Polymer Property : Cure Time = 0.0125 hour Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	0.750 min @Temperature 175 °C	0.0125 hour @Temperature 347 °F
Tra-Con Tra-Duct 29121 Snap Cure Conductive Silver Epoxy Adhesive TRA-DUCT 29121 is 100% solids, two component silver filled epoxy designed for chip bonding in microelectronic and optoelectronic applications. TRA-DUCT 29121 is a soft, smooth paste. This two-part f..
Cure Time	0.750 min @Temperature 170 °C	0.0125 hour @Temperature 338 °F	Bond Line
Epoxy Technology EPO-TEK® E2001 Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. Advantages & Appl..
Cure Time	0.750 min @Temperature 170 °C	0.0125 hour @Temperature 338 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® E3001 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Cure Time	0.750 min @Temperature 175 °C	0.0125 hour @Temperature 347 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® H20E-PFC Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.Advantages & Application Notes: Stencil..
Cure Time	0.750 min @Temperature 175 °C	0.0125 hour @Temperature 347 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® H20-LC Electrically Conductive, Silver Epoxy Product Description: EPO TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used exte..
Cure Time	0.750 min @Temperature 175 °C	0.0125 hour @Temperature 347 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® H20S Electrically Conductive, Silver Epoxy for Die Stamping Product Description: EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK®H20S is a highly reliable, two ..
Cure Time	0.750 min @Temperature 175 °C	0.0125 hour @Temperature 347 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® H20E-LV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-LV is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a ..
Cure Time	0.750 min @Temperature 204 °C	0.0125 hour @Temperature 399 °F
3M Scotchcast™ 260 Electrical Epoxy Powder Resin 3M Scotchcast Electrical Resin 260 is a widely used, well-known general purpose epoxy powder resin. A one-part, green pigmented, rapid heat-curing product, it is designed to provide a continuous, to..
Cure Time	0.750 min @Temperature 204 °C	0.0125 hour @Temperature 399 °F
3M Scotchcast™ 260 CG Electrical Epoxy Powder Resin 3M Scotchcast Electrical Resin 260 is a widely used, well-known general purpose epoxy powder resin. A one-part, green pigmented, rapid heat-curing product, it is designed to provide a continuous, to..