Polymer Property : Pot Life = 2880 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Pot Life	2880 - 2880 min @Temperature 5.00 - 5.00 °C	2880 - 2880 min @Temperature 41.0 - 41.0 °F	Average value: 2880 min Grade Count:1
Overview of materials for Epoxy, Electrically Conductive This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Electrically Conductive". Each property range of values reported is minimum and maximum values of..
Pot Life	2880 - 4320 min @Temperature 23.9 °C	2880 - 4320 min @Temperature 75.0 °F	100 gram batch
Master Bond EP112LS Two part, heat curing epoxy for potting, encapsulation, coating, sealing and impregnation Master Bond EP112LS is a low viscosity two component epoxy resin system for potting, encapsulation, sealing, coating and impregnation. The mix ratio is an easy to use 100:80 by weight. EP112LS offer..
Pot Life	2880 min	2880 min	(2 days)
Tra-Con Tra-Cast 3357 High Temperature Rigid Epoxy Casting System TRA-CAST 3357 is a smooth pouring, low viscosity casting resin system recommended for rigid, large mass potting, encapsulating, laminating, filament-winding and coil embedment applications where the..
Pot Life	2880 min	2880 min
Epoxy Technology EPO-TEK® H20E-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al..
Pot Life	2880 min	2880 min
Epoxy Technology EPO-TEK® H81A Epoxy Material Description: A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Information Provided by Epoxy Technolo..
Pot Life	2880 min	2880 min
Epoxy Technology EPO-TEK® U300-2 Two Component Epoxy Material Description: A two component epoxy designed for capillary underfill of semiconductor chips and SMDs. Long potlife, high Tg, and optical clarity are a few of its traits. NASA approved lo..