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Master Bond EP76M-F Electrically Conductive, Two Part Epoxy

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Master Bond Inc.
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP76M-F Electrically Conductive, Two Part Epoxy.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
Description: Master Bond EP76M-F is a two component, nickel filled, electrically conductive epoxy system for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. The outstanding feature of EP76M-F focuses on the faster set up time and full cure of the system when compared to the more standard EP76M. However, it should be noted that EP76M-F has a more limited open time. Unlike the majority of two part nickel conductive systems, EP76M-F has a one to one mix ratio by weight or volume and has no solvents or diluents. It has a paste consistency and is easy to apply. The volume resistivity of the cured system is 5-10 ohm-cm. EP76M-F is particularly noteworthy for its strength profile along with good resistance to chemicals including water, oil, and many acids and bases. EP76M-F has a wide temperature range of -60°F to +2 50°F. Adhesion to metals, composites, ceramics, glass, vulcanized rubbers and many plastics is excellent. Parts A and B are both colored gray. Master Bond EP76M-F is widely used in the electronic, electrical, computer and related industries where shielding and static dissipation are prime requirements, along with faster curing times.Product Advantages: Convenient mixing: one to one by weight or volume; contains no volatiles. Easy application: contact pressure only required for cure; adhesive spreads evenly and smoothly. Versatile cure schedules; ambient temperature cures or fast elevated temperature cures as required. Good electrical and thermal conductivity. High bond strength to similar and dissimilar substrates. Bonds well to a wide variety of substrates, especially metals and composites. Faster set up and cure times.Information provided by MasterBond®
Physical Properties Metric English Comments
Viscosity >= 500000 cP
>= 500000 cP
Part A, thixotropic
>= 900000 cP
>= 900000 cP
Part B, thixotropic
Mechanical Properties Metric English Comments
Hardness, Shore D >= 80
>= 80
Tensile Strength at Break >= 41.4 MPa
>= 6000 psi
Shear Strength >= 10.3 MPa
>= 1500 psi
Tensile lap, Al to Al
Thermal Properties Metric English Comments
CTE, linear 40.0 - 45.0 µm/m-°C
22.2 - 25.0 µin/in-°F
Thermal Conductivity 1.15 - 1.30 W/m-K
8.00 - 9.00 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 121 °C
250 °F
Minimum Service Temperature, Air -51.1 °C
-60.0 °F
Electrical Properties Metric English Comments
Volume Resistivity 5.0 - 10 ohm-cm
5.0 - 10 ohm-cm
Processing Properties Metric English Comments
Cure Time 60.0 - 120 min

@Temperature 93.3 °C
1.00 - 2.00 hour

@Temperature 200 °F
1440 - 2880 min

@Temperature 23.9 °C
24.0 - 48.0 hour

@Temperature 75.0 °F
Pot Life 15 - 20 min
15 - 20 min
100 gram batch
Shelf Life 3.00 - 6.00 Month
3.00 - 6.00 Month
unopened containers
Descriptive Properties Value Comments
Mixing Ratio (A to B) 1:1
by weight or volume
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