Polymer Property : Shear Strength = 23.4 MPa Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Shear Strength	23.4 MPa @Temperature 260 Â°C	3400 psi @Temperature 500 Â°F
Greene Tweed ArlonÂ® 1555 PEEK, Carbon, Graphite Filled ArlonÂ® is a tough, high-temperature, semi-crystalline, thermoplastic presenting a unique combination of mechanical, thermal, chemical and electrical properties. Greene, Tweed uses several proprie..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 302-3M Optically Transparent Epoxy Product Description: EPO-TEK® 302-3M is a two component epoxy used for optical, medical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 305 Spectrally Transparent Epoxy Product Description: EPO-TEK® 305 is a two component, semi-rigid, optical grade epoxy for semiconductor packaging of fiber optics, optoelectronics and medical devices. It is an electrically and th..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 320-3 Optically Opaque Epoxy Material Description: A two component, black-colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modific..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 320NC-2 Optically Opaque Epoxy Material Description: A two component, black colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modific..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 330 Low Viscosity, Optical Epoxy Product Description: EPO-TEK® 330 is a two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications.Advan..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 337H Graphite-Filled, High Temperature Epoxy Product Description: EPO-TEK® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic ind..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 354 High Temperature Epoxy Product Description: EPO-TEK® 354 is a two component, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally i..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 730 General Purpose Epoxy Product Description: EPO-TEK® 730 is a two component, thixotropic, room temperature-curing epoxy adhesive. Advantages & Application Notes: Excellent all purpose adhesive. Many uses in job shop and ..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 731 Epoxy Adhesive Material Description: A two component, thixotropic, room temperature-curing epoxy adhesive. It is an electrically and thermally insulating epoxy designed for general applications in semiconductor p..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® E3037 Epoxy Material Description: A single component, electrically conductive, thixotropic silver-filled epoxy for die-attach and SMD-attach inside hybrid microelectronics.Information Provided by Epoxy Technolo..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die Initial
Epoxy Technology EPO-TEK® EK1000 Epoxy Material Description: A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding ..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die Initial
Epoxy Technology EPO-TEK® EK1000-MP Epoxy Material Description: A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding ..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® EM127 Electrically Conductive Epoxy Product Description: EPO-TEK® EM127 is a single component, heat curable, electrically conductive epoxy adhesive for semiconductor IC and LED die attach applications.Advantages & Application Notes: ..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® H37-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H37-MP is a single component, electrically conductive, thixotropic silver-filled adhesive for die-attach and SMD attach inside hybrid microelectronic packages. Also av..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® OD2002 High Temperature Epoxy Material Description: High Tg version of EPO-TEK®353ND with low modulus and good toughness. Replacement for EPO-TEK® 364. Complies with USP Class VI biocompatibility standards.Information Provid..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® E3035 Electrically Conductive Adhesive Product Description: EPO-TEK® E3035 is a single component, silver-filled epoxy for hybrid die and component attach.Advantages & Application Notes: Performs exceptionally well as a die attach for sm..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® H20E-175 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / J..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® H37-MPT Epoxy Material Description: A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certi..
Shear Strength	23.4 MPa @Temperature -55.0 °C	3400 psi @Temperature -67.0 °F	Overlap
3M Scotch-Weld™ DP125 Gray Epoxy Adhesive Scotch-Weld epoxy adhesive DP125 Gray is a filled, pigmented version of the Scotch-Weld epoxy adhesive DP125 Translucent and has similar performance and flexibility properties.Information provided b..
Shear Strength	23.4 MPa	3400 psi	Overlap, Brass MEK/abrade/MEK
3M Scotch-Weld™ DP460 NS Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP460 Off-White and DP460 NS are high performance, two-part epoxy adhesives offering outstanding shear and peel adhesion and very high levels of durability.Informat..
Shear Strength	23.4 MPa	3400 psi	Overlap, Stainless Steel, Cohesive Failure
3M Scotch-Weld™ DP810NS Structural Adhesive 3M™ Scotch-Weld™ Low-Odor Acrylic Adhesives are two-part, 1:1 mix ratio, toughened structural adhesives with less odor than most acrylic adhesives. The adhesives have excellent shear and peel stre..
Shear Strength	23.4 MPa	3400 psi	Overlap, Stainless Steel, Cohesive Failure
3M Scotch-Weld™ DP810 Tan Structural Adhesive 3M™ Scotch-Weld™ Low-Odor Acrylic Adhesives are two-part, 1:1 mix ratio, toughened structural adhesives with less odor than most acrylic adhesives. The adhesives have excellent shear and peel stre..
Shear Strength	23.4 MPa	3400 psi	Lap, Alum to Alum
Atom Adhesives AA-BOND 2156 Epoxy Adhesive AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive compone..