Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Epoxy Technology EPO-TEK® E2116 Electrically Conductive, Silver Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® E2116 Electrically Conductive, Silver Epoxy.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
Product Description: EPO-TEK® E2116 is a two component, silver-filled and stencil printable electrically conductive adhesive for bonding SMDs onto PCB and substrates. Can be used as a “lead-free” alternative in circuit assembly applications found in semiconductor, medical, consumer and hybrid/military industries. Advantages & Application Notes: The thixotropic and paste-like rheology allows for application by screen or stencil printing techniques. It was designed to be printed for SMT joining similar to printing solder paste. It may also be hand applied or dispensed.A “lead-free” solution for PCB level circuit assemblies. It is suggested to use this epoxy with SMDs that do not contain Pb plated leads. Preferable to solder: Lead-free can be an environmental advantageSilver epoxy curing at 150°C is a lower temperature solution than 180-220°C SMT solder reflow.Electrically conductive adhesives can be used on flip chips and ultra-fine pitch count SMDs, avoiding the problems of solder bridging.NASA approved low outgassing epoxyCan be used on mixed technology hybrid substrates or PCBs. Adhesive deposit, pick-and-place, and cure can be accomplished in single step fashion.Alternate versions are available - contact techserv@epotek.com for best recommendation.Suggested surface finishes, contact pads, or leads: Ag, Ag-Pd, Au, and Cu. Compatible with PCBs including FR4, BT, ceramic, and flex circuits.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 1.04 g/cc
1.04 g/cc
Part B
2.95 g/cc
2.95 g/cc
Part A
Particle Size <= 20 µm
<= 20 µm
Viscosity 65000 - 90000 cP

@Temperature 23.0 °C
65000 - 90000 cP

@Temperature 73.4 °F
1 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 80
80
Tensile Modulus 3.83 GPa
556 ksi
Storage
Shear Strength 11.4 MPa
1650 psi
Lap
>= 23.4 MPa
>= 3400 psi
Die
Thermal Properties Metric English Comments
CTE, linear 43.0 µm/m-°C
23.9 µin/in-°F
Below Tg
142 µm/m-°C
78.9 µin/in-°F
Above Tg
Thermal Conductivity 1.19 W/m-K
8.26 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 200 °C
392 °F
Continuous
300 °C
572 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 100 °C
>= 212 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 405 °C
761 °F
Degradation Temperature; TGA
Electrical Properties Metric English Comments
Volume Resistivity <= 0.00050 ohm-cm
<= 0.00050 ohm-cm
Chemical Properties Metric English Comments
Ionic Impurities - Cl (Chloride) 153 ppm
153 ppm
Processing Properties Metric English Comments
Cure Time 15.0 min

@Temperature 150 °C
0.250 hour

@Temperature 302 °F
Minimum Bond Line
Pot Life 360 min
360 min
Shelf Life 6.00 Month

@Temperature 25.0 °C
6.00 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Amber
Part B
Silver
Part A
Consistency Viscous Paste
Ionic Impurities NH4 107 ppm
Mix Ratio By Weight 100:3
Number of Components Two
Weight Loss 0.66%
300°C
Copyright © lookpolymers.com All Rights Reserved