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Epoxy Technology EPO-TEK® U300-2 Two Component Epoxy
| Category | Polymer , Thermoset , Epoxy |
| Manufacturer | Epoxy Technology |
| Trade Name | EPO-TEK® |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Epoxy Technology EPO-TEK® U300-2 Two Component Epoxy.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Material Description: A two component epoxy designed for capillary underfill of semiconductor chips and SMDs. Long potlife, high Tg, and optical clarity are a few of its traits. NASA approved low outgassing epoxy suitable for electronic applications such as smart cards, RFIDs, medical implants and wafer level camera optics.Information Provided by Epoxy Technology
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 1.10 g/cc | 1.10 g/cc | Part A |
| 1.20 g/cc | 1.20 g/cc | Part B | |
| Viscosity | 3700 - 6700 cP @Temperature 23.0 °C |
3700 - 6700 cP @Temperature 73.4 °F |
20 rpm |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 80 | 80 | |
| Tensile Modulus | 1.85 GPa | 268 ksi | Storage |
| Shear Strength | 10.81 MPa | 1568 psi | Lap |
| 46.9 MPa | 6800 psi | Die |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | Below Tg |
| 184 µm/m-°C | 102 µin/in-°F | Above Tg | |
| Maximum Service Temperature, Air | 225 °C | 437 °F | Continuous |
| 325 °C | 617 °F | Intermittent | |
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| -55.0 °C | -67.0 °F | Intermittent | |
| Glass Transition Temp, Tg | >= 115 °C | >= 239 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Decomposition Temperature | 425 °C | 797 °F | Degradation Temperature |
| Optical Properties | Metric | English | Comments |
|---|---|---|---|
| Refractive Index | 1.5746 @Wavelength 589 nm |
1.5746 @Wavelength 589 nm |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | >= 3.00e+13 ohm-cm | >= 3.00e+13 ohm-cm | |
| Dielectric Constant | 3.04 @Frequency 1000 Hz |
3.04 @Frequency 1000 Hz |
|
| Dissipation Factor | 0.011 @Frequency 1000 Hz |
0.011 @Frequency 1000 Hz |
| Chemical Properties | Metric | English | Comments |
|---|---|---|---|
| Ionic Impurities - Na (Sodium) | 14 ppm | 14 ppm | |
| Ionic Impurities - K (Potassium) | 6.0 ppm | 6.0 ppm | |
| Ionic Impurities - Cl (Chloride) | 100 ppm | 100 ppm |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 180 min | 3.00 hour | minimum |
| 90.0 min @Temperature 120 °C |
1.50 hour @Temperature 248 °F |
minimum | |
| Pot Life | 2880 min | 2880 min | |
| Shelf Life | 12.0 Month @Temperature 25.0 °C |
12.0 Month @Temperature 77.0 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Color | Amber | Part B |
| Clear/Colorless | Part A | |
| Consistency | Pourable liquid | |
| Ionic Impurities NH4 | 274 ppm | |
| Number of Components | Two | |
| Weight Loss | <0.05% | 200°C |
| <0.05% | 250°C | |
| 0.15% | 300°C |
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