Master Bond EP21TDC-2 Highly Flexible Cryogenic Epoxy Compound

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer	Master Bond Inc.
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Master Bond EP21TDC-2 Highly Flexible Cryogenic Epoxy Compound.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding, sealing, coating and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperatures with a non-critical one to three mix ratio by weight. The cured compound has very high peel strength, greater than 30 pli, and an elongation of over 150%. Serviceable at cryogenic temperatures.

Physical Properties	Metric	English	Comments
Viscosity	70000 - 80000 cP @Temperature 23.0 °C	70000 - 80000 cP @Temperature 73.4 °F

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	121 °C	250 °F
Minimum Service Temperature, Air	-269 °C	-453 °F

Processing Properties	Metric	English	Comments
Cure Time	120 - 180 min @Temperature 93.3 °C	2.00 - 3.00 hour @Temperature 200 °F
	4320 min @Temperature 23.0 °C	72.0 hour @Temperature 73.4 °F

Descriptive Properties	Value	Comments
Color Code	"A" Clear; "B" Amber
Mix Ratio By Weight	33/100
Set-Up Time, minutes	75-90	At Room Temperature

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