Thermal Properties | Metric | English | Comments |
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CTE, linear | 30.0 - 52.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
16.7 - 28.9 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
SABIC Innovative Plastics Lexan® LF1520 PC (Asia Pacific) |
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CTE, linear | 30.0 - 150 µm/m-°C | 16.7 - 83.3 µin/in-°F | Average value: 70.2 µm/m-°C Grade Count:168 |
Overview of materials for Acrylic, General Purpose, Molded This property data is a summary of similar materials in the MatWeb database for the category "Acrylic, General Purpose, Molded". Each property range of values reported is minimum and maximum values .. |
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CTE, linear | 30.0 - 80.0 µm/m-°C | 16.7 - 44.4 µin/in-°F | Average value: 53.1 µm/m-°C Grade Count:11 |
Overview of materials for Polypropylene with 20% Mica Filler This property data is a summary of similar materials in the MatWeb database for the category "Polypropylene with 20% Mica Filler". Specific grades with primary filler content between 15% and 24% are.. |
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CTE, linear | 30.0 µm/m-°C @Temperature 20.0 °C |
16.7 µin/in-°F @Temperature 68.0 °F |
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Cookson Group Plaskon® 435 Mineral Filled Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.Combines exceptional reliability with wide molding process latitude. This material is designed to encapsulate a variety of semic.. |
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CTE, linear | 30.0 µm/m-°C | 16.7 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 1105-7185 PEEK, with carbon fiber, PTFE, lubricant modified Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts; low thermal coefficient of expansion.Dynamic stressed parts at high m.. |
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CTE, linear | 30.0 µm/m-°C | 16.7 µin/in-°F | Alpha 1 |
Lord Adhesives Thermosetâ„¢ ME-542 Underfill Encapsulant LORD Thermosetâ„¢ ME-542 encapsulant is an anhydridefree, thermally conductive, semiconductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip ch.. |
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CTE, linear | 30.0 µm/m-°C | 16.7 µin/in-°F | ASTM D696 |
Gromax PBT 3030-201 30% Glass Fiber Filled Product Description: A glass fiber 30% reinforced injection molding grade. Characteristics:Excellent electrical property Excellent temperature resistance, high heat distortion temperature Excellent .. |
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CTE, linear | 30.0 µm/m-°C | 16.7 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 1301-0915 PPS, linear, with carbon fiber, PTFE, lubricant modified Applications: Automotive industry, textile-and office machinery, medical- and precision engineering.High continuous use and heat distortion temperature. Non flammable.High-strength and stiff parts w.. |
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CTE, linear | 30.0 µm/m-°C @Temperature 20.0 °C |
16.7 µin/in-°F @Temperature 68.0 °F |
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Indium Corp. Indalloy 229 Lead Solder Alloy Information Provided by Indium Corporation |
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CTE, linear | 30.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
16.7 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
SABIC Innovative Plastics Valox® VIC4350 PBT (Asia Pacific) |
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CTE, linear | 30.0 - 55.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
16.7 - 30.6 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
SABIC Innovative Plastics LNP THERMOCOMP Lexan_SP7604 PC (Asia Pacific) |
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CTE, linear | 30.0 µm/m-°C | 16.7 µin/in-°F | ASTM D696 |
Samyang Tribit® 1500G10 PBT, Reinforced General Purpose Crystallization is fast, formability is excellent and thermal resistance, chemical resistance, electrical properties and abrasion resistance are excellent.1500G10 is a reinforced, general purpose gr.. |
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CTE, linear | 30.0 - 53.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
16.7 - 29.4 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
SABIC Innovative Plastics NORYL PX2949 PPE+PS (Asia Pacific) PPE+PS GF+Mineral Filler total 40% |
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CTE, linear | 30.0 - 50.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
16.7 - 27.8 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
SABIC Innovative Plastics NORYL GTX GTX6801 PPE+PA (Asia Pacific) PPE+PA, GF 30% |
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CTE, linear | 30.0 µm/m-°C @Temperature 23.0 - 55.0 °C |
