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Polymer Property : Processing Temperature = 365 °F Product List

Processing Properties

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Processing Properties Metric English Comments
Processing Temperature 170 - 185 °C
338 - 365 °F
Activation Temperature
PolyOne Geon™ Vinyl Wire & Cable EAS81A Polyvinyl Chloride, Flexible (PVC, Flexible)
Geon© EAS81A is a Vinyl Foam Concentrate for Wire and Cable Extrusion. This product is an exothermic type blowing agent intended to be used with a wide range of Wire and Cable Vinyl formulations to..
Processing Temperature 174 - 185 °C
345 - 365 °F
Suggested Stock
S&E Specialty Polymers TufTech™ G-4285-405 Black PVC Compound
Application: A UV resistant, PVC based compound, suitable for extrusion applications.Information provided by S&E Specialty Polymers
Processing Temperature 174 - 185 °C
345 - 365 °F
Suggested Stock
S&E Specialty Polymers TufTech™ GA-3188AHP PVC Compound
Application: RoHS compliant, phthalate free, 105°C flame retardant jacketing material suitable for extrusion applications.Information provided by S&E Specialty Polymers
Processing Temperature 170 - 185 °C
338 - 365 °F
Mixture Zone
Petroquimica Triunfo Trithene® TX 3003 LDPE - Shrink Wrap Film
The Trithene® TX 3003 resin is a low-density polyethylene (LDPE) with high molecular weight, presenting excellent mechanical properties. The product provided elevated gloss and transparency, adding..
Processing Temperature 22.2 - 185 °C
72.0 - 365 °F
Average value: 129 °C Grade Count:14
Overview of materials for Epoxy Encapsulant, Unreinforced
This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Encapsulant, Unreinforced". Each property range of values reported is minimum and maximum values o..
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
Cookson Group Plaskon® 435 Mineral Filled Epoxy Molding Compound  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.Combines exceptional reliability with wide molding process latitude. This material is designed to encapsulate a variety of semic..
Processing Temperature 175 - 185 °C
347 - 365 °F
Molding temperature
Cookson Group Plaskon® 440 Mineral Filled Novolac Epoxy Molding Compound  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.Combines exceptional reliability with wide molding process latitude. This material is designed to encapsulate semiconductor devi..
Processing Temperature 175 - 185 °C
347 - 365 °F
Molding temperature
Cookson Group Plaskon® 440S Mineral Filled Novolac Epoxy Molding Compound  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.Combines exceptional reliability with wide process latitude. This material is designed to encapsulate a wide range of semiconduc..
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
Cookson Group Plaskon® 1002 Conventional Encapsulant  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.A low cost, low stress, conventional molding compound recommended for high volume commodity-type packages that house simple linea..
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
Cookson Group Plaskon® 1031 Conventional Encapsulant  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.A low cost, conventional molding compound recommended for high volume commodity-type packages that house simple linear and discre..
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
Cookson Group Plaskon® 3400 Epoxy Molding Compound  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.A reduced-stress epoxy molding compound for the encapsulation of a variety of semiconductor devices ranging from small lead count..
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
Cookson Group Plaskon® 3400F Epoxy Molding Compound  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.A fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs ..
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
Cookson Group Plaskon® 3400FP Epoxy Molding Compound  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.A fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs ..
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
Cookson Group Plaskon® S-7LA Molding Compound  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress, low alpha emission molding compound designed for packaging stress-sensitive memory devices. It offers an alpha par..
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
Cookson Group Plaskon® S-7P Epoxy Encapsulant  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress, low viscosity epoxy encapsulant designed for packaging stress-sensitive semiconductor devices. It is specifically ..
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
Cookson Group Plaskon® S-7S Epoxy Encapsulant  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress, low viscosity epoxy encapsulant designed for packaging stress-sensitive semiconductor devices. It is specifically ..
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
Cookson Group Plaskon® SMT-B-1™ Epoxy Molding Compound for PBGAs  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound optimized specifically for grid arrays (BGA/LGA). It is formulated with a unique resin system that min..
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
Cookson Group Plaskon® SMT-B-1F Epoxy Molding Compound for PBGAs  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound optimized specifically for PBGA applications. It has the same unique resin system as SMT-B-1, which mi..
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
Cookson Group Plaskon® SMT-B-1FX (146.801) Epoxy Molding Compound for PBGAs  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound optimized specifically for PBGA applications. It is a reduced catalyst version of SMT-B-1F and provide..
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
Cookson Group Plaskon® SMT-B-1LV Epoxy Molding Compound for PBGAs  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound optimized specifically for grid arrays (BGA/LGA). Using an improved optimized filler system, it provide..
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
Cookson Group Plaskon® SMT-B-1RC (146.403) Epoxy Molding Compound for PBGAs  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound optimized specifically for PBGA applications. It has the same unique resin system as SMT-B-1, which mi..
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
Cookson Group Plaskon® SMT-B-1 LAS (146.408) Epoxy Molding Compound for PBGAs  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound optimized specifically for grid arrays (BGA/LGA) requiring low alpha particle count. It is formulated ..
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
Cookson Group Plaskon® 150.401 Encapsulation Resin  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.A second generation SMT-B family product. This material is the initial developmental, general purpose SMT-B encapsulation grade ..
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
Cookson Group Plaskon® ULS-12HLG Epoxy Encapsulant  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.A state-of-the-art, ultra low stress epoxy encapsulant designed for packaging large, stress-sensitive DIPs, PLCCs and QFPs. It i..
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
Cookson Group Plaskon® ULS-12 Epoxy Encapsulant  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.A state-of-the-art, ultra low stress epoxy encapsulant designed for packaging large, stress-sensitive DIPs, PLCCs and QFPs. It i..
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
Cookson Group Plaskon® ULS-12LA Molding Compound  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.An ultra low stress, low alpha emission molding compound designed for packaging stress-sensitive memory devices such as TSOPs and..
Processing Temperature 174 - 185 °C
345 - 365 °F
Recommended Stock Temperature
Sylvin Technologies 6131-92 PVC Wire/Cable Compound
Information provided by Sylvin Technologies Inc.
Processing Temperature 170 - 185 °C
338 - 365 °F
Mixture Zone
Petroquimica Triunfo Trithene® TS 3003 LDPE - Film Grade
The Trithene® TS 3003 resin is a low-density, high molecular weight polyethylene that offers high mechanical strength and excellent optical properties. The product shows high modulus of elasticity,..
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