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Polymer Property : Volume Resistivity = 0.0010 ohm-cm Product List

Electrical Properties

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Electrical Properties Metric English Comments
Volume Resistivity <= 0.0010 ohm-cm
<= 0.0010 ohm-cm
Cured; QAP-1017
Parker Chomerics Tecknit® 72-08116 Silver-Filled Epoxy System
Description: This is a silver filled epoxy system designed for maximum performance and lowest volume resistivity. It is easily mixed 1:1 by volume or weight, from the two one-ounce jars. Its consist..
Volume Resistivity <= 0.0010 ohm-cm
<= 0.0010 ohm-cm
Cured 2 hours at 65°C
Resin Technology Group TIGA 920H Flexible Silver Conductive
100 parts resin to 115 parts hardener.TIGA 920-H is a flexible, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications that require high flexibil..
Volume Resistivity <= 0.0010 ohm-cm
<= 0.0010 ohm-cm
Cured 1 hour at 110°C
Resin Technology Group TIGA 920H Flexible Silver Conductive
100 parts resin to 115 parts hardener.TIGA 920-H is a flexible, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications that require high flexibil..
Volume Resistivity <= 0.0010 ohm-cm
<= 0.0010 ohm-cm
Master Bond EP21TDCS Two Component Silver Conductive Epoxy Adhesive
Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidl..
Volume Resistivity <= 0.0010 ohm-cm
<= 0.0010 ohm-cm
Master Bond EP21TDCSFL Flexible Two Component Silver Conductive Epoxy
Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl..
Volume Resistivity <= 0.0010 ohm-cm
<= 0.0010 ohm-cm
Master Bond EP21TDCSMed Two Component, Silver Conductive USP Class VI Epoxy
Master Bond Polymer System EP21TDCS MED is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. The high strength..
Volume Resistivity <= 0.0010 ohm-cm
<= 0.0010 ohm-cm
Master Bond EP77M-1 Fast Setting, Silver Conductive Epoxy
Description: Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or..
Volume Resistivity 0.0010 ohm-cm
0.0010 ohm-cm
cured 2 hrs @ 65°C
Tra-Con Tra-Duct 916H03 Room Temperature Cure High Conductivity Silver Epoxy Adhesive
TRA-DUCT 916H03 is recommended for electronic bonding and sealing applications that require the combination of high conductivity coupled with good mechanical properties. This two part smooth paste s..
Volume Resistivity <= 0.0010 ohm-cm
<= 0.0010 ohm-cm
Master Bond EP21TDCSLO Two Component Silver Conductive Epoxy Adhesive
Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rap..
Volume Resistivity <= 0.0010 ohm-cm
<= 0.0010 ohm-cm
Master Bond EP3HTS Silver Filled, Electrically Conductive Epoxy
Description: Master Bond Polymer System EP3HTS is a one component, silver filled, electrically conductive epoxy system featuring high shear strength and good temperature resistance along with a fast..
Volume Resistivity <= 0.0010 ohm-cm
<= 0.0010 ohm-cm
Master Bond Supreme 10HTFS Silver Conductive Microelectronic Epoxy
Description: Master Bond Polymer System Supreme 10HTFS “snap cure” epoxy is a formulated system featuring a combination of high performance properties including high shear and peel strength, outst..
Volume Resistivity 0.0010 ohm-cm
0.0010 ohm-cm
cured 24 hrs @ 25°C
Tra-Con Tra-Duct 2902 Room Temperature Conductive Silver Epoxy Adhesive
TRA-DUCT 2902 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical prop..
Volume Resistivity 0.0010 ohm-cm
0.0010 ohm-cm
Trelleborg Emerson & Cuming Eccobond® 59C One-Component Silver Filled Electrically Conductive Silicone Adhesive
Emerson & Cuming 59C Eccobond® One-Component Silver Filled Electrically Conductive Silicone AdhesiveOne component, solvent containing, silver filled, electrically conductive, silicone pressure sens..
Volume Resistivity <= 0.0010 ohm-cm
<= 0.0010 ohm-cm
Loctite® 3882 Flexible Isotropic Epoxy Adhesive
Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..
Volume Resistivity <= 0.0010 ohm-cm
<= 0.0010 ohm-cm
Atom Adhesives AA-DUCT 904 Epoxy Adhesive
AA-DUCT 904 is a single component, heat curing, conductive epoxy that was designed for ease in handling. This high performance conductive epoxy cures quickly at elevated temperatures making it ideal..
Volume Resistivity <= 0.0010 ohm-cm
<= 0.0010 ohm-cm
Atom Adhesives AA-DUCT 905 Epoxy Adhesive
AA-DUCT 905 is a single component epoxy, formulated with pure silver powder combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive..
Volume Resistivity <= 0.0010 ohm-cm
<= 0.0010 ohm-cm
Loctite® 3887 High Adhesion Isotropic Epoxy Adhesive
Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..
Volume Resistivity <= 0.0010 ohm-cm
<= 0.0010 ohm-cm
Loctite® 3888 Room Temperature Cure Isotropic Epoxy Adhesive
Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona..
Volume Resistivity <= 0.0010 ohm-cm
<= 0.0010 ohm-cm
Master Bond EP3HTSMed Silver Filled, Medical Grade Epoxy
Description: Master Bond EP3HTSMed is a one component, silver filled, electrically conductive epoxy system featuring high shear strength and good temperature resistance along with a fast cure schedu..
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