Physical Properties | Metric | English | Comments |
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Viscosity | 4000 cP | 4000 cP | |
NextGen Adhesives P907-01 Fiber Optic Adhesive Description: NGAC P907-01 is a rapid curing, low viscosity, heat cured epoxy adhesive system that is specifically formulated for use in the fiber optic industry.Advantages and Applications: Uses inc.. |
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Viscosity | 4000 cP | 4000 cP | |
Resinlab® CYNERGY CA6014 Adhesive Description: The CYNERGY 6000 SERIES are for use in demanding applications where very fast cure speeds are required. These are single component solvent free materials manufactured in a wide variety.. |
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Viscosity | 4000 cP | 4000 cP | |
Resinlab® CYNERGY CA6209 Adhesive Description: The CYNERGY 6200 SERIES products are for use in demanding applications where very fast cure speeds are required. Also used when difficult to bond and acidic surfaces are used such as EP.. |
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Viscosity | 4000 cP | 4000 cP | |
Resinlab® CYNERGY CA6309 Adhesive Description: The CYNERGY 6300 SERIES products are for use in applications where a faster set time is desired or low moisture conditions exist. Provides good bonds to a wide variety of materials.Appl.. |
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Viscosity | 4000 cP | 4000 cP | "A" component |
ACC QSil 551 QSI Quantum Silicones Silicone Potting Material
(discontinued **) Part of the Amber Chemical Group. Data provided by manufacturer.Characteristics: 100% solid, long pot life, low modulus, good elongation. |
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Viscosity | 4000 cP @Temperature 25.0 °C |
4000 cP @Temperature 77.0 °F |
RVT SC4/14, spindle 6 @100 rpm |
Gwent Electronic Materials D2121102P1 UV Curable Dielectric Ink Screen printable UV cured green dielectric ink with good printability and excellent flexibility. Provides excellent screen life and is suitable for use with automated reel to reel, semi-automatic or.. |
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Viscosity | 4000 cP @Temperature 25.0 °C |
4000 cP @Temperature 77.0 °F |
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Momentive Performance Materials RTV656 Clear Extreme Low Temperature Potting/Encapsulating Compound Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depth.. |
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Viscosity | 4000 - 6000 cP | 4000 - 6000 cP | 30% solid in Anone |
Taiwan Sheen Soon Sheenthane® A7710 TPU for Ink Thermoplastic polyurethane elastomer for ink. Hydrolysis resistance gradeAbrasion resistant, flexible, soft, excellent adhesion, high solubility in MEK and Anone. Used for transfer coating, screen.. |
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Viscosity | 4000 cP @Shear Rate 10994 1/s, Temperature 210 °C |
4000 cP @Shear Rate 10994 1/s, Temperature 410 °F |
ASTM D3835 |
STAR Thermoplastic Alloys & Rubbers StarMediflex P 7020-1000 TPE Product Description: StarMediflex P 7020-1000 is an easy processing TPE designed for injection molding. This particular class of TPE material for medical products and tubing applications. Features:S.. |
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Viscosity | 4000 cP | 4000 cP | 10% Solid, 1.5% NaCl |
Solvay MACKADET® EQ-178 Surfactant Product Description: Mackadet EQ-178 is a mild, concentrated blend of surfactants for use as a base for high foam personal care products. This blend is free of alcohol, diethanolamides, lauryl sulfa.. |
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Viscosity | <= 4000 cP | <= 4000 cP | #4 SP @ 20 rpm; RP-0659 |
Solvay MIRACARE® BC-10 Surfactant Description: A performance concentrate used to produce ultra-mild baby shampoo, bubble bath, bath gel and liquid hand soap productsChemical Name: BABY SHAMPOO CONCENTRATE Available in: Asia Pacific,.. |
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Viscosity | 4000 - 6000 cP | 4000 - 6000 cP | Part B |
Master Bond EP21ARHT Two component epoxy adhesive, sealant, coating and encapsulating system Product Description: Master Bond EP21ARHT is a two component epoxy resin system for high performance bonding, sealing, coating and encapsulating. It has a convenient 100 to 50 mix ratio by weight an.. |
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Viscosity | 4000 - 8000 cP | 4000 - 8000 cP | Mixed |
Master Bond EP62-1Med USP Class VI Two Component Epoxy Resin System Master Bond EP62-1Med is a two component epoxy system that has an exceptionally long working life at ambient temperatures and cures rapidly at moderately elevated temperatures. It has a 100 to 10 mi.. |
