Epoxy Technology EPO-TEK® H20E-175 Electrically Conductive, Silver Epoxy

Category	Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® H20E-175 Electrically Conductive, Silver Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Product Description: EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / JEDEC packaging, microelectronic packaging of hybrids, as well as high temperature devices and assembly.Advantages & Application Notes: Thixotropic paste-like rheology allows for high speed dispensing and screen printing operations. It can also be applied by hand techniques using spatula, toothpick, or stamping chuck.Suggested for Rf/Microwave device packaging found in military, commercial, aerospace and cockpit, and industrial (down-hole petrochemical) circuits.> 3 day pot-life allows for mass production yielding low waste.Information Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	3.07 g/cc	3.07 g/cc	Part B
	3.44 g/cc	3.44 g/cc	Part A
Viscosity	2800 - 3800 cP @Temperature 23.0 °C	2800 - 3800 cP @Temperature 73.4 °F	100 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	70	70
Tensile Modulus	4.33 GPa	628 ksi	Storage
Shear Strength	8.908 MPa	1292 psi	Lap
	>= 23.4 MPa	>= 3400 psi	Die

Thermal Properties	Metric	English	Comments
CTE, linear	20.0 µm/m-°C	11.1 µin/in-°F	Below Tg
	88.0 µm/m-°C	48.9 µin/in-°F	Above Tg
Thermal Conductivity	2.04 W/m-K	14.2 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	250 °C	482 °F	Continuous
	350 °C	662 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 80.0 °C	>= 176 °F	Dynamic Cure 20—250°C /ISO 25 Min; Ramp -10—250°C @ 20°C/Min
Decomposition Temperature	450 °C	842 °F	Degradation Temperature

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.00040 ohm-cm	<= 0.00040 ohm-cm

Processing Properties	Metric	English
Cure Time	60.0 min @Temperature 180 °C	1.00 hour @Temperature 356 °F
	120 min @Temperature 150 °C	2.00 hour @Temperature 302 °F
Pot Life	5040 min	5040 min
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties	Value	Comments
Color	Silver	Part A
	Silver	Part B
Consistency	Smooth thixotropic paste
Mix Ratio By Weight	1:1
Number of Components	Two
Thixotropic Index	3.1
Weight Loss	0.05%	200°C
	0.11%	250°C
	0.25%	300°C

Users viewing this material also viewed the following: