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Polymer Property : Thermal Conductivity = 0.700 W/m-K Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | ASTM D5470 |
| Parker Chomerics PREMIER™ A240-FRHF EMI Shielding Plastic Description: PREMIER™ is the world’s first and most versatile commercially available conductive thermoplastic for real world EMI shielding solutions. It is a blend of PC/ABS thermoplastic polymer .. |
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| Thermal Conductivity | 0.700 - 0.900 W/m-K | 4.86 - 6.25 BTU-in/hr-ft²-°F | ASTM E1461 |
| Raschig Group EN 5007 Epoxy Molding Compound Mica reinforced molding compound. Low mold shrinkage and post-shrinkage, very good electrical values, outstanding heat resistance, very goo pourablity. This product meets the allowed upper limits fo.. |
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| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | ASTM E1530 |
| Solvay Specialty Polymers AvaSpire® AV-755 SL45 Polyaryletherketone (PAEK)
(Unverified Data**) AV-755 SL45 is a wear resistant grade of AvaSpire polyaryletherketone (PAEK) designed to provide low wear rates and high pressure-velocity (PV) tolerance in lubricated wear environments. Like the ot.. |
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| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Cookson Group Plaskon® 1002 Conventional Encapsulant
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low cost, low stress, conventional molding compound recommended for high volume commodity-type packages that house simple linea.. |
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| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Cookson Group Plaskon® 3300SH Mineral Filled Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.Exhibits exceptional reliability, excellent moldability, good release characteristics and low flash. This compound is especially.. |
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| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Cookson Group Plaskon® SMT-B-1LV Epoxy Molding Compound for PBGAs
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound optimized specifically for grid arrays (BGA/LGA). Using an improved optimized filler system, it provide.. |
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| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Cookson Group Plaskon® 150.401 Encapsulation Resin
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A second generation SMT-B family product. This material is the initial developmental, general purpose SMT-B encapsulation grade .. |
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| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Cookson Group Plaskon® ULS-12 Epoxy Encapsulant
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A state-of-the-art, ultra low stress epoxy encapsulant designed for packaging large, stress-sensitive DIPs, PLCCs and QFPs. It i.. |
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| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Cookson Group Plaskon® ULS-12LA Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.An ultra low stress, low alpha emission molding compound designed for packaging stress-sensitive memory devices such as TSOPs and.. |
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| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Menzolit Menzolit® BMC 0170 Unsaturated Polyester UP BMC 0170 is a general purpose BMC for electrical applications. Product according to type 801 DIN 16911. The glass content is on a level that combines good mouldability with good strength and stiffne.. |
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| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Menzolit Menzolit® BMC 0400 Unsaturated Polyester UP BMC 0400 is a low profile DMC/BMC for automotive applications. It fulfills the requirements of the automotive industry regarding painted body panels including reduced C-emissions. For highest surfac.. |
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| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Menzolit Menzolit® BMC 1500 Unsaturated Polyester UP BMC 1500 is a special BMC for the use at elevated temperature. The glass content is set to a level that combines good flowability with good strength and stiffness properties. Even without a specific.. |
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| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Menzolit Menzolit® BMC 2400 Unsaturated Polyester UP BMC 2400 is a general purpose BMC for applications in the field of low smoke density and non toxic smoke.. The flammability meets the demands of EN45545 and is classified according to British standa.. |
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| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Menzolit Menzolit® SMC 0390 Unsaturated Polyester UP SMC 0390 is a standard low profile SMC. Because of its low shrinkage, the material shows good surface quality as well as very low warpage. The product is suitable for applications if a better surfac.. |
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| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Menzolit Menzolit® SMC 0400 Unsaturated Polyester UP SMC 0400 is a Class-A SMC for exterior body applications on cars, LCV´s and trucks. These compounds mould to parts with good up to excellent surface quality for medium bake in-line and off-line p.. |
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| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Menzolit Menzolit® SMC 0430 Unsaturated Polyester UP SMC 0430 is a low emission Class-A SMC for on-line painted exterior body applications on passenger cars. These compounds mould to parts with excellent surface quality for on-line painted body panel.. |
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| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Menzolit Menzolit® SMC 0650 Unsaturated Polyester UP SMC 0650 Low pressure SMC for large panels when moulding force becomes critical. Specific moulding pressure < 20 bar. A Special molding procedure is necessary.Information Provided by Menzolit |
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| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Menzolit Menzolit® SMC 0800 Unsaturated Polyester UP SMC 0800 is a special SMC for applications within househould and kitchenware. The glass level has been selected to combine good mouldability with good strength and stiffness properties. The product .. |
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| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Menzolit Menzolit® SMC 1500 Unsaturated Polyester UP SMC 1500 is a special SMC for applications calling for high continuous service temperature. The glass level has been selected to combine good mouldability with good strength and stiffness properties.. |
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| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Menzolit Menzolit® BMC 1400 Unsaturated Polyester UP BMC 1400 is a special BMC for the use on an engine. The glass content is set to a level that combines good mouldability with good strength and stiffness properties. The product has been developped f.. |
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| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Menzolit Menzolit® BMC 2910 Unsaturated Polyester UP BMC 2910 incorporates additives which enhance the integral performance of mouldings during and after fire, currently used to mould Boltcaps which are designed to provide protection to the bolted co.. |
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| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Menzolit Menzolit® HPC 1200 Unsaturated Polyester UP HPC 1200 is a special SMC for high strength applications. The glass level has been selected to combine mouldability with high strength and stiffness properties in orientation direction. The reinforc.. |
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| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Menzolit Menzolit® SMC 0412 Unsaturated Polyester UP SMC 0412 is a premium Class-A SMC for on-line painted conductive exterior body applications on cars. These compounds mould to parts with excellent surface quality and low surface conductivity for e.. |
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| Thermal Conductivity | 0.700 W/m-K | 4.86 BTU-in/hr-ft²-°F | |
| Menzolit Menzolit® SMC 0421 Unsaturated Polyester UP SMC 0421 is a low density premium Class-A SMC for on-line painted exterior body applications on cars. These compounds mould to light weight parts with excellent surface quality for on-line painted .. |
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| Thermal Conductivity | 0.700 W/m-K @Temperature 90.0 °C |
4.86 BTU-in/hr-ft²-°F @Temperature 194 °F |
|
| Schott Glass 8532 Soft Glass Soft glass, free from Na, of high lead content, lower sealing temperature than glass 8531, high dielectric constant Encapsulation of semiconductor components at low temperature (diodes)Information .. |
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| Thermal Conductivity | 0.700 W/m-K @Temperature 250 °C |
4.86 BTU-in/hr-ft²-°F @Temperature 482 °F |
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| Saint-Gobain Micaver® Glass-Mica Electrical Insulator, Compression Moldings Glass-mica compound that occupies a place between plastics and ceramics in terms of usage temperature. It can be molded and machined like plastics and has the mechanical properties (strength, hardn.. |
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