Processing Properties | Metric | English | Comments |
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Cure Time | 5.00 min @Temperature 125 °C |
0.0833 hour @Temperature 257 °F |
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NextGen Adhesives P907-13 Fiber Optic Adhesive Description: NGAC P907-13 is a rapid curing, low viscosity, heat cured epoxy adhesive system that is specifically formulated for use in the fiber optic industry.Advantages and Applications: Uses inc.. |
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Cure Time | 5.00 - 10.0 min @Temperature 150 °C |
0.0833 - 0.167 hour @Temperature 302 °F |
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Resinlab® EP1325LV Thixotropic, Heat Curing Epoxy Adhesive Resinlab™ EP1325 and EP1325LV are one part thixotropic, heat curing epoxy adhesives. They can also be used as a small mass potting compounds, staking or damming adhesives, or polymer systems where .. |
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Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
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Lord Adhesives Metech 6103 Silver Conductor This material is a low viscosity thermoplastic printing ink designed for general purpose application onto various rigid substrate compositions such as epoxy board or other rigid plastic. It is desig.. |
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Cure Time | 5.00 - 10.0 min @Temperature 120 °C |
0.0833 - 0.167 hour @Temperature 248 °F |
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Lord Adhesives Thermosetâ„¢ MD-140 Conductive Adhesive LORD Thermosetâ„¢ MD-140 silver-filled conductive adhesive offers excellent thermal conductivity. It is designed for use in thermally demanding die attach applications such as microprocessor, po.. |
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Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
Press Cure |
Shin-Etsu Silicones LIMSâ„¢ KEG2000-70A/B Elastomer KEG2000-70 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. Its viscosity is low enough to allow easy pum.. |
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Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
Press Cure |
Shin-Etsu Silicones LIMSâ„¢ KEG2000-50A/B Elastomer KEG2000-50 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. Its viscosity is low enough to allow easy pum.. |
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Cure Time | 5.00 min @Temperature 125 °C |
0.0833 hour @Temperature 257 °F |
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Tra-Con Tra-Bond 2230 Color Keyed, High Temperature Epoxy Adhesive TRA-BOND 2230 is a clear, low viscosity, high temperature, two-part epoxy adhesive that changes colors during the curing process to indicate cure status. The unmixed components are light yellow; the.. |
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Cure Time | 5.00 min @Temperature 160 °C |
0.0833 hour @Temperature 320 °F |
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Trelleborg Emerson & Cuming Eccobond® A 359 One-Component High Temperature Performance Epoxy Adhesive Emerson & Cuming A 359 Eccobond® One-Component High Temperature Performance Epoxy AdhesiveAluminum filled, heat curing, epoxy adhesive. Sag resistant. Exceptional thermal and chemical resistance. H.. |
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Cure Time | 5.00 min @Temperature 120 °C |
0.0833 hour @Temperature 248 °F |
Minimum Bond Line |
Epoxy Technology EPO-TEK® 353ND Black High Temperature Epoxy Product Description: EPO TEK® 353ND Black is a a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applicationsAdvantages & Application Notes: EPO T.. |
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Cure Time | 5.00 min @Temperature 160 °C |
0.0833 hour @Temperature 320 °F |
Bond Line |
Epoxy Technology EPO-TEK® E2001 Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. Advantages & Appl.. |
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Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
Minimum Bond Line |
Epoxy Technology EPO-TEK® H20S Electrically Conductive, Silver Epoxy for Die Stamping Product Description: EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK®H20S is a highly reliable, two .. |
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Cure Time | 5.00 min @Temperature 120 °C |
0.0833 hour @Temperature 248 °F |
minimum |
Epoxy Technology EPO-TEK® H54 High Temperature Epoxy Product Description: EPO-TEK® H54 is a two component, high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in medical, hybrid, and optica.. |
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Cure Time | 5.00 min @Temperature 175 °C |
0.0833 hour @Temperature 347 °F |
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Epoxyset Epoxiohm EO-24 Electrically Conductive Epoxy Adhesive EO-24 is a two components, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is used for thermal management applica.. |
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Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
Minimum Bond Line |
Epoxy Technology EPO-TEK® H20E-LV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-LV is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a .. |
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Cure Time | 5.00 min @Temperature 482 °C |
0.0833 hour @Temperature 900 °F |
Step 2 |
Aremco Quartz-Coat™ 845 High Temperature Ceramic-Inorganic Coating Single part, waterborne, silicon-filled, phosphate-bonded, brown-black coating for glass and quartz to 2000 ºF (1093 ºC). Primarily used for marking ceramic parts and coating automotive headlamps.. |
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Cure Time | 5.00 min @Temperature 204 °C |
0.0833 hour @Temperature 399 °F |
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3M Scotchcast™ 265 Electrical Epoxy Powder Resin 3M Scotchcast Electrical Resin 265 is a new solution to an old problem. Historically, manufactures of coils, stators and armatures have used liquid-based varnishes or resins to coat and impregnate t.. |
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Cure Time | 5.00 min @Temperature 482 °C |
0.0833 hour @Temperature 900 °F |
Step 2 |
Aremco Ceramacoat™ 845-BLK High Temperature Ceramic-Inorganic Coating Single part, waterborne, silicon-filled, phosphate-bonded, Jet Black coating for glass and quartz to 2000 ºF (1093 ºC). Primarily used for marking ceramic parts and coating automotive headlamps, s.. |
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Cure Time | 5.00 min @Temperature 482 °C |
0.0833 hour @Temperature 900 °F |
Step 2 |
Aremco Ceramacoat™ 845-GRY High Temperature Ceramic-Inorganic Coating Single part, waterborne, silicon-filled, phosphate-bonded, gray coating for glass and quartz to 2000 ºF (1093 ºC). Primarily used for marking ceramic parts and coating automotive headlamps, stadiu.. |