Epoxy Technology EPO-TEK® CF6-2 High Temperature Epoxy

Category	Polymer , Thermoset , Epoxy , Epoxy, High Temperature
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® CF6-2 High Temperature Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Product Description: EPO-TEK® CF6-2 is a two component, high temperature and high Tg epoxy designed for fiber optic packaging. Advantages & Application Notes: The low viscosity nature allows for wicking and impregnating into fiber optic bundles, commonly found in medical or sensor industries.Low outgassing nature makes it ideal for high temperature fiber optic environments.Suggested applications:Medical: Adhering fiber bundles into ferrules, adhesion to stainless steel, rigid and flexible endoscopes, withstands medical sterilization such as autoclave, gamma, or ETO.Sensor Devices: down hole fiber sensors for petro-chemical industries. High power laser light beam delivery.Optics: Spectral Transmission in the VIS and IR region > 600 nm range.Amber color change upon cure allows for visual ID inspection of cure.Convenient 1:1 mix ratio allows for static mixing, or specialty packaging in double-barrel syringesInformation Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	1.21 g/cc	1.21 g/cc	Part A
	1.22 g/cc	1.22 g/cc	Part B
Viscosity	800 - 1200 cP @Temperature 23.0 °C	800 - 1200 cP @Temperature 73.4 °F	100 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	84	84
Tensile Modulus	1.98 GPa	287 ksi	Storage
Shear Strength	7.888 MPa	1144 psi	Lap
	>= 35.2 MPa	>= 5100 psi	Die

Thermal Properties	Metric	English	Comments
CTE, linear	69.0 µm/m-°C	38.3 µin/in-°F	Below Tg
	175 µm/m-°C	97.2 µin/in-°F	Above Tg
Maximum Service Temperature, Air	200 °C	392 °F	Continuous
	300 °C	572 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 110 °C	>= 230 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature	360 °C	680 °F	Degradation Temperature

Optical Properties	Metric	English	Comments
Refractive Index	1.5336 @Wavelength 589 nm	1.5336 @Wavelength 589 nm
Transmission, Visible	>= 97 % @Wavelength 700 - 2000 nm	>= 97 % @Wavelength 700 - 2000 nm	Spectral

Electrical Properties	Metric	English
Volume Resistivity	>= 1.80e+13 ohm-cm	>= 1.80e+13 ohm-cm
Dielectric Constant	2.99 @Frequency 1000 Hz	2.99 @Frequency 1000 Hz
Dissipation Factor	0.0050 @Frequency 1000 Hz	0.0050 @Frequency 1000 Hz

Processing Properties	Metric	English	Comments
Cure Time	60.0 min @Temperature 150 °C	1.00 hour @Temperature 302 °F	Minimum Bond Line
Pot Life	1080 min	1080 min
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties	Value	Comments
Color	Amber	Part B
	Clear/Colorless	Part A
Consistency	Pourable liquid
Mix Ratio By Weight	1:1
Number of Components	Two
Weight Loss	0.13%	250°C
	0.69%	300°C

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