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Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy
| Category | Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive |
| Manufacturer | Epoxy Technology |
| Trade Name | EPO-TEK® |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. Higher viscosity version of EPO-TEK® 430.Information Provided by Epoxy Technology
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 1.02 g/cc | 1.02 g/cc | Part B |
| 3.79 g/cc | 3.79 g/cc | Part A | |
| Particle Size | <= 50 µm | <= 50 µm | |
| Viscosity | >= 819200 cP @Temperature 23.0 °C |
>= 819200 cP @Temperature 73.4 °F |
0.5 rpm |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 77 | 77 | |
| Tensile Modulus | 2.75 GPa | 400 ksi | Storage |
| Shear Strength | 8.20 MPa | 1190 psi | Die |
| 9.267 MPa | 1344 psi | Lap |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 57.0 µm/m-°C | 31.7 µin/in-°F | Below Tg |
| Thermal Conductivity | 1.55 W/m-K | 10.8 BTU-in/hr-ft²-°F | |
| Maximum Service Temperature, Air | 250 °C | 482 °F | Continuous |
| 350 °C | 662 °F | Intermittent | |
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| -55.0 °C | -67.0 °F | Intermittent | |
| Glass Transition Temp, Tg | >= 110 °C | >= 230 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Decomposition Temperature | 434 °C | 813 °F | Degradation Temperature |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | >= 0.0050 ohm-cm | >= 0.0050 ohm-cm |
| Chemical Properties | Metric | English | Comments |
|---|---|---|---|
| Ionic Impurities - Na (Sodium) | 25 ppm | 25 ppm | |
| Ionic Impurities - K (Potassium) | 3.0 ppm | 3.0 ppm | |
| Ionic Impurities - Cl (Chloride) | 15 ppm | 15 ppm |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 30.0 min @Temperature 80.0 °C |
0.500 hour @Temperature 176 °F |
|
| 60.0 min @Temperature 60.0 °C |
1.00 hour @Temperature 140 °F |
||
| Pot Life | 180 min | 180 min | |
| Shelf Life | 12.0 Month @Temperature 25.0 °C |
12.0 Month @Temperature 77.0 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Color | Amber | Part B |
| Brown Copper | Part A | |
| Consistency | Thick paste | |
| Ionic Impurities NH4 | 36 ppm | |
| Mix Ratio By Weight | 100:2 | |
| Number of Components | Two | |
| Weight Loss | 0.76% | 200°C |
| 1.65% | 250°C | |
| 2.8% | 300°C |
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