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Polymer Property : Cure Time = 0.0833 hour Product List

Processing Properties

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Processing Properties Metric English Comments
Cure Time 5.00 min

@Temperature 125 °C
0.0833 hour

@Temperature 257 °F
NextGen Adhesives P907-13 Fiber Optic Adhesive
Description: NGAC P907-13 is a rapid curing, low viscosity, heat cured epoxy adhesive system that is specifically formulated for use in the fiber optic industry.Advantages and Applications: Uses inc..
Cure Time 5.00 - 10.0 min

@Temperature 150 °C
0.0833 - 0.167 hour

@Temperature 302 °F
Resinlab® EP1325LV Thixotropic, Heat Curing Epoxy Adhesive
Resinlab™ EP1325 and EP1325LV are one part thixotropic, heat curing epoxy adhesives. They can also be used as a small mass potting compounds, staking or damming adhesives, or polymer systems where ..
Cure Time 5.00 min

@Temperature 150 °C
0.0833 hour

@Temperature 302 °F
Lord Adhesives Metech 6103 Silver Conductor
This material is a low viscosity thermoplastic printing ink designed for general purpose application onto various rigid substrate compositions such as epoxy board or other rigid plastic. It is desig..
Cure Time 5.00 - 10.0 min

@Temperature 120 °C
0.0833 - 0.167 hour

@Temperature 248 °F
Lord Adhesives Thermosetâ„¢ MD-140 Conductive Adhesive
LORD Thermosetâ„¢ MD-140 silver-filled conductive adhesive offers excellent thermal conductivity. It is designed for use in thermally demanding die attach applications such as microprocessor, po..
Cure Time 5.00 min

@Temperature 150 °C
0.0833 hour

@Temperature 302 °F
Press Cure
Shin-Etsu Silicones LIMSâ„¢ KEG2000-70A/B Elastomer
KEG2000-70 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. Its viscosity is low enough to allow easy pum..
Cure Time 5.00 min

@Temperature 150 °C
0.0833 hour

@Temperature 302 °F
Press Cure
Shin-Etsu Silicones LIMSâ„¢ KEG2000-50A/B Elastomer
KEG2000-50 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. Its viscosity is low enough to allow easy pum..
Cure Time 5.00 min

@Temperature 125 °C
0.0833 hour

@Temperature 257 °F
Tra-Con Tra-Bond 2230 Color Keyed, High Temperature Epoxy Adhesive
TRA-BOND 2230 is a clear, low viscosity, high temperature, two-part epoxy adhesive that changes colors during the curing process to indicate cure status. The unmixed components are light yellow; the..
Cure Time 5.00 min

@Temperature 160 °C
0.0833 hour

@Temperature 320 °F
Trelleborg Emerson & Cuming Eccobond® A 359 One-Component High Temperature Performance Epoxy Adhesive
Emerson & Cuming A 359 Eccobond® One-Component High Temperature Performance Epoxy AdhesiveAluminum filled, heat curing, epoxy adhesive. Sag resistant. Exceptional thermal and chemical resistance. H..
Cure Time 5.00 min

@Temperature 120 °C
0.0833 hour

@Temperature 248 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® 353ND Black High Temperature Epoxy
Product Description: EPO TEK® 353ND Black is a a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applicationsAdvantages & Application Notes: EPO T..
Cure Time 5.00 min

@Temperature 160 °C
0.0833 hour

@Temperature 320 °F
Bond Line
Epoxy Technology EPO-TEK® E2001 Electrically Conductive, Silver-Filled Epoxy
Product Description: EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. Advantages & Appl..
Cure Time 5.00 min

@Temperature 150 °C
0.0833 hour

@Temperature 302 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® H20S Electrically Conductive, Silver Epoxy for Die Stamping
Product Description: EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK®H20S is a highly reliable, two ..
Cure Time 5.00 min

@Temperature 120 °C
0.0833 hour

@Temperature 248 °F
minimum
Epoxy Technology EPO-TEK® H54 High Temperature Epoxy
Product Description: EPO-TEK® H54 is a two component, high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in medical, hybrid, and optica..
Cure Time 5.00 min

@Temperature 175 °C
0.0833 hour

@Temperature 347 °F
Epoxyset Epoxiohm EO-24 Electrically Conductive Epoxy Adhesive
EO-24 is a two components, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is used for thermal management applica..
Cure Time 5.00 min

@Temperature 150 °C
0.0833 hour

@Temperature 302 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® H20E-LV Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H20E-LV is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a ..
Cure Time 5.00 min

@Temperature 482 °C
0.0833 hour

@Temperature 900 °F
Step 2
Aremco Quartz-Coat™ 845 High Temperature Ceramic-Inorganic Coating
Single part, waterborne, silicon-filled, phosphate-bonded, brown-black coating for glass and quartz to 2000 ºF (1093 ºC). Primarily used for marking ceramic parts and coating automotive headlamps..
Cure Time 5.00 min

@Temperature 204 °C
0.0833 hour

@Temperature 399 °F
3M Scotchcast™ 265 Electrical Epoxy Powder Resin
3M Scotchcast Electrical Resin 265 is a new solution to an old problem. Historically, manufactures of coils, stators and armatures have used liquid-based varnishes or resins to coat and impregnate t..
Cure Time 5.00 min

@Temperature 482 °C
0.0833 hour

@Temperature 900 °F
Step 2
Aremco Ceramacoat™ 845-BLK High Temperature Ceramic-Inorganic Coating
Single part, waterborne, silicon-filled, phosphate-bonded, Jet Black coating for glass and quartz to 2000 ºF (1093 ºC). Primarily used for marking ceramic parts and coating automotive headlamps, s..
Cure Time 5.00 min

@Temperature 482 °C
0.0833 hour

@Temperature 900 °F
Step 2
Aremco Ceramacoat™ 845-GRY High Temperature Ceramic-Inorganic Coating
Single part, waterborne, silicon-filled, phosphate-bonded, gray coating for glass and quartz to 2000 ºF (1093 ºC). Primarily used for marking ceramic parts and coating automotive headlamps, stadiu..
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