Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy

Category	Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or fast-cure; chips can be cured in-line < 90 seconds travel time; or lead-frames can be loaded into magazines for box oven curing

Physical Properties	Metric	English	Comments
Specific Gravity	1.04 g/cc	1.04 g/cc	Part B
	2.67 g/cc	2.67 g/cc	Part A
Particle Size	<= 20 µm	<= 20 µm
Viscosity	11000 - 14000 cP @Temperature 23.0 °C	11000 - 14000 cP @Temperature 73.4 °F	20 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	80	80
Tensile Modulus	2.15 GPa	312 ksi	Storage
Shear Strength	10.26 MPa	1488 psi	Lap
	>= 23.4 MPa	>= 3400 psi	Die

Thermal Properties	Metric	English	Comments
CTE, linear	24.0 µm/m-°C	13.3 µin/in-°F	Below Tg
	77.0 µm/m-°C	42.8 µin/in-°F	Above Tg
Thermal Conductivity	1.09 W/m-K	7.56 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	200 °C	392 °F	Continuous
	300 °C	572 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 100 °C	>= 212 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature	435 °C	815 °F	Degradation Temperature; TGA

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 0.00050 ohm-cm	>= 0.00050 ohm-cm

Chemical Properties	Metric	English
Ionic Impurities - Na (Sodium)	6.0 ppm	6.0 ppm
Ionic Impurities - K (Potassium)	4.0 ppm	4.0 ppm
Ionic Impurities - Cl (Chloride)	125 ppm	125 ppm

Processing Properties	Metric	English	Comments
Cure Time	2.00 min @Temperature 180 °C	0.0333 hour @Temperature 356 °F	Bond Line
	15.0 min @Temperature 150 °C	0.250 hour @Temperature 302 °F	Bond Line
Pot Life	1440 min	1440 min
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties	Value	Comments
Color	Amber	Part B
	Silver	Part A
Consistency	Smooth Thixotropic Paste
Ionic Impurities NH4	27 ppm
Mix Ratio By Weight	100:3
Number of Components	Two
Thixotropic Index	3.9
Weight Loss	0.23%	300°C

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