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Tra-Con Tra-Duct 29121 Snap Cure Conductive Silver Epoxy Adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy, Electrically Conductive , Filled/Reinforced Thermoset
Manufacturer Tra-Con, Inc.
Trade Name Tra-Duct
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Tra-Con Tra-Duct 29121 Snap Cure Conductive Silver Epoxy Adhesive.pdf
Price EMAIL US    sales@lookpolymers.com
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Material Notes:
TRA-DUCT 29121 is 100% solids, two component silver filled epoxy designed for chip bonding in microelectronic and optoelectronic applications. TRA-DUCT 29121 is a soft, smooth paste. This two-part formulation is free of solvents. TRA-DUCT 29121 can be screen printed, machine dispensed or stamped. Information provided by Tra-Con Inc.
Physical Properties Metric English Comments
Specific Gravity 3.00 g/cc
3.00 g/cc
Mixed, degassed
Viscosity 44500 cP

@Temperature 25.0 °C
44500 cP

@Temperature 77.0 °F
After mixing
Mechanical Properties Metric English Comments
Adhesive Bond Strength 7.65 MPa
1110 psi
Lap shear, alum to alum
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 125 °C
257 °F
Minimum Service Temperature, Air -60.0 °C
-76.0 °F
Glass Transition Temp, Tg 62.0 °C
144 °F
Ultimate Tg
Processing Properties Metric English Comments
Cure Time 0.750 min

@Temperature 175 °C
0.0125 hour

@Temperature 347 °F
5.00 min

@Temperature 150 °C
0.0833 hour

@Temperature 302 °F
15.0 min

@Temperature 120 °C
0.250 hour

@Temperature 248 °F
90.0 min

@Temperature 80.0 °C
1.50 hour

@Temperature 176 °F
720 min

@Temperature 50.0 °C
12.0 hour

@Temperature 122 °F
Pot Life 1440 min
1440 min
(1 day)
Descriptive Properties Value Comments
Color Silver
Mix Ratio, parts by weight 100/100
Resin/Hardener
Thixotropic Index 3.2
1 rpm/10 rpm, cp #52
Working Life hours 48
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