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Polymer Property : Cure Time = 5.00 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 5.00 min @Temperature 165 °C |
0.0833 hour @Temperature 329 °F |
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| NuSil MED-4880 Liquid Silicone Rubber - Unrestricted Medical Use Description: Liquid silicone rubbers, or LSRs, are elastomer systems reinforced with silica. They contain functional polymers of lower average molecular weight and viscosity when compared to high co.. |
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| Cure Time | <= 5.00 min @Temperature 150 °C |
<= 0.0833 hour @Temperature 302 °F |
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| NuSil MED-4910 Liquid Silicone Rubber - Restricted Medical Use Description: Liquid silicone rubbers, or LSRs, are elastomer systems reinforced with silica. They contain functional polymers of lower average molecular weight and viscosity when compared to high co.. |
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| Cure Time | 5.00 min @Temperature 125 °C |
0.0833 hour @Temperature 257 °F |
|
| NextGen Adhesives P907-13 Fiber Optic Adhesive Description: NGAC P907-13 is a rapid curing, low viscosity, heat cured epoxy adhesive system that is specifically formulated for use in the fiber optic industry.Advantages and Applications: Uses inc.. |
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| Cure Time | 5.00 min @Temperature 177 °C |
0.0833 hour @Temperature 351 °F |
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| NuSil MED-4244 Low Consistency Elastomer - Unrestricted Medical Use Description: Low consistency elastomers (LCEs) are useful alternatives to liquid silicone rubber (LSR) and high consistency rubber (HCR) for end users who need a low viscosity elastomer which provid.. |
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| Cure Time | 5.00 min @Temperature 116 °C |
0.0833 hour @Temperature 241 °F |
|
| NuSil MED4-4115 Silicone, One Part High Consistent Elastomer - Restricted Medical Use Description: HCRs can be used for extrusion of tubing and profiles (rod or ribbon), in calendared sheeting for die-cutting, or in compression or transfer molded parts such as balloons, gaskets or o-.. |
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| Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
|
| NuSil MED-4820 Liquid Silicone Rubber - Unrestricted Medical Use Description: Liquid silicone rubbers, or LSRs, are elastomer systems reinforced with silica. They contain functional polymers of lower average molecular weight and viscosity when compared to high co.. |
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| Cure Time | 5.00 min @Temperature 116 °C |
0.0833 hour @Temperature 241 °F |
|
| NuSil MED4-4515 One-Part Standard High Consistency Elastomer - Unrestricted Medical Use Description: HCRs can be used for extrusion of tubing and profiles (rod or ribbon), in calendared sheeting for die-cutting, or in compression or transfer molded parts such as balloons, gaskets or o-.. |
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| Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
|
| Lord Adhesives Metech 6103 Silver Conductor This material is a low viscosity thermoplastic printing ink designed for general purpose application onto various rigid substrate compositions such as epoxy board or other rigid plastic. It is desig.. |
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| Cure Time | 5.00 min @Temperature 120 °C |
0.0833 hour @Temperature 248 °F |
Press Cure |
| Shin-Etsu Silicones LIMSâ„¢ KE1950-30A/B Elastomer KE-1950-30 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. It's viscosity is low enough to allow easy .. |
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| Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
Press Cure |
| Shin-Etsu Silicones LIMSâ„¢ KEG2002-60A/B Elastomer Information Provided by Shin-Etsu Silicones of America, Inc. |
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| Cure Time | 5.00 min @Temperature 125 °C |
0.0833 hour @Temperature 257 °F |
|
| Tra-Con Tra-Bond 2230 Color Keyed, High Temperature Epoxy Adhesive TRA-BOND 2230 is a clear, low viscosity, high temperature, two-part epoxy adhesive that changes colors during the curing process to indicate cure status. The unmixed components are light yellow; the.. |
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| Cure Time | 5.00 min @Temperature 125 °C |
0.0833 hour @Temperature 257 °F |
|
| Tra-Con Tra-Bond 526M04 Color Keyed High Temperature Epoxy Adhesive TRA-BOND 526M04 is a low viscosity, high-temperature, two-part epoxy formulation with a long working life. TRA-BOND 526M04 exhibits excellent wicking, and develops strong, tough mechanically stable .. |
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| Cure Time | 5.00 min @Temperature 100 °C |
0.0833 hour @Temperature 212 °F |
|
| Tra-Con Tra-Bond F123LV Color Keyed High Temperature Epoxy Adhesive TRA-BOND F123LV is a fast cure, low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating s.. |
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| Cure Time | 5.00 min @Temperature 125 °C |
0.0833 hour @Temperature 257 °F |
|
| Tra-Con Tra-Duct 2958 Snap Cure Conductive Silver Epoxy Adhesive TRA-DUCT 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach bonding and sealing applications .. |
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| Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
|
| Tra-Con Tra-Bond F253HV Color Keyed High Temperature Epoxy Adhesive TRA-BOND F253HV is a clear, high temperature, two-part epoxy formulation that changes colors during the curing process to indicate cure status. The unmixed components are light yellow; the mixture i.. |
