Songhan Plastic Technology Co.,Ltd.

Master Bond EP21TDC-2 Highly Flexible Cryogenic Epoxy Compound

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Master Bond Inc.
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP21TDC-2 Highly Flexible Cryogenic Epoxy Compound.pdf
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Material Notes:
Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding, sealing, coating and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperatures with a non-critical one to three mix ratio by weight. The cured compound has very high peel strength, greater than 30 pli, and an elongation of over 150%. Serviceable at cryogenic temperatures.
Physical Properties Metric English Comments
Viscosity 70000 - 80000 cP

@Temperature 23.0 °C
70000 - 80000 cP

@Temperature 73.4 °F
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 121 °C
250 °F
Minimum Service Temperature, Air -269 °C
-453 °F
Processing Properties Metric English Comments
Cure Time 120 - 180 min

@Temperature 93.3 °C
2.00 - 3.00 hour

@Temperature 200 °F
4320 min

@Temperature 23.0 °C
72.0 hour

@Temperature 73.4 °F
Descriptive Properties Value Comments
Color Code "A" Clear; "B" Amber
Mix Ratio By Weight 33/100
Set-Up Time, minutes 75-90
At Room Temperature
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