 23.9 °C	24.0 - 36.0 hour @Temperature 75.0 °F
Master Bond Supreme 11AO Electrically Isolating Adhesive and Sealant Description: Master Bond Polymer System SURPEME 11AO is a two component epoxy resin system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated..
Cure Time	1440 - 2160 min @Temperature 25.0 °C	24.0 - 36.0 hour @Temperature 77.0 °F
Atom Adhesives AA-BOND FDA22 Epoxy Adhesive AA-BOND FDA22 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administ..