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| Cure Time | 5.00 min @Temperature 120 °C |
0.0833 hour @Temperature 248 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® 353ND High Temperature Epoxy Product Description: EPO-TEK® 353ND is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. It is one of the most popular EPO-TEK® bra.. |
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| Cure Time | 5.00 min @Temperature 120 °C |
0.0833 hour @Temperature 248 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® 353ND-T High Temperature Thixotropic Epoxy Product Description: EPO TEK® 353ND-T is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. Advantages & Application Notes: Suitable for fiber op.. |
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| Cure Time | 5.00 min @Temperature 120 °C |
0.0833 hour @Temperature 248 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® 353ND-T4 Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T4 is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. This is a higher viscosity version of EPO-TEK® 353.. |
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| Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
minimum |
| Epoxy Technology EPO-TEK® 920 Thermally Conductive Epoxy Material Description: A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB,.. |
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| Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
minimum |
| Epoxy Technology EPO-TEK® GE116 Electrically and Thermally Insulating Epoxy Material Description: A single component, thixotropic, electrically and thermally insulating epoxy adhesive designed for bonding SMDs to the PCB. It can be used for electronic assembly in many devi.. |
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| Cure Time | 5.00 min @Temperature 120 °C |
0.0833 hour @Temperature 248 °F |
minimum |
| Epoxy Technology EPO-TEK® H54 High Temperature Epoxy Product Description: EPO-TEK® H54 is a two component, high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in medical, hybrid, and optica.. |
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| Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® H70E-1 Thermally Conductive, Electrically Insulating Epoxy Material Description: A two component, thermally conductive, electrically insulating epoxy adhesive designed for semiconductor and microelectronic packaging. It is most commonly used for die-attach.. |
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| Cure Time | 5.00 min @Temperature 125 °C |
0.0833 hour @Temperature 257 °F |
minimum |
| Epoxy Technology EPO-TEK® OE101 Two Component Epoxy Material Description: A two component epoxy designed for low stress applications in fiber optic packaging, opto-electronics and semiconductors. It is a lower modulus version of EPO-TEK® 353ND.Inf.. |
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| Cure Time | 5.00 min @Temperature 120 °C |
0.0833 hour @Temperature 248 °F |
minimum |
| Epoxy Technology EPO-TEK® OE188 High Temperature Silica-Filled Epoxy Product Description: EPO-TEK® OE188 is a low CTE, designed for semiconductor and fiber optic applications. Advantages & Application Notes: Paste-like viscosity allows for application by dispensing.. |
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| Cure Time | 5.00 min @Temperature 100 °C |
0.0833 hour @Temperature 212 °F |
|
| Dow Corning 3-6652 THERMALLY CONDUCTIVE ELASTOMER, KIT Two-part, grey, low modulus, thixotropic, good thermal conductivity.Information provided by Dow Corning |
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| Cure Time | 5.00 min @Temperature 200 °C |
0.0833 hour @Temperature 392 °F |
|
| ACC QLE 1100 QSI Quantum Silicones 43 Durometer Clear, Addition Cure, 1-part Elastomer for Coating QLE 1100 is a 100% silicone solids elastomer designed for use as a conformal coating, but can also be used for cloth coating applications. Key Features: 100% solids Transparent, ideal for pigmentat.. |
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| Cure Time | 5.00 min @Temperature 100 °C |
0.0833 hour @Temperature 212 °F |
|
| Atom Adhesives AA-BOND F123 Epoxy Adhesive AA-BOND F123 is a low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating single or multi.. |
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| Cure Time | 5.00 min @Temperature 482 °C |
0.0833 hour @Temperature 900 °F |
Step 2 |
| Aremco Ceramacoat™ 845-SIL High Temperature Ceramic-Inorganic Coating Single part, waterborne, silicon-filled, phosphate-bonded, matte silver coating for glass and quartz to 2000 ºF (1093 ºC). Primarily used for marking ceramic parts and coating automotive headlamps.. |
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| Cure Time | 5.00 min @Temperature 155 °C |
0.0833 hour @Temperature 311 °F |
TC90 |
| TSE Industries Millathane® 76 Millable Polyester Polyurethane Rubber, 2.0 PHR MBTS Millathane® 76 is a very suitable choice for use in products such as bushings, small copier rolls; automotive applications — bumpers, o-rings, hydraulic seals, belts, gaskets, solid tires — and m.. |
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| Cure Time | 5.00 - 10.000 min @Temperature 149 °C |
0.0833 - 0.16667 hour @Temperature 300 °F |
|
| Master Bond Supreme 3ANHT Epoxy Adhesives for Bonding Stainless Steel Description: Master Bond Polymer System Supreme 3ANHT is a one component, heat cured epoxy adhesive and sealant, featuring high peel and shear strength along with good thermal conductivity and conve.. |
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