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Polymer Property : Cure Time = 5.00 min Product List

Processing Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.
Processing Properties Metric English Comments
Cure Time 5.00 min

@Temperature 165 °C
0.0833 hour

@Temperature 329 °F
NuSil MED-4880 Liquid Silicone Rubber - Unrestricted Medical Use
Description: Liquid silicone rubbers, or LSRs, are elastomer systems reinforced with silica. They contain functional polymers of lower average molecular weight and viscosity when compared to high co..
Cure Time <= 5.00 min

@Temperature 150 °C
<= 0.0833 hour

@Temperature 302 °F
NuSil MED-4910 Liquid Silicone Rubber - Restricted Medical Use
Description: Liquid silicone rubbers, or LSRs, are elastomer systems reinforced with silica. They contain functional polymers of lower average molecular weight and viscosity when compared to high co..
Cure Time 5.00 min

@Temperature 125 °C
0.0833 hour

@Temperature 257 °F
NextGen Adhesives P907-13 Fiber Optic Adhesive
Description: NGAC P907-13 is a rapid curing, low viscosity, heat cured epoxy adhesive system that is specifically formulated for use in the fiber optic industry.Advantages and Applications: Uses inc..
Cure Time 5.00 min

@Temperature 177 °C
0.0833 hour

@Temperature 351 °F
NuSil MED-4244 Low Consistency Elastomer - Unrestricted Medical Use
Description: Low consistency elastomers (LCEs) are useful alternatives to liquid silicone rubber (LSR) and high consistency rubber (HCR) for end users who need a low viscosity elastomer which provid..
Cure Time 5.00 min

@Temperature 116 °C
0.0833 hour

@Temperature 241 °F
NuSil MED4-4115 Silicone, One Part High Consistent Elastomer - Restricted Medical Use
Description: HCRs can be used for extrusion of tubing and profiles (rod or ribbon), in calendared sheeting for die-cutting, or in compression or transfer molded parts such as balloons, gaskets or o-..
Cure Time 5.00 min

@Temperature 150 °C
0.0833 hour

@Temperature 302 °F
NuSil MED-4820 Liquid Silicone Rubber - Unrestricted Medical Use
Description: Liquid silicone rubbers, or LSRs, are elastomer systems reinforced with silica. They contain functional polymers of lower average molecular weight and viscosity when compared to high co..
Cure Time 5.00 min

@Temperature 116 °C
0.0833 hour

@Temperature 241 °F
NuSil MED4-4515 One-Part Standard High Consistency Elastomer - Unrestricted Medical Use
Description: HCRs can be used for extrusion of tubing and profiles (rod or ribbon), in calendared sheeting for die-cutting, or in compression or transfer molded parts such as balloons, gaskets or o-..
Cure Time 5.00 min

@Temperature 150 °C
0.0833 hour

@Temperature 302 °F
Lord Adhesives Metech 6103 Silver Conductor
This material is a low viscosity thermoplastic printing ink designed for general purpose application onto various rigid substrate compositions such as epoxy board or other rigid plastic. It is desig..
Cure Time 5.00 min

@Temperature 120 °C
0.0833 hour

@Temperature 248 °F
Press Cure
Shin-Etsu Silicones LIMSâ„¢ KE1950-30A/B Elastomer
KE-1950-30 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. It's viscosity is low enough to allow easy ..
Cure Time 5.00 min

@Temperature 150 °C
0.0833 hour

@Temperature 302 °F
Press Cure
Shin-Etsu Silicones LIMSâ„¢ KEG2002-60A/B Elastomer
Information Provided by Shin-Etsu Silicones of America, Inc.
Cure Time 5.00 min

@Temperature 125 °C
0.0833 hour

@Temperature 257 °F
Tra-Con Tra-Bond 2230 Color Keyed, High Temperature Epoxy Adhesive
TRA-BOND 2230 is a clear, low viscosity, high temperature, two-part epoxy adhesive that changes colors during the curing process to indicate cure status. The unmixed components are light yellow; the..
Cure Time 5.00 min

@Temperature 125 °C
0.0833 hour

@Temperature 257 °F
Tra-Con Tra-Bond 526M04 Color Keyed High Temperature Epoxy Adhesive
TRA-BOND 526M04 is a low viscosity, high-temperature, two-part epoxy formulation with a long working life. TRA-BOND 526M04 exhibits excellent wicking, and develops strong, tough mechanically stable ..
Cure Time 5.00 min

@Temperature 100 °C
0.0833 hour

@Temperature 212 °F
Tra-Con Tra-Bond F123LV Color Keyed High Temperature Epoxy Adhesive
TRA-BOND F123LV is a fast cure, low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating s..
Cure Time 5.00 min

@Temperature 125 °C
0.0833 hour

@Temperature 257 °F
Tra-Con Tra-Duct 2958 Snap Cure Conductive Silver Epoxy Adhesive
TRA-DUCT 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach bonding and sealing applications ..
Cure Time 5.00 min

