Mechanical Properties | Metric | English | Comments |
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Shear Strength | 23.4 MPa @Temperature 260 °C |
3400 psi @Temperature 500 °F |
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Greene Tweed Arlon® 1555 PEEK, Carbon, Graphite Filled Arlon® is a tough, high-temperature, semi-crystalline, thermoplastic presenting a unique combination of mechanical, thermal, chemical and electrical properties. Greene, Tweed uses several proprie.. |
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Shear Strength | >= 23.4 MPa | >= 3400 psi | Die |
Epoxy Technology EPO-TEK® 302-3M Optically Transparent Epoxy Product Description: EPO-TEK® 302-3M is a two component epoxy used for optical, medical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as.. |
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Shear Strength | >= 23.4 MPa | >= 3400 psi | Die |
Epoxy Technology EPO-TEK® 320-3 Optically Opaque Epoxy Material Description: A two component, black-colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modific.. |
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Shear Strength | >= 23.4 MPa | >= 3400 psi | Die |
Epoxy Technology EPO-TEK® 330 Low Viscosity, Optical Epoxy Product Description: EPO-TEK® 330 is a two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications.Advan.. |
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Shear Strength | >= 23.4 MPa | >= 3400 psi | Die |
Epoxy Technology EPO-TEK® 337H Graphite-Filled, High Temperature Epoxy Product Description: EPO-TEK® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic ind.. |
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Shear Strength | >= 23.4 MPa | >= 3400 psi | Die |
Epoxy Technology EPO-TEK® 354 High Temperature Epoxy Product Description: EPO-TEK® 354 is a two component, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally i.. |
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Shear Strength | >= 23.4 MPa | >= 3400 psi | Die |
Epoxy Technology EPO-TEK® 360 Low Viscosity Optical Epoxy Adhesive Product Description: EPO-TEK® 360 is a two component, high-temperature grade epoxy for semiconductor, electronics, fiber optics and medical applications.Advantages & Application Notes: Built in col.. |
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Shear Strength | >= 23.4 MPa | >= 3400 psi | Die |
Epoxy Technology EPO-TEK® 360ST High Temperature Epoxy Material Description: A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a slightly th.. |
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Shear Strength | >= 23.4 MPa | >= 3400 psi | Die |
Epoxy Technology EPO-TEK® 360T High Temperature Epoxy Material Description: A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a thixotropic.. |
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Shear Strength | >= 23.4 MPa | >= 3400 psi | Die |
Epoxy Technology EPO-TEK® 509FM-1 General Purpose Epoxy Product Description: EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic indust.. |
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Shear Strength | >= 23.4 MPa | >= 3400 psi | Die |
Epoxy Technology EPO-TEK® 730 Unfilled Black General and Structural Grade Epoxy Material Description: A two component, room temperature curing, general and structural grade epoxy. It can be used for adhesive, sealing, and encapsulating applications in medical, xray device, fil.. |
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Shear Strength | >= 23.4 MPa | >= 3400 psi | Die |
Epoxy Technology EPO-TEK® E2116 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E2116 is a two component, silver-filled and stencil printable electrically conductive adhesive for bonding SMDs onto PCB and substrates. Can be used as a “lead-free”.. |
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Shear Strength | >= 23.4 MPa | >= 3400 psi | Die |
Epoxy Technology EPO-TEK® E3035T-2 Electrically Conductive Epoxy Product Description: EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits.Advantages & Application Notes: This epoxy c.. |
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Shear Strength | >= 23.4 MPa | >= 3400 psi | Die Initial |
Epoxy Technology EPO-TEK® EK1000-MP Epoxy Material Description: A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding .. |
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Shear Strength | >= 23.4 MPa | >= 3400 psi | Die |
Epoxy Technology EPO-TEK® H20-FC Electrically Conductive Epoxy Product Description: EPO-TEK®H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly.Adv.. |
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Shear Strength | >= 23.4 MPa | >= 3400 psi | Die |
Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el.. |
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Shear Strength | >= 23.4 MPa | >= 3400 psi | Die |
Epoxy Technology EPO-TEK® N20E Electrically Conductive Paste Product Description: EPO-TEK® N20E is a two component, electrically and thermally conductive, epoxy adhesive designed for semiconductor and electronics assembly. Its applications and field conditi.. |
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Shear Strength | 23.4 MPa | 3400 psi | Die |
Epoxy Technology EPO-TEK® OG116-31 UV Cure Optical Epoxy Product Description: EPO-TEK® OG116-31 is a single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical.. |
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Shear Strength | >= 23.4 MPa | >= 3400 psi | Die |
Epoxy Technology EPO-TEK® T7139 Glob Top Epoxy Product Description: EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.Advantages & Application N.. |
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Shear Strength | 23.4 MPa | 3400 psi | Overlap, Etched Aluminum |
3M Scotch-Weld™ DP125 Gray Epoxy Adhesive Scotch-Weld epoxy adhesive DP125 Gray is a filled, pigmented version of the Scotch-Weld epoxy adhesive DP125 Translucent and has similar performance and flexibility properties.Information provided b.. |
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Shear Strength | 23.4 MPa @Temperature -55.0 °C |
3400 psi @Temperature -67.0 °F |
Overlap |
3M Scotch-Weld™ DP125 Gray Epoxy Adhesive Scotch-Weld epoxy adhesive DP125 Gray is a filled, pigmented version of the Scotch-Weld epoxy adhesive DP125 Translucent and has similar performance and flexibility properties.Information provided b.. |
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Shear Strength | 23.4 MPa | 3400 psi | Overlap, Brass MEK/abrade/MEK |
3M Scotch-Weld™ DP460 NS Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP460 Off-White and DP460 NS are high performance, two-part epoxy adhesives offering outstanding shear and peel adhesion and very high levels of durability.Informat.. |
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Shear Strength | 23.4 MPa | 3400 psi | Overlap, Stainless Steel, Cohesive Failure |
3M Scotch-Weld™ DP810 Tan Structural Adhesive 3M™ Scotch-Weld™ Low-Odor Acrylic Adhesives are two-part, 1:1 mix ratio, toughened structural adhesives with less odor than most acrylic adhesives. The adhesives have excellent shear and peel stre.. |
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Shear Strength | 23.4 MPa | 3400 psi | Overlap, Galvanized Steel-MEK/Abrade/MEK, Cohesive/Adhesive Failure |
3M Scotch-Weld™ LSB60 Toughened Epoxy Adhesives 3M™ Scotch-Weld™ Toughened Epoxy Adhesive LBS60 is a high performance, two-part, toughened epoxy adhesives offering outstanding shear adhesion and very high levels of durability with a choice of f.. |
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Shear Strength | 23.4 MPa @Temperature -55.0 °C |
3400 psi @Temperature -67.0 °F |
Aluminum, etched, Overlap, Cohesive Failure |
3M Scotch-Weld™ LSB60 Toughened Epoxy Adhesives 3M™ Scotch-Weld™ Toughened Epoxy Adhesive LBS60 is a high performance, two-part, toughened epoxy adhesives offering outstanding shear adhesion and very high levels of durability with a choice of f.. |