Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Epoxy Technology EPO-TEK® 330 Low Viscosity, Optical Epoxy

Category Polymer , Thermoset , Epoxy
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® 330 Low Viscosity, Optical Epoxy.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
Product Description: EPO-TEK® 330 is a two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications.Advantages & Application Notes: Built in color change from clear to amber when cured properly. The color change can be used for in-line inspection of epoxy joints and adhesive fillet.Unfilled epoxy resin allows for % transmission in the VIS and NIR.Low viscosity allows for wicking and capillary action.Suggested Applications:Semiconductor: capillary flow underfill for Flip Chip mounted dieFiber Optic: polarizing maintaining fibers (PMF) found in gyroscope coils; fiber termination into ferrule.Medical: impregnation into fiber optic light guides and endoscopes; resists autoclave, ETO, or gamma sterilization.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 1.02 g/cc
1.02 g/cc
Part B
1.15 g/cc
1.15 g/cc
Part A
Viscosity 350 - 550 cP

@Temperature 23.0 °C
350 - 550 cP

@Temperature 73.4 °F
100 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 87
87
Tensile Modulus 2.10 GPa
305 ksi
Storage
Shear Strength >= 13.8 MPa
>= 2000 psi
Lap
>= 23.4 MPa
>= 3400 psi
Die
Thermal Properties Metric English Comments
CTE, linear 39.0 µm/m-°C
21.7 µin/in-°F
Below Tg
175 µm/m-°C
97.2 µin/in-°F
Above Tg
Maximum Service Temperature, Air 200 °C
392 °F
Continuous
300 °C
572 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 90.0 °C
>= 194 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature 369 °C
696 °F
Degradation Temperature
Optical Properties Metric English Comments
Refractive Index 1.5345

@Wavelength 589 nm
1.5345

@Wavelength 589 nm
Transmission, Visible <= 51 %

@Wavelength 500 nm
<= 51 %

@Wavelength 500 nm
Spectral
<= 88 %

@Wavelength 600 nm
<= 88 %

@Wavelength 600 nm
Spectral
<= 97 %

@Wavelength 700 - 1600 nm
<= 97 %

@Wavelength 700 - 1600 nm
Spectral
Electrical Properties Metric English Comments
Volume Resistivity >= 2.00e+13 ohm-cm
>= 2.00e+13 ohm-cm
Dielectric Constant 3.74

@Frequency 1000 Hz
3.74

@Frequency 1000 Hz
Dissipation Factor 0.011

@Frequency 1000 Hz
0.011

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 1.00 min

@Temperature 150 °C
0.0167 hour

@Temperature 302 °F
Minimum Bond Line
5.00 min

@Temperature 120 °C
0.0833 hour

@Temperature 248 °F
Minimum Bond Line
10.0 min

@Temperature 100 °C
0.167 hour

@Temperature 212 °F
Minimum Bond Line
30.0 min

@Temperature 80.0 °C
0.500 hour

@Temperature 176 °F
Minimum Bond Line
Pot Life 360 min
360 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Amber
Part B
Clear/Colorless
Part A
Consistency Pourable liquid
Mix Ratio By Weight 10:1
Number of Components Two
Weight Loss 0.68%
200°C
1.06%
250°C
1.77%
300°C
Copyright © lookpolymers.com All Rights Reserved