Polymer Property : Cure Time = 5.00 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	5.00 min @Temperature 302 °C	0.0833 hour @Temperature 576 °F
Parker Chomerics CHO-BOND 592 Conductive Epoxy Highly conductive silver-filled epoxy adhesive which combines the best properties of metals and organics. This two-component system is unique in that it combines long pot life, good electrical condu..
Cure Time	5.00 - 10.0 min @Temperature 150 °C	0.0833 - 0.167 hour @Temperature 302 °F
Resinlab® EP1320LV Heat Cure Epoxy Conformal Coating Resinlab™ EP1320 and EP1320LV are one part heat cure epoxy conformal coatings. They can also be used as a small mass potting compounds, structural adhesives, or insulating polymer systems where the..
Cure Time	5.00 min @Temperature 150 Â°C	0.0833 hour @Temperature 302 Â°F
Lord Adhesives Metech 6103 Silver Conductor This material is a low viscosity thermoplastic printing ink designed for general purpose application onto various rigid substrate compositions such as epoxy board or other rigid plastic. It is desig..
Cure Time	5.00 - 10.0 min @Temperature 120 Â°C	0.0833 - 0.167 hour @Temperature 248 Â°F
Lord Adhesives Thermosetâ„¢ MD-140 Conductive Adhesive LORD Thermosetâ„¢ MD-140 silver-filled conductive adhesive offers excellent thermal conductivity. It is designed for use in thermally demanding die attach applications such as microprocessor, po..
Cure Time	5.00 min @Temperature 170 Â°C	0.0833 hour @Temperature 338 Â°F	belt dryer
Gwent Electronic Materials C2081126P2 Conductive Silver Polymer Paste This product is a thermoplastic screen printing ink, developed for use in membrane touch switch applications as well as counter electrode in electrochemical sensors and conductive tracks. It may be ..
Cure Time	5.00 min @Temperature 120 Â°C	0.0833 hour @Temperature 248 Â°F	Press Cure
Shin-Etsu Silicones LIMSâ„¢ KE1950-10A/B Elastomer KE-1950-10 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. It's viscosity is low enough to allow easy ..
Cure Time	5.00 min @Temperature 120 Â°C	0.0833 hour @Temperature 248 Â°F	Press Cure
Shin-Etsu Silicones LIMSâ„¢ KE1950-30A/B Elastomer KE-1950-30 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. It's viscosity is low enough to allow easy ..
Cure Time	5.00 min @Temperature 120 Â°C	0.0833 hour @Temperature 248 Â°F	Press Cure
Shin-Etsu Silicones LIMSâ„¢ KE1950-70A/B Elastomer KE-1950-70 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. It's viscosity is low enough to allow easy ..
Cure Time	5.00 min @Temperature 150 Â°C	0.0833 hour @Temperature 302 Â°F	Press Cure
Shin-Etsu Silicones LIMSâ„¢ KEG2000-50A/B Elastomer KEG2000-50 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. Its viscosity is low enough to allow easy pum..
Cure Time	5.00 min @Temperature 125 °C	0.0833 hour @Temperature 257 °F
Tra-Con Tra-Bond 400-5 Low Temperature Cure Epoxy Adhesive TRA-BOND 400-5 adhesive is a general purpose non-conductive epoxy. It combines the properties of a moderate work life with the ability to cure rapidly at temperatures as low as 60°C. Having a relat..
Cure Time	5.00 min @Temperature 125 °C	0.0833 hour @Temperature 257 °F
Tra-Con Tra-Bond F253 Color Keyed High Temperature Epoxy Adhesive TRA-BOND F253 is a low viscosity, high temperature, two-part epoxy formulation that changes color during the curing process to indicate cure status. The unmixed components are light yellow; the mixt..
Cure Time	5.00 min @Temperature 125 °C	0.0833 hour @Temperature 257 °F
Tra-Con Tra-Bond F253M Color Keyed High Temperature Epoxy Adhesive TRA-BOND F253M is a low viscosity, high temperature, two-part epoxy formulation that changes color during the curing process to indicate cure status. The unmixed components are light yellow; the mix..
Cure Time	5.00 min @Temperature 150 °C	0.0833 hour @Temperature 302 °F
Tra-Con Tra-Bond F253HV Color Keyed High Temperature Epoxy Adhesive TRA-BOND F253HV is a clear, high temperature, two-part epoxy formulation that changes colors during the curing process to indicate cure status. The unmixed components are light yellow; the mixture i..
Cure Time	5.00 min @Temperature 150 °C	0.0833 hour @Temperature 302 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® H20E-PFC Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.Advantages & Application Notes: Stencil..
Cure Time	5.00 min @Temperature 150 °C	0.0833 hour @Temperature 302 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® N20E Electrically Conductive Paste Product Description: EPO-TEK® N20E is a two component, electrically and thermally conductive, epoxy adhesive designed for semiconductor and electronics assembly. Its applications and field conditi..
Cure Time	5.00 min @Temperature 175 °C	0.0833 hour @Temperature 347 °F
Atom Adhesives AA-DUCT 905 Epoxy Adhesive AA-DUCT 905 is a single component epoxy, formulated with pure silver powder combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive..
Cure Time	5.00 min @Temperature 100 °C	0.0833 hour @Temperature 212 °F	EN 2243-1
Hexcel® Redux® 810 Two-Part Epoxy Paste Adhesive Redux® 810 is a multi-purpose, high shear and peel strength, two-part, toughened epoxy paste adhesive with corrosion-inhibiting properties.Features: Available in cartridges with a static mixer and ..