Category | Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive |
Manufacturer | Epoxy Technology |
Trade Name | EPO-TEK® |
Port | Ningbo port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | Epoxy Technology EPO-TEK® H35-175MPT Electrically Conductive, Silver Epoxy.pdf |
Price | EMAIL US sales@lookpolymers.com |
Physical Properties | Metric | English | Comments |
---|---|---|---|
Specific Gravity | 3.65 g/cc | 3.65 g/cc | |
Particle Size | <= 20 µm | <= 20 µm | |
Viscosity | 90000 - 110000 cP @Temperature 23.0 °C |
90000 - 110000 cP @Temperature 73.4 °F |
2.5 rpm |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Hardness, Shore D | 83 | 83 | |
Tensile Modulus | 2.92 GPa | 424 ksi | Storage |
Shear Strength | 11.67 MPa | 1693 psi | Lap |
>= 23.4 MPa | >= 3400 psi | Die |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 35.0 µm/m-°C | 19.4 µin/in-°F | Below Tg |
123 µm/m-°C | 68.3 µin/in-°F | Above Tg | |
Thermal Conductivity | 2.67 W/m-K | 18.5 BTU-in/hr-ft²-°F | |
Maximum Service Temperature, Air | 200 °C | 392 °F | Continuous |
300 °C | 572 °F | Intermittent | |
Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
-55.0 °C | -67.0 °F | Intermittent | |
Glass Transition Temp, Tg | >= 100 °C | >= 212 °F | Dynamic Cure 20—300°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
Decomposition Temperature | 354 °C | 669 °F | Degradation Temperature |
Electrical Properties | Metric | English | Comments |
---|---|---|---|
Volume Resistivity | <= 0.00050 ohm-cm | <= 0.00050 ohm-cm |
Chemical Properties | Metric | English | Comments |
---|---|---|---|
Ionic Impurities - Na (Sodium) | <= 50 ppm | <= 50 ppm | |
Ionic Impurities - K (Potassium) | <= 50 ppm | <= 50 ppm | |
Ionic Impurities - Cl (Chloride) | <= 200 ppm | <= 200 ppm |
Processing Properties | Metric | English | Comments |
---|---|---|---|
Cure Time | 60.0 min @Temperature 180 °C |
1.00 hour @Temperature 356 °F |
Minimum Bond Line |
90.0 min @Temperature 165 °C |
1.50 hour @Temperature 329 °F |
Minimum Bond Line | |
Pot Life | 40320 min | 40320 min | |
Shelf Life | 12.0 Month @Temperature -40.0 °C |
12.0 Month @Temperature -40.0 °F |
Descriptive Properties | Value | Comments |
---|---|---|
Color | Silver | |
Consistency | Smooth thixotropic paste | |
Ionic Impurities NH4 | 32 ppm | |
Number of Components | Single | |
Thixotropic Index | 4.6 | |
Weight Loss | 0.03% | 200°C |
0.05% | 250°C | |
0.13% | 300°C |