Epoxy Technology EPO-TEK® 301-2FL Low Stress, Optical Epoxy

Product Description: EPO-TEK® 301-2FL is a two component optical, medical, and semiconductor grade epoxy resin. It is a more flexible version of EPO-TEK® 301-2.Advantages & Application Notes: Suggested for LCD optical lamination and sealing of glass plates. The product can resist yellowing over 17 days of continuous UV light exposure. Suitable for LED encapsulation.Ease of use: potting and casting, encapsulation, and adhesive.Semiconductor applications: underfill for flip chips, glob top encapsulation over wire bonds, spin coating at wafer level.Compliant adhesive that will be resistant to impact or vibrations. Low stress adhesive for bonding optics inside OEM / scientific instruments.Fiber optic adhesive; bundling fibers, terminating fiber into ferrule, adhesive for mounting optics inside fiber components, bonding glass cover slip over V-groove; spectral transmission of visible and IR light.BIOCOMPATIBLE and NON-TOXIC; complies with USP Class VI biocompatibility standards for medical devices and implantation applications.Adhesion to glass, quartz, metals, wood and most plastics is very good.May also be used for impregnating wooden or porous objects for artifact restoration.Capable of both heat cure and room temperature cure.Information Provided by Epoxy Technology