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Epoxy Technology EPO-TEK® H20E-175 Electrically Conductive, Silver Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® H20E-175 Electrically Conductive, Silver Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / JEDEC packaging, microelectronic packaging of hybrids, as well as high temperature devices and assembly.Advantages & Application Notes: Thixotropic paste-like rheology allows for high speed dispensing and screen printing operations. It can also be applied by hand techniques using spatula, toothpick, or stamping chuck.Suggested for Rf/Microwave device packaging found in military, commercial, aerospace and cockpit, and industrial (down-hole petrochemical) circuits.> 3 day pot-life allows for mass production yielding low waste.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 3.07 g/cc
3.07 g/cc
Part B
3.44 g/cc
3.44 g/cc
Part A
Viscosity 2800 - 3800 cP

@Temperature 23.0 °C
2800 - 3800 cP

@Temperature 73.4 °F
100 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 70
70
Tensile Modulus 4.33 GPa
628 ksi
Storage
Shear Strength 8.908 MPa
1292 psi
Lap
>= 23.4 MPa
>= 3400 psi
Die
Thermal Properties Metric English Comments
CTE, linear 20.0 µm/m-°C
11.1 µin/in-°F
Below Tg
88.0 µm/m-°C
48.9 µin/in-°F
Above Tg
Thermal Conductivity 2.04 W/m-K
14.2 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 250 °C
482 °F
Continuous
350 °C
662 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 80.0 °C
>= 176 °F
Dynamic Cure 20—250°C /ISO 25 Min; Ramp -10—250°C @ 20°C/Min
Decomposition Temperature 450 °C
842 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity <= 0.00040 ohm-cm
<= 0.00040 ohm-cm
Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 180 °C
1.00 hour

@Temperature 356 °F
120 min

@Temperature 150 °C
2.00 hour

@Temperature 302 °F
Pot Life 5040 min
5040 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Silver
Part A
Silver
Part B
Consistency Smooth thixotropic paste
Mix Ratio By Weight 1:1
Number of Components Two
Thixotropic Index 3.1
Weight Loss 0.05%
200°C
0.11%
250°C
0.25%
300°C
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