- HOME
- POLYMER SEARCH
- Polymer Property : Cure Time = 5.00 min
Polymer Property : Cure Time = 5.00 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 5.00 min @Temperature 24.0 °C |
0.0833 hour @Temperature 75.2 °F |
Followed by 30 min @ 60°-71°C |
| Parker Chomerics CHO-SHIELD® 2056 Conductive Coating CHO-SHIELD® 2054 silver-plated-copper filled commercial-grade coating proved high levels of EMI shielding effectiveness, abrasion resistance and excellent adhesion on a variety of materials used fo.. |
|||
| Cure Time | 5.00 - 10.0 min @Temperature 150 °C |
0.0833 - 0.167 hour @Temperature 302 °F |
|
| Resinlab® EP1325LV Thixotropic, Heat Curing Epoxy Adhesive Resinlab™ EP1325 and EP1325LV are one part thixotropic, heat curing epoxy adhesives. They can also be used as a small mass potting compounds, staking or damming adhesives, or polymer systems where .. |
|||
| Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
|
| Lord Adhesives Metech 6103 Silver Conductor This material is a low viscosity thermoplastic printing ink designed for general purpose application onto various rigid substrate compositions such as epoxy board or other rigid plastic. It is desig.. |
|||
| Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
Press Cure |
| Shin-Etsu Silicones LIMSâ„¢ KEG2000-60A/B Elastomer KEG2000-60 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. Its viscosity is low enough to allow easy pum.. |
|||
| Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
Press Cure |
| Shin-Etsu Silicones LIMSâ„¢ KEG2002-50A/B Elastomer Information Provided by Shin-Etsu Silicones of America, Inc. |
|||
| Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
Press Cure |
| Shin-Etsu Silicones LIMSâ„¢ KEG2000-75A/B Elastomer KEG2000-75 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. Its viscosity is low enough to allow easy pum.. |
|||
| Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
Press Cure |
| Shin-Etsu Silicones LIMSâ„¢ KEG2002-60A/B Elastomer Information Provided by Shin-Etsu Silicones of America, Inc. |
|||
| Cure Time | 5.00 min @Temperature 125 °C |
0.0833 hour @Temperature 257 °F |
|
| Tra-Con Tra-Bond 2230 Color Keyed, High Temperature Epoxy Adhesive TRA-BOND 2230 is a clear, low viscosity, high temperature, two-part epoxy adhesive that changes colors during the curing process to indicate cure status. The unmixed components are light yellow; the.. |
|||
| Cure Time | 5.00 min @Temperature 125 °C |
0.0833 hour @Temperature 257 °F |
|
| Tra-Con Tra-Bond F253 Color Keyed High Temperature Epoxy Adhesive TRA-BOND F253 is a low viscosity, high temperature, two-part epoxy formulation that changes color during the curing process to indicate cure status. The unmixed components are light yellow; the mixt.. |
|||
| Cure Time | 5.00 min @Temperature 125 °C |
0.0833 hour @Temperature 257 °F |
|
| Tra-Con Tra-Bond F253M Color Keyed High Temperature Epoxy Adhesive TRA-BOND F253M is a low viscosity, high temperature, two-part epoxy formulation that changes color during the curing process to indicate cure status. The unmixed components are light yellow; the mix.. |
|||
| Cure Time | 5.00 min @Temperature 125 °C |
0.0833 hour @Temperature 257 °F |
|
| Tra-Con Tra-Duct 2960 Snap Cure Electrically Conductive Silver-Filled Epoxy TRA-DUCT 2960 is a one or two-part, specially refined and processed silver filled adhesive for high speed manufacturing. Recommended for the microelectronic, automotive computer and telecommunicatio.. |
|||
| Cure Time | 5.00 min @Temperature 180 °C |
0.0833 hour @Temperature 356 °F |
|
| Trelleborg Emerson & Cuming Eccobond® C429-2 One-Component Silver Filled Electrically Conductive Epoxy Adhesive Emerson & Cuming C429-2 Eccobond® One-Component Silver Filled Electrically Conductive Epoxy AdhesiveOne component, high strength, moderate cost, silver filled, electrically conductive, epoxy adhesi.. |
|||
| Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® 375 High Temperature Epoxy Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen sy.. |
|||
| Cure Time | 5.00 min @Temperature 160 °C |
0.0833 hour @Temperature 320 °F |
Bond Line |
| Epoxy Technology EPO-TEK® E2001 Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. Advantages & Appl.. |
|||
| Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® H20-LC Electrically Conductive, Silver Epoxy Product Description: EPO TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used exte.. |
|||
| Cure Time | 5.00 min @Temperature 120 °C |
0.0833 hour @Temperature 248 °F |
minimum |
| Epoxy Technology EPO-TEK® H54 High Temperature Epoxy Product Description: EPO-TEK® H54 is a two component, high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in medical, hybrid, and optica.. |
|||
| Cure Time | 5.00 min @Temperature 125 °C |
0.0833 hour @Temperature 257 °F |
minimum |
| Epoxy Technology EPO-TEK® OE101 Two Component Epoxy Material Description: A two component epoxy designed for low stress applications in fiber optic packaging, opto-electronics and semiconductors. It is a lower modulus version of EPO-TEK® 353ND.Inf.. |
|||
| Cure Time | 5.00 min @Temperature 75.0 °C |
0.0833 hour @Temperature 167 °F |
|
| Dow Corning 3-4207 DIELECTRIC TOUGH GEL KIT Two-part, translucent green, fast RT or heat cure, tough, primerless chemical adhesion, UV indicator, and UL 94 V-1 flammability classification.Information provided by Dow Corning |
|||
| Cure Time | 5.00 min @Temperature 125 °C |
0.0833 hour @Temperature 257 °F |
|
| Atom Adhesives AA-BOND F253 Epoxy Adhesive AA-BOND F253 is a low viscosity, high temperature, two-part epoxy formulation that changes color during the curing process to indicate cure status.Appearance: Unmixed-Light Yellow; Mixed – Greenish.. |
|||
| Cure Time | 5.00 min @Temperature 482 °C |
0.0833 hour @Temperature 900 °F |
Step 2 |
| Aremco Ceramacoat™ 845-BLU High Temperature Ceramic-Inorganic Coating Single part, waterborne, silicon-filled, phosphate-bonded, blue coating for glass and quartz to 2000 ºF (1093 ºC). Primarily used for marking ceramic parts and coating automotive headlamps, stadiu.. |
|||
| Cure Time | 5.00 min @Temperature 125 °C |
0.0833 hour @Temperature 257 °F |
|
| Henkel Frekote 55-NC Mold Release Agent A non-CFC release agent designed to provide multiple releases with no contaminating transfer. This semi permanent release system chemically bonds to the mold surface to form a microthin film that is.. |
|||
| Cure Time | 5.00 - 10.000 min @Temperature 149 °C |
0.0833 - 0.16667 hour @Temperature 300 °F |
|
| Master Bond Supreme 3ANHT Epoxy Adhesives for Bonding Stainless Steel Description: Master Bond Polymer System Supreme 3ANHT is a one component, heat cured epoxy adhesive and sealant, featuring high peel and shear strength along with good thermal conductivity and conve.. |
|||
Copyright © lookpolymers.com All Rights Reserved