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- Polymer Property : Glass Transition Temp, Tg = 115 °C
Polymer Property : Glass Transition Temp, Tg = 115 °C Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Glass Transition Temp, Tg | 115 °C | 239 °F | |
| NextGen Adhesives P907-12 Fiber Optic Adhesive Description: NGAC P907-12 is a rapid curing, low viscosity, heat cured epoxy adhesive system that is specifically formulated for use in the fiber optic industry.Advantages and Applications: Uses inc.. |
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| Glass Transition Temp, Tg | 115 °C | 239 °F | |
| NextGen Adhesives P907-13 Fiber Optic Adhesive Description: NGAC P907-13 is a rapid curing, low viscosity, heat cured epoxy adhesive system that is specifically formulated for use in the fiber optic industry.Advantages and Applications: Uses inc.. |
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| Glass Transition Temp, Tg | 115 °C | 239 °F | Dry; DMA |
| Park Electrochemical Nelcote® E-761 Epoxy Prepreg, 120 E-Glass Reinforced Nelcote® E-761 is a versatile self-adhesive epoxy matrix for use in aerospace and commercial application where ease of processing and cost are key considerations.Key Features and Benefits:Controlle.. |
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| Glass Transition Temp, Tg | 115 °C | 239 °F | Dry; DMA |
| Park Electrochemical Nelcote® E-761 Epoxy Prepreg, 285 Kevlar® Reinforced Nelcote® E-761 is a versatile self-adhesive epoxy matrix for use in aerospace and commercial application where ease of processing and cost are key considerations.Key Features and Benefits:Controlle.. |
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| Glass Transition Temp, Tg | 115 °C | 239 °F | Dry; DMA |
| Park Electrochemical Nelcote® E-761 Epoxy Prepreg, 3K 8HS Carbon Reinforced Nelcote® E-761 is a versatile self-adhesive epoxy matrix for use in aerospace and commercial application where ease of processing and cost are key considerations.Key Features and Benefits:Controlle.. |
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| Glass Transition Temp, Tg | 115 °C | 239 °F | Dry; DMA |
| Park Electrochemical Nelcote® E-761 Epoxy Prepreg, 3K PW Carbon Reinforced Nelcote® E-761 is a versatile self-adhesive epoxy matrix for use in aerospace and commercial application where ease of processing and cost are key considerations.Key Features and Benefits:Controlle.. |
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| Glass Transition Temp, Tg | 115 °C | 239 °F | Dry; DMA |
| Park Electrochemical Nelcote® E-761 Epoxy Prepreg, 4581 Quartz Nelcote® E-761 is a versatile self-adhesive epoxy matrix for use in aerospace and commercial application where ease of processing and cost are key considerations.Key Features and Benefits:Controlle.. |
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| Glass Transition Temp, Tg | 115 °C | 239 °F | Dry; DMA |
| Park Electrochemical Nelcote® E-761 Epoxy Prepreg, 6781 S2-Glass Nelcote® E-761 is a versatile self-adhesive epoxy matrix for use in aerospace and commercial application where ease of processing and cost are key considerations.Key Features and Benefits:Controlle.. |
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| Glass Transition Temp, Tg | 115 °C | 239 °F | Dry; DMA |
| Park Electrochemical Nelcote® E-761 Epoxy Prepreg, 7781 E-Glass Reinforced Nelcote® E-761 is a versatile self-adhesive epoxy matrix for use in aerospace and commercial application where ease of processing and cost are key considerations.Key Features and Benefits:Controlle.. |
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| Glass Transition Temp, Tg | 115 °C | 239 °F | Dry; DMA |
| Park Electrochemical Nelcote® E-761 Epoxy Prepreg, Spectra® 951 - PT Reinforced Nelcote® E-761 is a versatile self-adhesive epoxy matrix for use in aerospace and commercial application where ease of processing and cost are key considerations.Key Features and Benefits:Controlle.. |
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| Glass Transition Temp, Tg | 115 °C | 239 °F | TM R050-25 |
| Resinlab® EP1325 Thixotropic, Heat Curing Epoxy Adhesive Resinlab™ EP1325 and EP1325LV are one part thixotropic, heat curing epoxy adhesives. They can also be used as a small mass potting compounds, staking or damming adhesives, or polymer systems where .. |
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| Glass Transition Temp, Tg | 115 °C | 239 °F | wet |
| Henkel Hysol EA 9681 Film Adhesive Epoxy film adhesive for bonding applications. Hysol EA9681 is formulated to provide excellent performance properties for many bonding applications, and has excellent results on composite surfaces th.. |
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| Glass Transition Temp, Tg | 115 °C | 239 °F | Ultimate Tg |
| Tra-Con Tra-Bond 2116 Low Vapor Pressure Epoxy Staking Compound TRA-BOND 2116 is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronic, aerospace, and industrial applications where.. |
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| Glass Transition Temp, Tg | 115 °C | 239 °F | Ultimate Tg |
| Tra-Con Tra-Bond 221M02 Information provided by Tra-Con Inc. |
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| Glass Transition Temp, Tg | 115 °C | 239 °F | Ultimate Tg |
| Tra-Con Tra-Bond 400-5 Low Temperature Cure Epoxy Adhesive TRA-BOND 400-5 adhesive is a general purpose non-conductive epoxy. It combines the properties of a moderate work life with the ability to cure rapidly at temperatures as low as 60°C. Having a relat.. |
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| Glass Transition Temp, Tg | 115 °C | 239 °F | Ultimate Tg, 10°C/min; DSC |
| Tra-Con Tra-Bond F253M Color Keyed High Temperature Epoxy Adhesive TRA-BOND F253M is a low viscosity, high temperature, two-part epoxy formulation that changes color during the curing process to indicate cure status. The unmixed components are light yellow; the mix.. |
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| Glass Transition Temp, Tg | 115 °C | 239 °F | Ultimate Tg |
| Tra-Con Tra-Bond FS443 Color Keyed Thixotropic Epoxy Adhesive TRA-BOND FS443 is a fast cure, high viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating s.. |
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| Glass Transition Temp, Tg | >= 115 °C | >= 239 °F | Dynamic Post- Cure Scan 20—200°C; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® OG116-31 UV Cure Optical Epoxy Product Description: EPO-TEK® OG116-31 is a single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical.. |
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| Glass Transition Temp, Tg | >= 115 °C | >= 239 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® U300-2 Two Component Epoxy Material Description: A two component epoxy designed for capillary underfill of semiconductor chips and SMDs. Long potlife, high Tg, and optical clarity are a few of its traits. NASA approved lo.. |
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| Glass Transition Temp, Tg | 115 °C | 239 °F | |
| Armstrong A-661 Epoxy Adhesive A truly unique, two-component, room temperature curing thixotropic epoxy adhesive system, which exhibits good bond strength at service temperatures up to 400°F. Ideal for applications where resist.. |
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| Glass Transition Temp, Tg | 115 °C | 239 °F | |
| Armstrong C-4/D Epoxy Adhesive A low viscosity, clear amber, unfilled adhesive, recommended for use with activators D or W. C-4 with Activator W offers maximum versatility in that differing degrees of flexibility can be achieved .. |
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| Glass Transition Temp, Tg | 115 °C | 239 °F | 10°C/min |
| Arkema Group Cristamid® MS 1100 Semi-Aromatic Nylon (PASA) (Dry) Designation ISO 1874-PA12/xx,MHLR,12-020Semi-aromatic polyamide (PASA) grade for injection molding and tubes extrusion.Transparency even thick. High resistance to environmental stress cracking. Good.. |
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