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Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® E2001-HV Electrically Conductive, Silver-Filled Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.Advantages & Application Notes:Snap cure adhesive or fast-cure; chips can be cured in-line < 90 seconds travel time; or lead-frames can be loaded into magazines for box oven curing
Physical Properties Metric English Comments
Specific Gravity 1.04 g/cc
1.04 g/cc
Part B
2.67 g/cc
2.67 g/cc
Part A
Particle Size <= 20 µm
<= 20 µm
Viscosity 11000 - 14000 cP

@Temperature 23.0 °C
11000 - 14000 cP

@Temperature 73.4 °F
20 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 80
80
Tensile Modulus 2.15 GPa
312 ksi
Storage
Shear Strength 10.26 MPa
1488 psi
Lap
>= 23.4 MPa
>= 3400 psi
Die
Thermal Properties Metric English Comments
CTE, linear 24.0 µm/m-°C
13.3 µin/in-°F
Below Tg
77.0 µm/m-°C
42.8 µin/in-°F
Above Tg
Thermal Conductivity 1.09 W/m-K
7.56 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 200 °C
392 °F
Continuous
300 °C
572 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 100 °C
>= 212 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 435 °C
815 °F
Degradation Temperature; TGA
Electrical Properties Metric English Comments
Volume Resistivity >= 0.00050 ohm-cm
>= 0.00050 ohm-cm
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) 6.0 ppm
6.0 ppm
Ionic Impurities - K (Potassium) 4.0 ppm
4.0 ppm
Ionic Impurities - Cl (Chloride) 125 ppm
125 ppm
Processing Properties Metric English Comments
Cure Time 2.00 min

@Temperature 180 °C
0.0333 hour

@Temperature 356 °F
Bond Line
15.0 min

@Temperature 150 °C
0.250 hour

@Temperature 302 °F
Bond Line
Pot Life 1440 min
1440 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Amber
Part B
Silver
Part A
Consistency Smooth Thixotropic Paste
Ionic Impurities NH4 27 ppm
Mix Ratio By Weight 100:3
Number of Components Two
Thixotropic Index 3.9
Weight Loss 0.23%
300°C
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