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- Epoxy Technology EPO-TEK® H20E-175 Electrically Conductive, Silver Epoxy
Epoxy Technology EPO-TEK® H20E-175 Electrically Conductive, Silver Epoxy
| Category | Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive |
| Manufacturer | Epoxy Technology |
| Trade Name | EPO-TEK® |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Epoxy Technology EPO-TEK® H20E-175 Electrically Conductive, Silver Epoxy.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Product Description: EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / JEDEC packaging, microelectronic packaging of hybrids, as well as high temperature devices and assembly.Advantages & Application Notes: Thixotropic paste-like rheology allows for high speed dispensing and screen printing operations. It can also be applied by hand techniques using spatula, toothpick, or stamping chuck.Suggested for Rf/Microwave device packaging found in military, commercial, aerospace and cockpit, and industrial (down-hole petrochemical) circuits.> 3 day pot-life allows for mass production yielding low waste.Information Provided by Epoxy Technology
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 3.07 g/cc | 3.07 g/cc | Part B |
| 3.44 g/cc | 3.44 g/cc | Part A | |
| Viscosity | 2800 - 3800 cP @Temperature 23.0 °C |
2800 - 3800 cP @Temperature 73.4 °F |
100 rpm |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 70 | 70 | |
| Tensile Modulus | 4.33 GPa | 628 ksi | Storage |
| Shear Strength | 8.908 MPa | 1292 psi | Lap |
| >= 23.4 MPa | >= 3400 psi | Die |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 20.0 µm/m-°C | 11.1 µin/in-°F | Below Tg |
| 88.0 µm/m-°C | 48.9 µin/in-°F | Above Tg | |
| Thermal Conductivity | 2.04 W/m-K | 14.2 BTU-in/hr-ft²-°F | |
| Maximum Service Temperature, Air | 250 °C | 482 °F | Continuous |
| 350 °C | 662 °F | Intermittent | |
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| -55.0 °C | -67.0 °F | Intermittent | |
| Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—250°C /ISO 25 Min; Ramp -10—250°C @ 20°C/Min |
| Decomposition Temperature | 450 °C | 842 °F | Degradation Temperature |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | <= 0.00040 ohm-cm | <= 0.00040 ohm-cm |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 60.0 min @Temperature 180 °C |
1.00 hour @Temperature 356 °F |
|
| 120 min @Temperature 150 °C |
2.00 hour @Temperature 302 °F |
||
| Pot Life | 5040 min | 5040 min | |
| Shelf Life | 12.0 Month @Temperature 25.0 °C |
12.0 Month @Temperature 77.0 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Color | Silver | Part A |
| Silver | Part B | |
| Consistency | Smooth thixotropic paste | |
| Mix Ratio By Weight | 1:1 | |
| Number of Components | Two | |
| Thixotropic Index | 3.1 | |
| Weight Loss | 0.05% | 200°C |
| 0.11% | 250°C | |
| 0.25% | 300°C |
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