Epoxy Technology EPO-TEK® 354 High Temperature Epoxy

Category	Polymer , Thermoset , Epoxy , Epoxy, High Temperature
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® 354 High Temperature Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Product Description: EPO-TEK® 354 is a two component, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally insulating epoxy.Advantages & Application Notes: Extended pot-life of many days which allows low waste between manufacturing shifts. Built-in color change upon cure. Users can determine cure by visual means due to a red-amber color change from slight yellow. Suggested Applications: Semiconductor: capillary underfill below flip chip mounted die or SMDs. Opto-electronic: %Transmission in the IR from 800 – 2000 nm range, adhesion to Si, glass, ceramic and metals. Fiber Optic: sealing fiber into ferrules, optical connectors, adhesion to quartz, Au, kovar, stainless steel, packaging of Fiber Optic components. Medical: resisting autoclave steam sterilization cycles in fiber optic bundles, adhesion to most plastics. Designed to be a longer pot-life alternative to EPO-TEK® 353ND, it may be used in similar applications and devices.Capable of being syringe dispensed in mass production. It’s medium viscosity lends itself to adhesive, sealing, potting and encapsulation.Complies with USP Class VI biocompatibility standards.Information Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	1.15 g/cc	1.15 g/cc	Part B
	1.20 g/cc	1.20 g/cc	Part A
Viscosity	4000 - 6000 cP @Temperature 23.0 °C	4000 - 6000 cP @Temperature 73.4 °F	50 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	82	82
Tensile Modulus	2.46 GPa	356 ksi	Storage
Shear Strength	11.50 MPa	1668 psi	Lap
	>= 23.4 MPa	>= 3400 psi	Die

Thermal Properties	Metric	English	Comments
CTE, linear	96.0 µm/m-°C	53.3 µin/in-°F	Below Tg
	175 µm/m-°C	97.2 µin/in-°F	Above Tg
Maximum Service Temperature, Air	250 °C	482 °F	Continuous
	350 °C	662 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 95.0 °C	>= 203 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature	487 °C	909 °F	Degradation Temperature

Optical Properties	Metric	English	Comments
Refractive Index	1.5734 @Wavelength 589 nm	1.5734 @Wavelength 589 nm	uncured
Transmission, Visible	>= 96 % @Wavelength 600 nm	>= 96 % @Wavelength 600 nm	Spectral
	>= 99 % @Wavelength 800 nm	>= 99 % @Wavelength 800 nm	Spectral

Electrical Properties	Metric	English
Volume Resistivity	>= 2.00e+13 ohm-cm	>= 2.00e+13 ohm-cm
Dielectric Constant	3.48 @Frequency 1000 Hz	3.48 @Frequency 1000 Hz
Dissipation Factor	0.0040 @Frequency 1000 Hz	0.0040 @Frequency 1000 Hz

Chemical Properties	Metric	English
Ionic Impurities - Na (Sodium)	17 ppm	17 ppm
Ionic Impurities - K (Potassium)	9.0 ppm	9.0 ppm
Ionic Impurities - Cl (Chloride)	81 ppm	81 ppm

Processing Properties	Metric	English	Comments
Cure Time	10.0 min @Temperature 150 °C	0.167 hour @Temperature 302 °F	Minimum Bond Line
	30.0 min @Temperature 120 °C	0.500 hour @Temperature 248 °F	Minimum Bond Line
Pot Life	180 min	180 min
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties	Value	Comments
Color	Clear/Colorless	Part A
	Dark Amber	Part B
Consistency	Pourable liquid
Ionic Impurities NH4	300 ppm
Mix Ratio By Weight	10:1
Number of Components	Two
Weight Loss	0.5%	200°C
	0.7%	250°C
	0.85%	300°C

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