Polymer Property : Shear Strength = 3400 psi Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 301-2FL Low Stress, Optical Epoxy Product Description: EPO-TEK® 301-2FL is a two component optical, medical, and semiconductor grade epoxy resin. It is a more flexible version of EPO-TEK® 301-2.Advantages & Application Notes: Sug..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 302-3M Optically Transparent Epoxy Product Description: EPO-TEK® 302-3M is a two component epoxy used for optical, medical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 320NC-2 Optically Opaque Epoxy Material Description: A two component, black colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modific..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 354 High Temperature Epoxy Product Description: EPO-TEK® 354 is a two component, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally i..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 360 Low Viscosity Optical Epoxy Adhesive Product Description: EPO-TEK® 360 is a two component, high-temperature grade epoxy for semiconductor, electronics, fiber optics and medical applications.Advantages & Application Notes: Built in col..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 360T High Temperature Epoxy Material Description: A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a thixotropic..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 730 General Purpose Epoxy Product Description: EPO-TEK® 730 is a two component, thixotropic, room temperature-curing epoxy adhesive. Advantages & Application Notes: Excellent all purpose adhesive. Many uses in job shop and ..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or f..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® E2116 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E2116 is a two component, silver-filled and stencil printable electrically conductive adhesive for bonding SMDs onto PCB and substrates. Can be used as a “lead-free”..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® E3037 Epoxy Material Description: A single component, electrically conductive, thixotropic silver-filled epoxy for die-attach and SMD-attach inside hybrid microelectronics.Information Provided by Epoxy Technolo..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® EM127 Electrically Conductive Epoxy Product Description: EPO-TEK® EM127 is a single component, heat curable, electrically conductive epoxy adhesive for semiconductor IC and LED die attach applications.Advantages & Application Notes: ..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® H20-FC Electrically Conductive Epoxy Product Description: EPO-TEK®H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly.Adv..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® H35-175MPT Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35MPT is a single component, silver-filled, electrically conductive epoxy designed for military hybrid die and component attach. High viscosity version of EPO-TEK® H..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® M10-D Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® OD2002 High Temperature Epoxy Material Description: High Tg version of EPO-TEK®353ND with low modulus and good toughness. Replacement for EPO-TEK® 364. Complies with USP Class VI biocompatibility standards.Information Provid..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® OE100-T High Temperature Epoxy Material Description: A two component, high Tg, high temperature grade epoxy designed for semiconductor, underfill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy ca..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® OG178 UV Cure Optical Epoxy Material Description: A single component, UV/visible shifted light curable epoxy, designed for adhesive, sealing, coating and encapsulating applications found in semiconductor, electro-optics, fiber..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® H20E-175 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / J..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® H37-MPT Epoxy Material Description: A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certi..
Shear Strength	23.4 MPa	3400 psi	Overlap, Etched Aluminum
3M Scotch-Weld™ DP125 Gray Epoxy Adhesive Scotch-Weld epoxy adhesive DP125 Gray is a filled, pigmented version of the Scotch-Weld epoxy adhesive DP125 Translucent and has similar performance and flexibility properties.Information provided b..
Shear Strength	23.4 MPa @Temperature -55.0 °C	3400 psi @Temperature -67.0 °F	Overlap
3M Scotch-Weld™ DP125 Gray Epoxy Adhesive Scotch-Weld epoxy adhesive DP125 Gray is a filled, pigmented version of the Scotch-Weld epoxy adhesive DP125 Translucent and has similar performance and flexibility properties.Information provided b..
Shear Strength	23.4 MPa	3400 psi	Overlap, Brass MEK/abrade/MEK
3M Scotch-Weld™ DP460 NS Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP460 Off-White and DP460 NS are high performance, two-part epoxy adhesives offering outstanding shear and peel adhesion and very high levels of durability.Informat..
Shear Strength	23.4 MPa	3400 psi	Overlap, FRP (Green) (IPA/abrade/IPA), Adhesive Failure/Cohesive Failure; ASTM D1002
3M Scotch-Weld™ DP920 Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP920 is a two-part, 2:1 mix ratio, toughened epoxy structural adhesive with a 20 minute work life. It exhibits excellent shear and peel strengths along with good i..
Shear Strength	23.4 MPa @Temperature -55.0 °C	3400 psi @Temperature -67.0 °F	Aluminum, etched, Overlap, Cohesive Failure
3M Scotch-Weld™ LSB60 Toughened Epoxy Adhesives 3M™ Scotch-Weld™ Toughened Epoxy Adhesive LBS60 is a high performance, two-part, toughened epoxy adhesives offering outstanding shear adhesion and very high levels of durability with a choice of f..
Shear Strength	23.4 MPa	3400 psi	Overlap, Galvanized Steel-MEK/Abrade/MEK, Cohesive/Adhesive Failure
3M Scotch-Weld™ LSB60NS Toughened Epoxy Adhesives 3M™ Scotch-Weld™ Toughened Epoxy Adhesive LBS60NS is a high performance, two-part, toughened epoxy adhesives offering outstanding shear adhesion and very high levels of durability with a choice of..
Shear Strength	23.4 MPa	3400 psi	Overlap, Etched Al, 100% RH at 49°C for 14 days
3M Scotch-Weld™ 2216 B/A Tan NS Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive 2216 B/A is a flexible, two-part, room temperature curing epoxy with high peel and shear strength. Scotch-Weld epoxy adhesive 2216 B/A is identical to 3M Scotch-Wel..