@Temperature 150 °C
0.0833 hour

@Temperature 302 °F
Tra-Con Tra-Bond F253HV Color Keyed High Temperature Epoxy Adhesive
TRA-BOND F253HV is a clear, high temperature, two-part epoxy formulation that changes colors during the curing process to indicate cure status. The unmixed components are light yellow; the mixture i..
Cure Time 5.00 min

@Temperature 120 °C
0.0833 hour

@Temperature 248 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® 353ND High Temperature Epoxy
Product Description: EPO-TEK® 353ND is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. It is one of the most popular EPO-TEK® bra..
Cure Time 5.00 min

@Temperature 120 °C
0.0833 hour

@Temperature 248 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® 353ND-T High Temperature Thixotropic Epoxy
Product Description: EPO TEK® 353ND-T is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. Advantages & Application Notes: Suitable for fiber op..
Cure Time 5.00 min

@Temperature 120 °C
0.0833 hour

@Temperature 248 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® 353ND-T4 Thixotropic Epoxy
Product Description: EPO-TEK® 353ND-T4 is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. This is a higher viscosity version of EPO-TEK® 353..
Cure Time 5.00 min

@Temperature 150 °C
0.0833 hour

@Temperature 302 °F
minimum
Epoxy Technology EPO-TEK® 920 Thermally Conductive Epoxy
Material Description: A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB,..
Cure Time 5.00 min

@Temperature 150 °C
0.0833 hour

@Temperature 302 °F
minimum
Epoxy Technology EPO-TEK® GE116 Electrically and Thermally Insulating Epoxy
Material Description: A single component, thixotropic, electrically and thermally insulating epoxy adhesive designed for bonding SMDs to the PCB. It can be used for electronic assembly in many devi..
Cure Time 5.00 min

@Temperature 120 °C
0.0833 hour

@Temperature 248 °F
minimum
Epoxy Technology EPO-TEK® H54 High Temperature Epoxy
Product Description: EPO-TEK® H54 is a two component, high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in medical, hybrid, and optica..
Cure Time 5.00 min

@Temperature 150 °C
0.0833 hour

@Temperature 302 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® H70E-1 Thermally Conductive, Electrically Insulating Epoxy
Material Description: A two component, thermally conductive, electrically insulating epoxy adhesive designed for semiconductor and microelectronic packaging. It is most commonly used for die-attach..
Cure Time 5.00 min

@Temperature 125 °C
0.0833 hour

@Temperature 257 °F
minimum
Epoxy Technology EPO-TEK® OE101 Two Component Epoxy
Material Description: A two component epoxy designed for low stress applications in fiber optic packaging, opto-electronics and semiconductors. It is a lower modulus version of EPO-TEK® 353ND.Inf..
Cure Time 5.00 min

@Temperature 120 °C
0.0833 hour

@Temperature 248 °F
minimum
Epoxy Technology EPO-TEK® OE188 High Temperature Silica-Filled Epoxy
Product Description: EPO-TEK® OE188 is a low CTE, designed for semiconductor and fiber optic applications. Advantages & Application Notes: Paste-like viscosity allows for application by dispensing..
Cure Time 5.00 min

@Temperature 100 °C
0.0833 hour

@Temperature 212 °F
Dow Corning 3-6652 THERMALLY CONDUCTIVE ELASTOMER, KIT
Two-part, grey, low modulus, thixotropic, good thermal conductivity.Information provided by Dow Corning
Cure Time 5.00 min

@Temperature 200 °C
0.0833 hour

@Temperature 392 °F
ACC QLE 1100 QSI Quantum Silicones 43 Durometer Clear, Addition Cure, 1-part Elastomer for Coating
QLE 1100 is a 100% silicone solids elastomer designed for use as a conformal coating, but can also be used for cloth coating applications. Key Features: 100% solids Transparent, ideal for pigmentat..
Cure Time 5.00 min

@Temperature 100 °C
0.0833 hour

@Temperature 212 °F
Atom Adhesives AA-BOND F123 Epoxy Adhesive
AA-BOND F123 is a low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating single or multi..
Cure Time 5.00 min

@Temperature 482 °C
0.0833 hour

@Temperature 900 °F
Step 2
Aremco Ceramacoat™ 845-SIL High Temperature Ceramic-Inorganic Coating
Single part, waterborne, silicon-filled, phosphate-bonded, matte silver coating for glass and quartz to 2000 ºF (1093 ºC). Primarily used for marking ceramic parts and coating automotive headlamps..
Cure Time 5.00 min

@Temperature 155 °C
0.0833 hour

@Temperature 311 °F
TC90
TSE Industries Millathane® 76 Millable Polyester Polyurethane Rubber, 2.0 PHR MBTS
Millathane® 76 is a very suitable choice for use in products such as bushings, small copier rolls; automotive applications — bumpers, o-rings, hydraulic seals, belts, gaskets, solid tires — and m..
Cure Time 5.00 - 10.000 min

@Temperature 149 °C
0.0833 - 0.16667 hour

@Temperature 300 °F
Master Bond Supreme 3ANHT Epoxy Adhesives for Bonding Stainless Steel
Description: Master Bond Polymer System Supreme 3ANHT is a one component, heat cured epoxy adhesive and sealant, featuring high peel and shear strength along with good thermal conductivity and conve..
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