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Master Bond EP21TDCSLO Two Component Silver Conductive Epoxy Adhesive

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Master Bond Inc.
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP21TDCSLO Two Component Silver Conductive Epoxy Adhesive.pdf
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Material Notes:
Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. The high strength bonds are remarkably adaptable to thermal cycling and resistant to chemicals including water, oil and most organic solvents. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is excellent.
Mechanical Properties Metric English Comments
Adhesive Bond Strength >= 5.52 MPa
>= 800 psi
shear, Al/Al, after 30 days water immersion
>= 5.86 MPa
>= 850 psi
shear, Al/Al
Peel Strength >= 0.877 kN/m
>= 5.00 pli
Thermal Properties Metric English Comments
Thermal Conductivity 1.59 W/m-K
11.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 135 °C
275 °F
Minimum Service Temperature, Air -269 °C
-452 °F
Electrical Properties Metric English Comments
Volume Resistivity <= 0.0010 ohm-cm
<= 0.0010 ohm-cm
Processing Properties Metric English Comments
Cure Time 60.0 - 120 min

@Temperature 93.3 °C
1.00 - 2.00 hour

@Temperature 200 °F
1440 - 2880 min

@Temperature 23.9 °C
24.0 - 48.0 hour

@Temperature 75.0 °F
Pot Life 30 - 40 min
30 - 40 min
50 gram mass
Shelf Life 3.00 - 6.00 Month
3.00 - 6.00 Month
Descriptive Properties Value Comments
Mixing Ratio (A to B) 1/1
Viscosity smooth paste
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