Epoxy Technology EPO-TEK® 360 Low Viscosity Optical Epoxy Adhesive

Category	Polymer , Thermoset , Epoxy
Manufacturer	Epoxy Technology
Trade Name	EPO-TEK®
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Epoxy Technology EPO-TEK® 360 Low Viscosity Optical Epoxy Adhesive.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Product Description: EPO-TEK® 360 is a two component, high-temperature grade epoxy for semiconductor, electronics, fiber optics and medical applications.Advantages & Application Notes: Built in color change from clear to amber when cured properly. The color change can be used for in-line inspection of epoxy joints and adhesive fillet.Unfilled epoxy resin allows for % transmission in the VIS and NIR to be realized.Low viscosity allows for wicking and capillary action.Suggested Applications:Semiconductor: capillary flow underfill for Flip Chip mounted dieFiber Optic: polarizing maintaining fibers ( PMF ) found in gyroscope coils; fiber termination into ferrule.Medical: impregnation into fiber optic light guides and endoscopes; resist autoclave, ETO, or gamma sterilization.Electronics: impregnating copper coil windings found in motors or SMD inductor coils; adhesion to ferrite coresFeatured inside Technical Paper #11 titled ?Significance of Glass Transition Temperature on Epoxy Resins for Fiber Optic Applications”Information Provided by Epoxy Technology

Physical Properties	Metric	English	Comments
Specific Gravity	1.02 g/cc	1.02 g/cc	Part B
	1.15 g/cc	1.15 g/cc	Part A
Viscosity	350 - 550 cP @Temperature 23.0 °C	350 - 550 cP @Temperature 73.4 °F	100 rpm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	87	87
Tensile Modulus	2.22 GPa	322 ksi	Storage
Shear Strength	>= 13.8 MPa	>= 2000 psi	Lap
	>= 23.4 MPa	>= 3400 psi	Die

Thermal Properties	Metric	English	Comments
CTE, linear	39.0 µm/m-°C	21.7 µin/in-°F	Below Tg
	175 µm/m-°C	97.2 µin/in-°F	Above Tg
Maximum Service Temperature, Air	200 °C	392 °F	Continuous
	300 °C	572 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 90.0 °C	>= 194 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature	375 °C	707 °F	Degradation Temperature

Optical Properties	Metric	English	Comments
Refractive Index	1.5345 @Wavelength 589 nm	1.5345 @Wavelength 589 nm
Transmission, Visible	>= 51 % @Wavelength 500 nm	>= 51 % @Wavelength 500 nm	Spectral
	>= 88 % @Wavelength 600 nm	>= 88 % @Wavelength 600 nm	Spectral
	>= 97 % @Wavelength 700 - 1600 nm	>= 97 % @Wavelength 700 - 1600 nm	Spectral

Electrical Properties	Metric	English
Volume Resistivity	<= 2.00e+13 ohm-cm	<= 2.00e+13 ohm-cm
Dielectric Constant	3.74 @Frequency 1000 Hz	3.74 @Frequency 1000 Hz
Dissipation Factor	0.011 @Frequency 1000 Hz	0.011 @Frequency 1000 Hz

Processing Properties	Metric	English	Comments
Cure Time	1.00 min @Temperature 150 °C	0.0167 hour @Temperature 302 °F	Minimum Bond Line
	10.0 min @Temperature 100 °C	0.167 hour @Temperature 212 °F	Minimum Bond Line
Pot Life	360 min	360 min
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties	Value	Comments
Color	Amber	Part B
	Clear/Colorless	Part A
Consistency	Pourable liquid
Mix Ratio By Weight	100:10
Number of Components	Two
Weight Loss	0.08%	200°C
	0.25%	250°C
	1.06%	300°C

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