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Polymer Property : Cure Time = 3.00 hour Product List

Processing Properties

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Processing Properties Metric English Comments
Cure Time 180 min

@Temperature 76.7 °C
3.00 hour

@Temperature 170 °F
Humiseal 2A64 Urethane Conformal Coating
Humiseal 2A64 Urethane Conformal CoatingHigh moisture resistanceExcellent dielectrical propertiesExcellent chemical resistanceRepairableMIL-I-46058C ApprovedPasses thermal shock test (MIL-I-46058C)F..
Cure Time 180 - 240 min
3.00 - 4.00 hour
Handling strength in 3 to 4 hrs.
Fibre Glast 1101 High-Strength General Purpose Epoxy Adhesive
Description:#1101 is a light grayish-tan two part epoxy adhesive that was developed especially for difficult bonding problems involving similar or dissimilar materials. #1101 provides excellent adhe..
Cure Time 180 min
3.00 hour
Functional cure
ITW Devcon Flexane® Rubber Repair / Castable Urethane Fast Cure, Black
Information provided by ITW Devcon
Cure Time 180 - 240 min

@Temperature 149 °C
3.00 - 4.00 hour

@Temperature 300 °F
Master Bond EP45HT-1 Adhesive Resists Exposure to Sterilization
Description: Master Bond Polymer System EP45HT-1 is a remarkably fast curing, medium viscosity, two component epoxy compound formulated for high performance casting and bonding. It is 100% reactive ..
Cure Time 180 min
3.00 hour
1 hr @ 25°C + 2 hrs @ 65°C
Tra-Con Tra-Bond 216R02 Quick Set Electrical Insulator
TRA-BOND 216R02 is an exceptional epoxy formulation recommended for applications where both quick set-up and a low-viscosity material are required. This clear, two-part, low-viscosity system is easi..
Cure Time 180 min
3.00 hour
2 hrs @ 125°C + 1 hr @ 140°C
Tra-Con Tra-Bond F202HV Spectrally Transparent Thixotropic Epoxy Adhesive
TRA-BOND F202 is a clear, thixotropic epoxy adhesive recommended for photonic applications requiring exposure to high temperatures or chemical and environmental resistance. This 100% solids system e..
Cure Time >= 180 min
>= 3.00 hour
Trelleborg Emerson & Cuming Stycast® E-1000 One-Component Epoxy Low Stress Encapsulant
Emerson & Cuming E-1000 Stycast® One-Component Epoxy Low Stress EncapsulantDesigned for the encapsulation of a wide range of stress sensitive electronics. They offer excellent performance at low te..
Cure Time 180 min

@Temperature 80.0 °C
3.00 hour

@Temperature 176 °F
Loctite® 3143 Deep Potting Epoxy
PottersLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and shock resistance of assemblies. For ..
Cure Time 180 min

@Temperature 125 °C
3.00 hour

@Temperature 257 °F
Trelleborg Emerson & Cuming Eccobond® 17 M 1 Heat Cure Catalyst
Emerson & Cuming 17 M 1 Eccobond® Heat Cure CatalystVery high temperature resistance, highest temperature strength, lowest shrink. Non-crystallizing. Long working life. Imparts excellent chemical r..
Cure Time 180 min

@Temperature 25.0 °C
3.00 hour

@Temperature 77.0 °F
Full Cure; Steel
Loctite® 266 High Temperature/High Strength Threadlocker
ThreadlockersInvented by Loctite Corporation as a revolutionary method to lock and seal threaded fasteners, Loctite® Liquid Threadlockers have found wide acceptance in a range of applications--from..
Cure Time >= 180 min

@Temperature 130 °C
>= 3.00 hour

@Temperature 266 °F
Cytec (Conap) FR-1200 / EA-117 Conapoxy® Resin / Conacure® Hardener
Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Cure Time >= 180 min

@Temperature 130 °C
>= 3.00 hour

@Temperature 266 °F
Cytec (Conap) RN-1000 / EA-117 Conapoxy® Resin / Conacure® Hardener
Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Cure Time 180 min
3.00 hour
Tack-Free Time
3M AC-350 Class A-1/2 Aerospace Sealant
3M Aerospace Sealant AC-350 Class A are fast-cure, intermediate density two-component, manganese dioxide cure, brushable, polysulfide fuel tank and fuselage sealants. 3M AC-350 Class A Sealants have..
Cure Time 180 - 240 min
3.00 - 4.00 hour
Touch Dry
3M Scotchkote™ 162CR Epoxy Coating
3M Scotchkote Epoxy Coating 162CR has been specifically developed as a 100% solids lining for eth internals of tanks, vessels and other equipment in contact with dirty water, mild aqueous chemicals ..
Cure Time 180 - 240 min

@Temperature 149 °C
3.00 - 4.00 hour

@Temperature 300 °F
Alternate Cure
Aremco Aremco-Bond™ 526N High Performance Epoxide
Clear-Amber, 1:1 System for Tough Bonding Applications Also available filled with aluminum oxide (Alumina) or pigments
Cure Time 180 - 240 min
3.00 - 4.00 hour
2-4 hrs Air Set; 3 hrs at 200°F
Aremco Pyro-Putty™ 653 High Temperature Ceramic-Metallic Putty, Stainless Filled
Ceramic and Stainless-Filled, One-Part, Water Based Paste.For Vertical Surfaces and Applications to 1/2" Thick.Repairs Cast Iron, Steel and Stainless Parts to 2000°F.
Cure Time 180 min
3.00 hour
Initial Set
3M Scotchkote™ 60EG 533 Urethane Elastomer
Scotchkote Urethane Elastomer 60EG 533 has been specifically developed as an elastomeric repair system with a high degree of flexibility for rebuilding and resurfacing rubber components.Product Feat..
Cure Time 180 min
3.00 hour
Time to Handling Strength
3M Scotch-Weld™ DP8005 Translucent Structural Adhesive
3M™ Scotch-Weld™ Structural Plastic Adhesive DP-8005 is a two-part acrylic-based adhesive (10:1 ratio by volume) that can bond many low surface energy plastics, including many grades of polypropyl..
Cure Time 180 - 360 min
3.00 - 6.00 hour
2-4 hr at 200°F followed by 1-2 hr at 350°F
Aremco Cerama-Dip™ 538-N High Temperature Specialty Ceramic-Inorganic Coating
Low viscosity, light gray coating for powder resistors and rheostats to 2600°F (1427°C). black and green pigments also available.
Cure Time 180 - 240 min
3.00 - 4.00 hour
At 300°F plus 1 hrs at 150°F
Master Bond Supreme 45HTQ Quartz Filled, Heat Resistant Epoxy Compound
Master Bond Polymer Adhesive Supreme 45HTQ is a two component, toughened, quartz filled epoxy compound for high performance structural bonding and casting. It is suitable for applications where long..
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