16.7 µin/in-°F @Temperature 73.4 - 131 °F |
ISO 11359-2 |
Polyplastics Duranex® 3226 Polybutylene Terephthalate (PBT), Standard, FR, UL approved regrind 50%, 20% GF filled DURANEX® is a crystalline thermoplastic based on polybutylene terephthalate (PBT) that can be readily strengthened, modified, or otherwise performance enhanced through the addition of glass fibers .. |
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CTE, linear | 30.0 µm/m-°C @Temperature 23.0 - 55.0 °C |
16.7 µin/in-°F @Temperature 73.4 - 131 °F |
ISO 11359-2 |
Polyplastics Duranex® 7307 Polybutylene Terephthalate (PBT), Super low warpage, GF filled DURANEX® is a crystalline thermoplastic based on polybutylene terephthalate (PBT) that can be readily strengthened, modified, or otherwise performance enhanced through the addition of glass fibers .. |
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CTE, linear | 30.0 µm/m-°C @Temperature 20.0 °C |
16.7 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Toyobo VYLOPET® EMC132-02 Injection Molding Polyester Resin, Flame Resistant Applications: Relay partsFeatures: Excellent arc resistanceFlame resistanceInformation provided by Toyobo. |
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CTE, linear | 30.0 µm/m-°C | 16.7 µin/in-°F | ASTM-D696 |
Toyobo VYLOPET® EMC320R Polyester Resin VYLOPET® is a polyester resin developed specifically for injection molding. Polyester resins have excellent heat resistance, rigidity, chemical resistance, and electric properties. Grade EMC320R ha.. |
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CTE, linear | 30.0 - 35.0 µm/m-°C | 16.7 - 19.4 µin/in-°F | |
Master Bond Supreme 11AO Electrically Isolating Adhesive and Sealant Description: Master Bond Polymer System SURPEME 11AO is a two component epoxy resin system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated.. |
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CTE, linear | 30.0 µm/m-°C @Temperature 23.0 - 80.0 °C |
16.7 µin/in-°F @Temperature 73.4 - 176 °F |
DIN 53752 |
CP-Polymer-Technik Wellamid® 6000/52 GV 15 HWCP 15% Glass Fiber Nylon 6, Low Temperature Impact Modified, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG |
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CTE, linear | 30.0 µm/m-°C | 16.7 µin/in-°F | |
Epoxyset Epoxiohm EO-24 Electrically Conductive Epoxy Adhesive EO-24 is a two components, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is used for thermal management applica.. |
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CTE, linear | 30.0 - 35.0 µm/m-°C @Temperature 20.0 °C |
16.7 - 19.4 µin/in-°F @Temperature 68.0 °F |
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Abatron AboCast/AboCure 8109-2 High melting point. Filled version.Processing: 100/10 pbw; 90 minute potlife; mix at 130-140°C (270 °F); cures in 16 h/120°C (250°F), 10 h/140°C (285°F), 8 h/160°C (320°F), 2 h/ 200°C (390°.. |
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CTE, linear | 30.0 µm/m-°C @Temperature 23.0 - 80.0 °C |
16.7 µin/in-°F @Temperature 73.4 - 176 °F |
53752-A |
BASF Elastollan R 3001 15% Glass Filled TPUR Description: Thermoplastic Polyester Polyurethane Elastomers with exceptional properties, very high impact resistance, high modulus with at the same time elasticity, low coefficient of thermal expan.. |
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CTE, linear | 30.0 µm/m-°C | 16.7 µin/in-°F | |
Atom Adhesives AA-DUCT AD1 Epoxy Adhesive AA-DUCT AD1 is a single component epoxy, formulated with pure silver power combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive .. |
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CTE, linear | 30.0 µm/m-°C | 16.7 µin/in-°F | ASTM E831 |
Addiplast Addinyl A2 ZV30 Nylon 66, 30% Glass Filled Glass fiber reinforced, increased thermal aging stabilityInformation provided by Addiplast. |
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CTE, linear | 30.0 µm/m-°C @Temperature 20.0 °C |
16.7 µin/in-°F @Temperature 68.0 °F |
Dry; ASTM D696 |
Asahi Kasei Leona® 14G25 25% Glass Filled Nylon 66 Enhanced strength and stiffness; with 25% GF. Superior heat aging resistance, fatigue resistance, and creep resistance.Applications:Mechanical and electrical parts, engine mounts and other under-the.. |
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CTE, linear | 30.0 µm/m-°C @Temperature 20.0 °C |
16.7 µin/in-°F @Temperature 68.0 °F |
ISO 11359 |
Teijin Panlite® BS-8110R Friction and Abrasion Resistant, Carbon Fiber Reinforced Polycarbonate Resin CF 10% reinforced grade, meeting UL 94 V-2. it is compounded with fluorine powder to improve friction and abrasion resistance and also exhibits a mold release property, maintaining excellent charact.. |