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Viscosity | 4000 - 8000 cP @Temperature 25.0 °C |
4000 - 8000 cP @Temperature 77.0 °F |
Mixed |
Trelleborg Emerson & Cuming Eccobond® B 97 Heat Cure Catalyst Emerson & Cuming B 97 Eccobond® Heat Cure CatalystVery high temperature resistance, not as brittle as 17 M 1. Cures from 80°C to 200°C. Excellent chemical resistance. May also be used as an accel.. |
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Viscosity | 4000 cP @Temperature 25.0 °C |
4000 cP @Temperature 77.0 °F |
Mixed |
Trelleborg Emerson & Cuming Stycast® 2057/9 Two-Component General Purpose Encapsulant Features and Typical Applications: Designed as general purpose encapsulants, these products offer a wide range of features including thermal conductivity, mechanical shock and impact resistance, as .. |
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Viscosity | 4000 - 6000 cP @Temperature 23.0 °C |
4000 - 6000 cP @Temperature 73.4 °F |
50 rpm |
Epoxy Technology EPO-TEK® 354 High Temperature Epoxy Product Description: EPO-TEK® 354 is a two component, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally i.. |
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Viscosity | 4000 - 7000 cP | 4000 - 7000 cP | |
Epoxyset Epoxibond EB-135 Unfilled Epoxy Adhesive A two-component, unfilled epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries. EB-135 has excellent bond strength to various substrat.. |
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Viscosity | 4000 - 6000 cP | 4000 - 6000 cP | 50-6 |
Abatron AboCast 50-6/AboCure 50-17 Epoxy Data provided by the manufacturer, Abatron, Inc. Very low-viscosity; Medium Amber color. Shelf life is 12+ months. |
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Viscosity | 4000 cP | 4000 cP | "A" component |
ACC QSil 550 QSI Quantum Silicones Silicone Potting Material QSil 550 is a 100% silicone solids elastomer designed for electrical potting applications. The two-component system offers a hard, thermally conductive, low modulus material that is readily repairab.. |
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Viscosity | 4000 cP | 4000 cP | "B" component |
ACC QSil 550R QSI Quantum Silicones Silicone Potting Material QSil 550Ris a 100% silicone solids elastomer designed for electronic potting applications. The two-component system offers a hard, thermally conductive, low modulus material that is readily repairab.. |
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Viscosity | 4000 cP | 4000 cP | "A" component |
ACC QSil 550SB QSI Quantum Silicones Self-Priming Silicone Potting Material QSil 550SB is a 100% silicone solids elastomer designed for electronic potting applications. The two-component system offers a hard, thermally conductive, low modulus material that is readily repair.. |
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Viscosity | 4000 - 5.00e+7 cP @Shear Rate 0.100 - 11000 1/s |
4000 - 5.00e+7 cP @Shear Rate 0.100 - 11000 1/s |
Average value: 1.53e+6 cP Grade Count:111 |
Overview of materials for Thermoplastic Elastomer, Melt-Processible Rubber This property data is a summary of similar materials in the MatWeb database for the category "Thermoplastic Elastomer, Melt-Processible Rubber". Each property range of values reported is minimum and.. |
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Viscosity | 4000 cP | 4000 cP | QSil 216A |
ACC QSil 216 QSI Quantum Silicones Transparent Liquid Silicone Rubber QSil 216 is a two-part, clear, liquid silicone which will cure at room temperature or at elevated temperatures. It has a low viscosity, which allows for ease of flow around complex parts, providing .. |
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Viscosity | 4000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
4000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake Viscosity |
Gwent Electronic Materials C2040226D4 Curable Carbon Ink This product is based on a unique curing process that results in the low temperature formation of a thermosetting conductive coating that combines good adhesion with excellent chemical, solvent and .. |
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Viscosity | 4000 - 6000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
4000 - 6000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
Gwent Electronic Materials C2060602D1 Membrane Touch Switch Paste The ink should be gently stirred before use avoiding introduction of air bubbles. It is a polymer based system for printing on polyester, PVC, etc.Can be used in membrane touch switch applicationsSc.. |