Processing Properties | Metric | English | Comments |
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Cure Time | 5.00 min @Temperature 302 °C |
0.0833 hour @Temperature 576 °F |
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Parker Chomerics CHO-BOND 592 Conductive Epoxy Highly conductive silver-filled epoxy adhesive which combines the best properties of metals and organics. This two-component system is unique in that it combines long pot life, good electrical condu.. |
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Cure Time | 5.00 - 10.0 min @Temperature 150 °C |
0.0833 - 0.167 hour @Temperature 302 °F |
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Resinlab® EP1320LV Heat Cure Epoxy Conformal Coating Resinlab™ EP1320 and EP1320LV are one part heat cure epoxy conformal coatings. They can also be used as a small mass potting compounds, structural adhesives, or insulating polymer systems where the.. |
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Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
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Lord Adhesives Metech 6103 Silver Conductor This material is a low viscosity thermoplastic printing ink designed for general purpose application onto various rigid substrate compositions such as epoxy board or other rigid plastic. It is desig.. |
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Cure Time | 5.00 - 10.0 min @Temperature 120 °C |
0.0833 - 0.167 hour @Temperature 248 °F |
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Lord Adhesives Thermosetâ„¢ MD-140 Conductive Adhesive LORD Thermosetâ„¢ MD-140 silver-filled conductive adhesive offers excellent thermal conductivity. It is designed for use in thermally demanding die attach applications such as microprocessor, po.. |
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Cure Time | 5.00 min @Temperature 170 °C |
0.0833 hour @Temperature 338 °F |
belt dryer |
Gwent Electronic Materials C2081126P2 Conductive Silver Polymer Paste This product is a thermoplastic screen printing ink, developed for use in membrane touch switch applications as well as counter electrode in electrochemical sensors and conductive tracks. It may be .. |
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Cure Time | 5.00 min @Temperature 120 °C |
0.0833 hour @Temperature 248 °F |
Press Cure |
Shin-Etsu Silicones LIMSâ„¢ KE1950-10A/B Elastomer KE-1950-10 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. It's viscosity is low enough to allow easy .. |
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Cure Time | 5.00 min @Temperature 120 °C |
0.0833 hour @Temperature 248 °F |
Press Cure |
Shin-Etsu Silicones LIMSâ„¢ KE1950-30A/B Elastomer KE-1950-30 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. It's viscosity is low enough to allow easy .. |
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Cure Time | 5.00 min @Temperature 120 °C |
0.0833 hour @Temperature 248 °F |
Press Cure |
Shin-Etsu Silicones LIMSâ„¢ KE1950-70A/B Elastomer KE-1950-70 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. It's viscosity is low enough to allow easy .. |
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Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
Press Cure |
Shin-Etsu Silicones LIMSâ„¢ KEG2000-50A/B Elastomer KEG2000-50 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. Its viscosity is low enough to allow easy pum.. |
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Cure Time | 5.00 min @Temperature 125 °C |
0.0833 hour @Temperature 257 °F |
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Tra-Con Tra-Bond 400-5 Low Temperature Cure Epoxy Adhesive TRA-BOND 400-5 adhesive is a general purpose non-conductive epoxy. It combines the properties of a moderate work life with the ability to cure rapidly at temperatures as low as 60°C. Having a relat.. |
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Cure Time | 5.00 min @Temperature 125 °C |
0.0833 hour @Temperature 257 °F |
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Tra-Con Tra-Bond F253 Color Keyed High Temperature Epoxy Adhesive TRA-BOND F253 is a low viscosity, high temperature, two-part epoxy formulation that changes color during the curing process to indicate cure status. The unmixed components are light yellow; the mixt.. |
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Cure Time | 5.00 min @Temperature 125 °C |
0.0833 hour @Temperature 257 °F |
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Tra-Con Tra-Bond F253M Color Keyed High Temperature Epoxy Adhesive TRA-BOND F253M is a low viscosity, high temperature, two-part epoxy formulation that changes color during the curing process to indicate cure status. The unmixed components are light yellow; the mix.. |
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Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
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Tra-Con Tra-Bond F253HV Color Keyed High Temperature Epoxy Adhesive TRA-BOND F253HV is a clear, high temperature, two-part epoxy formulation that changes colors during the curing process to indicate cure status. The unmixed components are light yellow; the mixture i.. |
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Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
Minimum Bond Line |
Epoxy Technology EPO-TEK® H20E-PFC Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.Advantages & Application Notes: Stencil.. |
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Cure Time | 5.00 min @Temperature 150 °C |
0.0833 hour @Temperature 302 °F |
Minimum Bond Line |
Epoxy Technology EPO-TEK® N20E Electrically Conductive Paste Product Description: EPO-TEK® N20E is a two component, electrically and thermally conductive, epoxy adhesive designed for semiconductor and electronics assembly. Its applications and field conditi.. |
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Cure Time | 5.00 min @Temperature 175 °C |
0.0833 hour @Temperature 347 °F |
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Atom Adhesives AA-DUCT 905 Epoxy Adhesive AA-DUCT 905 is a single component epoxy, formulated with pure silver powder combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive.. |
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Cure Time | 5.00 min @Temperature 100 °C |
0.0833 hour @Temperature 212 °F |
EN 2243-1 |
Hexcel® Redux® 810 Two-Part Epoxy Paste Adhesive Redux® 810 is a multi-purpose, high shear and peel strength, two-part, toughened epoxy paste adhesive with corrosion-inhibiting properties.Features: Available in cartridges with a static mixer and .. |