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Epoxy Technology EPO-TEK® H20-FC Electrically Conductive Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® H20-FC Electrically Conductive Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK®H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly.Advantages & Application Notes: It is a snap cure version of EPO-TEK® H20E, designed for snap cure at 140°C and
Physical Properties Metric English Comments
Specific Gravity 2.51 g/cc
2.51 g/cc
Part B
3.80 g/cc
3.80 g/cc
Part A
Particle Size <= 45 µm
<= 45 µm
Viscosity 2361 cP

@Temperature 23.0 °C
2361 cP

@Temperature 73.4 °F
50 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 55
55
Tensile Modulus 6.39 GPa
928 ksi
Storage
Shear Strength >= 13.8 MPa
>= 2000 psi
Lap
>= 23.4 MPa
>= 3400 psi
Die
Thermal Properties Metric English Comments
CTE, linear 56.0 µm/m-°C
31.1 µin/in-°F
Below Tg
233 µm/m-°C
129 µin/in-°F
Above Tg
Thermal Conductivity 2.63 W/m-K
18.3 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 200 °C
392 °F
Continuous
300 °C
572 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg 85.0 °C
185 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 392 °C
738 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity <= 0.00040 ohm-cm
<= 0.00040 ohm-cm
Processing Properties Metric English Comments
Cure Time 15.0 min

@Temperature 120 °C
0.250 hour

@Temperature 248 °F
Minimum Bond Line
35.0 min

@Temperature 140 °C
0.583 hour

@Temperature 284 °F
Minimum Bond Line
45.0 min

@Temperature 80.0 °C
0.750 hour

@Temperature 176 °F
Minimum Bond Line
Pot Life 1200 min
1200 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Silver
Part A
Silver
Part B
Consistency Smooth thixotropic paste
Mix Ratio By Weight 1:1
Number of Components Two
Thixotropic Index 4.62
Weight Loss 0.73%
200°C
1.67%
250°C
2.37%
300°C
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