Songhan Plastic Technology Co.,Ltd.

Cookson Group Plaskon® SMT-B-1FX (146.801) Epoxy Molding Compound for PBGAs  (discontinued **)

Category Polymer , Thermoset , Epoxy , Epoxy Molding Compound
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Cookson Group Plaskon® SMT-B-1FX (146.801) Epoxy Molding Compound for PBGAs  (discontinued **).pdf
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Material Notes:
Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound optimized specifically for PBGA applications. It is a reduced catalyst version of SMT-B-1F and provides a 1-2% wire sweep improvement in most applications. It has the same unique resin system as that in SMT-B-1. Faster cure speed for shorter cure times in multi-plunger and automolding equipment; Improved wire sweep performance (lower viscosity); Reduced post mold cure times; Improved warp performance; Lower moisture absorption
Physical Properties Metric English Comments
Density 1.91 g/cc
0.0690 lb/in³
Viscosity 5500 cP

@Temperature 175 °C
5500 cP

@Temperature 347 °F
Shimadzu Viscosity, 1000 psi
Spiral Flow 92.0 - 105 cm
36.2 - 41.3 in
177°C/1000 psi
Mechanical Properties Metric English Comments
Hardness, Shore D 81
Flexural Strength 68.0 MPa
9860 psi
Flexural Modulus 15.0 GPa
2180 ksi
Thermal Properties Metric English Comments
CTE, linear 12.0 µm/m-°C

@Temperature 20.0 °C
6.67 µin/in-°F

@Temperature 68.0 °F
CTE, linear, Transverse to Flow 57.0 µm/m-°C

@Temperature 20.0 °C
31.7 µin/in-°F

@Temperature 68.0 °F
Thermal Conductivity 0.700 W/m-K
4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 220 °C
428 °F
Flammability, UL94 V-0

@Thickness 3.20 mm

@Thickness 0.126 in

@Thickness 3.20 mm

@Thickness 0.126 in
Electrical Properties Metric English Comments
Electrical Resistivity 3.20e+16 ohm-cm
3.20e+16 ohm-cm
Dielectric Constant 3.9

@Frequency 1000 Hz

@Frequency 1000 Hz
Dielectric Strength 28.0 kV/mm
711 kV/in
Processing Properties Metric English Comments
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
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