Songhan Plastic Technology Co.,Ltd.

Master Bond EP21FL Flexibilized and Toughened Low Viscosity Epoxy

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Master Bond Inc.
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP21FL Flexibilized and Toughened Low Viscosity Epoxy.pdf
  Online Service   lookpolymers   27660005
Material Notes:
Master Bond Polymer System EP21FL is a lower viscosity, two component, flexibilized epoxy resin system for high performance bonding, coating, sealing and encapsulating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a four to one mix ratio by weight. This compound is 100% reactive and does not contain any solvents or volatiles. It bonds well to a variety of substrates, including metals, glass, ceramics and many plastics.
Physical Properties Metric English Comments
Viscosity 3000 - 4000 cP

@Temperature 23.0 °C
3000 - 4000 cP

@Temperature 73.4 °F
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 121 °C
250 °F
Minimum Service Temperature, Air -51.1 °C
-60.0 °F
Processing Properties Metric English Comments
Cure Time 120 - 180 min

@Temperature 93.3 °C
2.00 - 3.00 hour

@Temperature 200 °F
1440 - 2880 min

@Temperature 23.0 °C
24.0 - 48.0 hour

@Temperature 73.4 °F
Descriptive Properties Value Comments
Color Code "A" Amber; "B" Amber
Mix Ratio By Weight 100/25
Set-Up Time, minutes 120-180
At Room Temperature
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