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Epoxyset Epoxiohm EO-24 Electrically Conductive Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxyset
Trade Name Epoxiohm
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxyset Epoxiohm EO-24 Electrically Conductive Epoxy Adhesive.pdf
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Material Notes:
EO-24 is a two components, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is used for thermal management applications due to its high thermal conductivity.Information provided by Epoxyset Inc.
Physical Properties Metric English Comments
Density 3.10 g/cc
0.112 lb/in³
Viscosity 3000 cP
3000 cP
Mechanical Properties Metric English Comments
Hardness, Shore D 85
85
ASTM D2240
Shear Strength 23.0 MPa
3340 psi
Adhesive Bond Strength 9.65 MPa
1400 psi
Lap Shear Strength
Thermal Properties Metric English Comments
CTE, linear 30.0 µm/m-°C
16.7 µin/in-°F
Thermal Conductivity >= 2.50 W/m-K
>= 17.4 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 200 °C
392 °F
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Glass Transition Temp, Tg 88.0 °C
190 °F
Electrical Properties Metric English Comments
Electrical Resistivity <= 0.000400 ohm-cm
<= 0.000400 ohm-cm
Processing Properties Metric English Comments
Cure Time 5.00 min

@Temperature 175 °C
0.0833 hour

@Temperature 347 °F
60.0 min

@Temperature 125 °C
1.00 hour

@Temperature 257 °F
Pot Life >= 480 min
>= 480 min
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