Epoxy Technology EPO-TEK® 302-3M Optically Transparent Epoxy

Category	Polymer , Thermoset , Epoxy
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® 302-3M Optically Transparent Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Product Description: EPO-TEK® 302-3M is a two component epoxy used for optical, medical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as a coating.Advantages & Application Notes: Low viscosity, clear and colorless epoxy is well suited for potting applications, and for transmitting VIS or NIR light in opto-circuits.Excellent water, chemical, and solvent resistant properties including 10% nitric acid, acetone, hexane, and dichlorormethane.Suggested Applications:Fiber Optic/Optical:Potting and encapsulation; lens and prism bonding for Scientific / OEM instruments; LED encapsulant. Transmission in the VIS/NIR range from 350 – 1550 nm. Can be used in the optical pathway.Potting or sealing the fiber into the snout of the opto-package.Adhesive for V-groove, fiber arrays or lens arrays.Bonding optical fibers into ferrules. Fibers of glass or plastic. Ferrules of glass, quartz, stainless steel, kovar, or ceramic.Semiconductor:Recommended for underfilling of flip chips or SMDs on PCB; can also be used for COB glob top process using a DAM/FILL method; can resist 85/85 moisture soaks, as well as Tcycles and Tshocks.Medical:Wicking into fiber optic bundles for endoscopes or light guides; very good autoclave resistance.Adhesion to stainless steel metal, ceramic, titanium and most plastics.USP Class VI bio-compatible.Passes NASA low outgassing standard ASTM E595 with proper cure This product has been tested and satisfies low halogen requirements.Information Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	0.960 g/cc	0.960 g/cc	Part B
	1.20 g/cc	1.20 g/cc	Part A
Viscosity	800 - 1600 cP @Temperature 23.0 °C	800 - 1600 cP @Temperature 73.4 °F	100 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	80	80
Tensile Modulus	1.73 GPa	252 ksi	Storage
Shear Strength	>= 13.8 MPa	>= 2000 psi	Lap
	>= 23.4 MPa	>= 3400 psi	Die

Thermal Properties	Metric	English	Comments
CTE, linear	56.0 µm/m-°C	31.1 µin/in-°F	Below Tg
	193 µm/m-°C	107 µin/in-°F	Above Tg
Maximum Service Temperature, Air	175 °C	347 °F	Continuous
	250 °C	482 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 55.0 °C	>= 131 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature	351 °C	664 °F	Degradation Temperature

Optical Properties	Metric	English	Comments
Refractive Index	1.5446 @Wavelength 589 nm	1.5446 @Wavelength 589 nm	uncured
Transmission, Visible	>= 95 % @Wavelength 460 - 1620 nm	>= 95 % @Wavelength 460 - 1620 nm	Spectral

Electrical Properties	Metric	English
Volume Resistivity	>= 1.00e+13 ohm-cm	>= 1.00e+13 ohm-cm
Dielectric Constant	3.39 @Frequency 1000 Hz	3.39 @Frequency 1000 Hz
Dissipation Factor	0.0061 @Frequency 1000 Hz	0.0061 @Frequency 1000 Hz

Chemical Properties	Metric	English
Ionic Impurities - Na (Sodium)	10 ppm	10 ppm
Ionic Impurities - K (Potassium)	4.0 ppm	4.0 ppm
Ionic Impurities - Cl (Chloride)	42 ppm	42 ppm

Processing Properties	Metric	English
Cure Time	180 min @Temperature 65.0 °C	3.00 hour @Temperature 149 °F
	1440 min @Temperature 23.0 °C	24.0 hour @Temperature 73.4 °F
Pot Life	60 min	60 min
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties	Value	Comments
Color	Clear/Colorless	Part A
	Clear/Colorless	Part B
Consistency	Pourable liquid
Ionic Impurities NH4	1 ppm
Mix Ratio By Weight	100:45
Number of Components	Two
Weight Loss	0.77%	250°C
	1.22%	300°C

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