Polymer Property : Cure Time = 90.0 min Product List

Processing Properties

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Processing Properties	Metric	English
Cure Time	60.0 - 90.0 min @Temperature 177 °C	1.00 - 1.50 hour @Temperature 350 °F
Master Bond EP17HT One component epoxy system for bonding, sealing, coating and casting Product Description: Master Bond EP17HT is an one component, heat cured epoxy system for bonding, sealing, coating and encapsulating. It features good physical properties, electrical insulation prof..
Cure Time	60.0 - 90.0 min @Temperature 177 °C	1.00 - 1.50 hour @Temperature 350 °F
Master Bond EP17HT-LO One component epoxy system for bonding, sealing, coating and casting Product Description: Master Bond EP17HT-LO is a one component, heat cured epoxy system for bonding, sealing, coating and encapsulating. It features good physical properties, electrical insulation pr..
Cure Time	40.000 - 90.0 min @Temperature 121 °C	0.66666 - 1.50 hour @Temperature 250 °F
Master Bond EP3HTS Silver Filled, Electrically Conductive Epoxy Description: Master Bond Polymer System EP3HTS is a one component, silver filled, electrically conductive epoxy system featuring high shear strength and good temperature resistance along with a fast..
Cure Time	60.0 - 90.0 min @Temperature 93.3 °C	1.00 - 1.50 hour @Temperature 200 °F
Master Bond EP41S Fast Curing Epoxy Features Chemical Resistance Description: Master Bond EP41S is a two component epoxy resin compound for durable, high performance, tough, high strength coatings, liners and sealants with outstanding resistance to organic solven..
Cure Time	15.0 - 90.0 min @Temperature 22.0 °C	0.250 - 1.50 hour @Temperature 71.6 °F
Dow Corning 3-4207 DIELECTRIC TOUGH GEL KIT Two-part, translucent green, fast RT or heat cure, tough, primerless chemical adhesion, UV indicator, and UL 94 V-1 flammability classification.Information provided by Dow Corning
Cure Time	40.000 - 90.0 min @Temperature 121 °C	0.66666 - 1.50 hour @Temperature 250 °F
Master Bond EP3HTSMed Silver Filled, Medical Grade Epoxy Description: Master Bond EP3HTSMed is a one component, silver filled, electrically conductive epoxy system featuring high shear strength and good temperature resistance along with a fast cure schedu..
Cure Time	75.0 - 90.0 min @Temperature 121 °C	1.25 - 1.50 hour @Temperature 250 °F
Master Bond Supreme 10HTFL One Part Epoxy Cures at 250°F Description: Master Bond Polymer System Supreme 10HTFL features a blend of physical properties including outstanding peel strength, very high shear strength and a wide service temperature range of 4..