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Tra-Con Tra-Bond 77-1S One Component SMD Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy
Manufacturer Tra-Con, Inc.
Trade Name Tra-Bond
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Tra-Con Tra-Bond 77-1S One Component SMD Adhesive.pdf
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Material Notes:
TRA-BOND 77-1S one component, solvent-free, insulating epoxy adhesive is designed specifically for attaching surface mounted devices (SMDs) to printed circuit boards prior to wave solder. TRA-BOND 77-1S adhesive exhibits outstanding moisture resistance, eliminating concern about significant electrical leakage after long-term exposure to high humidity conditions. This adhesive withstands 1000 hours at 100°C and 95% relative humidity testing with only a slight drop in insulation resistance. In addition, TRA-BOND 77-1S adhesive exhibits superior application features. Its soft, smooth consistency permits application through fine diameter needles. This adhesive exhibits no tailing or sagging. Small uniform dots may be dispensed for capacitor and resistor attach. To satisfy the seated heights of SOT devices, narrow peaks or multiple dots may be used. TRA-BOND 77-1S adhesive is also ideally suited for application by screening or pin transfer.Information provided by Tra-Con Inc.
Physical Properties Metric English Comments
Viscosity 47000 cP
47000 cP
Mixed
Mechanical Properties Metric English Comments
Hardness, Shore D 94
94
Adhesive Bond Strength 16.5 MPa
2400 psi
Lap shear, alum to alum
Thermal Properties Metric English Comments
CTE, linear 55.0 µm/m-°C
30.6 µin/in-°F
Below Tg
100 µm/m-°C
55.6 µin/in-°F
Above Tg
Thermal Conductivity 0.500 W/m-K

@Temperature 121 °C
3.47 BTU-in/hr-ft²-°F

@Temperature 250 °F
Glass Transition Temp, Tg 200 °C
392 °F
Ultimate Tg
Electrical Properties Metric English Comments
Volume Resistivity 1.30e+12 ohm-cm
1.30e+12 ohm-cm
Dielectric Constant 4.6

@Frequency 1000 Hz
4.6

@Frequency 1000 Hz
Dissipation Factor 0.017

@Frequency 1000 Hz
0.017

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 0.167 min

@Temperature 200 °C
0.00278 hour

@Temperature 392 °F
2.00 min

@Temperature 175 °C
0.0333 hour

@Temperature 347 °F
3.00 min

@Temperature 150 °C
0.0500 hour

@Temperature 302 °F
Shelf Life 3.00 Month
3.00 Month
At 5°C
12.0 Month

@Temperature -40.0 °C
12.0 Month

@Temperature -40.0 °F
Descriptive Properties Value Comments
Device Shear grams 2000
Thick Film Resistors
Weight Loss % 0.33
At 250°C
Working Life months 3
At 25°C
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