Polymer Property : Pot Life = 180 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Pot Life	180 - 240 min	180 - 240 min	Mass: 100g; TM R050-17
Resinlab® EP1285HD-12 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C..
Pot Life	180 min	180 min	ASTM D4212
Parker Chomerics CHO-SHIELD® 4994 Conductive Flexible Coating Description: CHO-SHIELD® 4994 is a smooth, highly conductive flexible silver-filled polyurethane coating designed for military/aerospace airframe applications. Both coatings provide superior adhesi..
Pot Life	180 min	180 min
Resin Technology Group H420 Oxy-Bond™ Electrically Conductive Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma..
Pot Life	180 min @Temperature 25.0 °C	180 min @Temperature 77.0 °F
Resin Technology Group TIGA 920H Flexible Silver Conductive 100 parts resin to 115 parts hardener.TIGA 920-H is a flexible, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications that require high flexibil..
Pot Life	180 min @Temperature 100 Â°C	180 min @Temperature 212 Â°F
Huntsman HT 976 Aromatic Amine Approx. H+ equivalent weight 63. Mix Ratio with GY 6010 is 36.Comments/Applications: 4,4'-diaminodiphenyl sulfone (DDS). Solid amine with a melting point of 174 - 178Â°C. Excellent high temper..
Pot Life	180 min	180 min
Hybrid Plastics POSSÂ® EP 1050 Epoxy Adhesive EP1050 is a POSSÂ® based, high-temperature epoxy adhesive with outstanding resistance to ozone, plasma, or atomic oxygen environments. Major applications include medical devices, optics, semicondu..
Pot Life	180 min	180 min
Hybrid Plastics POSSÂ® EP 2000 Epoxy Adhesive EP2000 is a POSSÂ® based, ultra-high temperature epoxy adhesive. The POSSÂ® content in EP2000 offers unique properties such as high thermal stability, outstanding oxygen and chemical resistance...
Pot Life	180 min	180 min
Tra-Con Tra-Bond FDA22 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-22 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini..
Pot Life	180 min	180 min
Tra-Con Tra-Bond FDA23 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-23 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini..
Pot Life	180 min	180 min
Tra-Con Tra-Bond FDA8T Food and Drug Application Thixotropic Flexible Epoxy Adhesive TRA-BOND FDA-8T EPOXY ADHESIVE is a thixotropic epoxy resin system specifically developed for bonding applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini..
Pot Life	180 min	180 min
Tra-Con Tra-Cast 3011 Semi-Flexible Clear Epoxy Casting Compound TRA-CAST 3011 is a clear, low viscosity epoxy casting compound recommended for industrial embedding and casting applications where its combination of superior properties, good clarity, long pot life..
Pot Life	180 min	180 min
Tra-Con Tra-Cast 3012 Clear Epoxy Casting Compound TRA-CAST 3012 is a clear, low viscosity epoxy casting compound recommended for industrial embedding and casting applications where its combination of superior properties good clarity, long pot life,..
Pot Life	180 min	180 min
Tra-Con Tra-Duct 2916 Room Temperature Conductive Silver Epoxy Adhesive TRA-DUCT 2916 is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good ele..
Pot Life	180 min	180 min	40 grams
Tra-Con Tra-Bond 216E02 Encapsulant for "Fill" Applications TRA-BOND 216E02 is a two-part epoxy adhesive developed specifically for underfill and encapsulating applications where the combination of excellent mechanical, thermal and electrical properties are ..
Pot Life	180 - 240 min	180 - 240 min
Epoxy Technology EPO-TEK® 353ND Black High Temperature Epoxy Product Description: EPO TEK® 353ND Black is a a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applicationsAdvantages & Application Notes: EPO T..
Pot Life	180 min	180 min
Epoxy Technology EPO-TEK® 353ND-T Black High Temperature Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T Black is a two component, high temperature, thixotropic epoxy for fiber optic, PCB and various medical applications. Advantages & Application Notes: This produ..
Pot Life	180 min	180 min
Epoxy Technology EPO-TEK® 353ND-T1 High Temperature Thixotropic Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed for fiber optic, electronics and medical applications. It is a more viscous alternative to EPO-TEK® 353ND-T.I..
Pot Life	180 min	180 min
Epoxy Technology EPO-TEK® 360ST High Temperature Epoxy Material Description: A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a slightly th..
Pot Life	>= 180 min	>= 180 min
Epoxyset Epoxibond EB-119SP Unfilled Epoxy Adhesive A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc...
Pot Life	180 min	180 min	uncured
Atom Adhesives AA-DUCT 2924 Epoxy Adhesive AA-DUCT 2924 is a two part electrically conductive composition developed for low shrinkage; low resistivity bonding applications where good electrical and physical properties over a wide temperature..
Pot Life	180 min	180 min	uncured
Atom Adhesives AA-DUCT 902LP Epoxy Adhesive AA-DUCT 902LP is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value ..
Pot Life	180 min	180 min	uncured
Atom Adhesives AA-DUCT 916 Epoxy Adhesive AA-DUCT 916 is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good elect..
Pot Life	180 min @Temperature 100 °C	180 min @Temperature 212 °F
Abatron AboCast 8103-13 One-Component Epoxy AboCast 8103-13 is the low-viscosity one-component clear epoxy system with deep impregnation that offers high performance at relatively high temperatures. It is best for thin-wall casting. Suggested..
Pot Life	180 min @Temperature 24.0 °C	180 min @Temperature 75.2 °F	1 lb. mass
BCC Products BC 7136-2 Epoxy Casting BC7136-2 is an aluminum filled thick section casting system with heat resistance to 300ºF. May be cast to a thickness of 2 inches in non-conductive molds, 3 inches in conductive molds and thicker s..
Pot Life	180 min	180 min
Henkel Hysol EA 9380 Paste Adhesive System Cures at low temperature. Offers strength, toughness and high temperature resistance of heat-curing film adhesives, with greater flexibility and ease of use. Can be applied to large parts with contr..