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Epoxy Technology EPO-TEK® 730 General Purpose Epoxy

Category Polymer , Thermoset , Epoxy
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® 730 General Purpose Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK® 730 is a two component, thixotropic, room temperature-curing epoxy adhesive. Advantages & Application Notes: Excellent all purpose adhesive. Many uses in job shop and repair businesses, home or household, outdoor, recreation, camping, automotive, boating; and industrial use such as filtration and metal working.Designed for those applications where a limited amount of flow is desirable. Capillary forces do not pull the epoxy out of alignment.The paste-like appearance allows it to be spread by hand using a spatula or blade, by dispensing equipment, or specialty packaging.The 1:1 mix ratio allows it to be easily mixed by volume or by weight.Used in the fabrication of X-ray sensors. Adheres to metal foils and substrates, especially lead. Available in black and in different viscosities. Excellent adhesion to foam/plastics; especially those used in filtration applications.Medical grade suggested applications: Has passed the requirements of USP Class VI Biocompatibility Standards for implantation devices.Excellent adhesion to stainless steel. Suitable for adhesive and sealing.Suggested for LCD plug-seal or end-seal, due to its high viscosity nature and room temperature cure.Can be used for joining SMDs to PCB, for staking applications, or double sided PCB. It has wet, ?green strength? before cure. In many cases, the thixotropic nature of the adhesive will hold parts in place without special fixtures while the hardening process is taking place.Very popular epoxy for wood-working applications.Versatility in curing options between 23°C and 100°CInformation Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 0.940 g/cc
0.940 g/cc
Part B
1.12 g/cc
1.12 g/cc
Part A
Particle Size <= 20 µm
<= 20 µm
Viscosity 80000 - 120000 cP

@Temperature 23.0 °C
80000 - 120000 cP

@Temperature 73.4 °F
2.5 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 64
64
Tensile Modulus 0.852 GPa
124 ksi
Storage
Shear Strength >= 13.8 MPa
>= 2000 psi
Lap
>= 23.4 MPa
>= 3400 psi
Die
Thermal Properties Metric English Comments
CTE, linear 66.0 µm/m-°C
36.7 µin/in-°F
Below Tg
248 µm/m-°C
138 µin/in-°F
Above Tg
Maximum Service Temperature, Air 150 °C
302 °F
Continuous
250 °C
482 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 55.0 °C
>= 131 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature 367 °C
693 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity <= 3.00e+13 ohm-cm
<= 3.00e+13 ohm-cm
Dielectric Constant 3.17

@Frequency 1000 Hz
3.17

@Frequency 1000 Hz
Dissipation Factor 0.021

@Frequency 1000 Hz
0.021

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 100 °C
0.500 hour

@Temperature 212 °F
Minimum Bond Line
1440 min

@Temperature 23.0 °C
24.0 hour

@Temperature 73.4 °F
Minimum Bond Line
Pot Life 60 min
60 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Tan
Part A
Tan
Part B
Consistency Smooth paste
Mix Ratio By Weight 1:1
Number of Components Two
Thixotropic Index 2.1
Weight Loss 1.41%
200°C
2.22%
250°C
4.16%
300°C
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