Polymer Property : Viscosity = 70000 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	70000 cP @Shear Rate 400 1/s, Temperature 200 °C	70000 cP @Shear Rate 400 1/s, Temperature 392 °F
Premix Thermoplastics PRESEAL® TPE 5020 General Description:PRESEAL® TPE 5020 is a thermoplastic elastomer based highly conductive compound intended primarily for EMI gasket applications. It may also find interesting uses as conductors o..
Viscosity	70000 - 200000 cP	70000 - 200000 cP
Lord Adhesives 510 Fast Cure Acrylic Adhesive Lord 500 SeriesLord 500 Series Acrylic Adhesives bond plastics and prepared metals; they offer excellent adhesion to both thermoplastics and thermoset plastics. They are available with varying handi..
Viscosity	70000 - 100000 cP	70000 - 100000 cP
Lord Adhesives Metech 7801 Cermet Resistor Overglaze Composition Resistor overglaze composition 7801 is a laser trimable, green colored glaze designed to be printed and fired over thick film resistors. 7801 improves the stability of laser or air-abrasive trimmed ..
Viscosity	70000 cP @Temperature 25.0 Â°C	70000 cP @Temperature 77.0 Â°F
Lord Adhesives Thermosetâ„¢ MD-200 Electrically Conductive Die-Attach Adhesive This is a system with the versatility to fit a wide variety of production and performance needs. The working life allows sufficient time for short production interruption. It can be initially cured ..
Viscosity	70000 cP	70000 cP	Mixed Viscosity
ITW Devcon One minuteâ„¢ Epoxy Gel, Amber Information provided by ITW Devcon
Viscosity	70000 cP	70000 cP	Mixed Viscosity
ITW Devcon Epoxy Plusâ„¢ 25 Grey Information provided by ITW Devcon
Viscosity	70000 - 140000 cP	70000 - 140000 cP	Part B
Master Bond EP21TDCHT-LO Room Temperature Curing, Toughened Two Component Epoxy Master Bond Polymer Adhesive EP21TDCHT-LO is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one ..
Viscosity	70000 - 80000 cP	70000 - 80000 cP
Master Bond EP51FL-1 Rapid Curing Cryogenic Two Component Epoxy Master Bond Polymer System EP51FL-1 is a two component highly flexible epoxy resin system for high performance bonding sealing and coating. Although most flexiblilized epoxy formulations are very sl..
Viscosity	70000 - 150000 cP	70000 - 150000 cP
Master Bond Supreme 3HT-80 High Strength Epoxy Adhesive Cures at 80°C Description: Master Bond Supreme 3HT-80 is a one component, heat curing epoxy system featuring excellent physical strength properties and toughness with an eye-catching curing temperature of 170-175..
Viscosity	70000 - 80000 cP @Temperature 23.0 °C	70000 - 80000 cP @Temperature 73.4 °F
Master Bond EP21TDC-2 Highly Flexible Cryogenic Epoxy Compound Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding, sealing, coating and encapsulation. It is formulated to cure fully at ambie..
Viscosity	70000 - 80000 cP @Temperature 23.0 °C	70000 - 80000 cP @Temperature 73.4 °F
Master Bond EP34 Room Temperature Curing Two Component Epoxy System Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. Adhesion to metals, glass, ceramics, woo..
Viscosity	70000 - 80000 cP @Temperature 23.0 °C	70000 - 80000 cP @Temperature 73.4 °F
Master Bond EP35 High Temperature Resistant Two Component Epoxy System Master Bond Polymer Adhesive EP35 is a unique, room temperature curing, two component epoxy adhesive for high temperature bonding applications. Master Bond Polymer Adhesive EP35 produces high stren..
Viscosity	70000 cP @Temperature 25.0 °C	70000 cP @Temperature 77.0 °F	Mixed
Trelleborg Emerson & Cuming Eccobond® D 275 One-Component Fast Cure Epoxy Adhesive Emerson & Cuming D 275 Eccobond® One-Component Fast Cure Epoxy AdhesiveSemi-rigid, high strength, fast curing, pourable, epoxy structural adhesive. Good peel strength (12 pli), Recommended for bond..
Viscosity	70000 cP	70000 cP	Haake cone and plate rheometer @ 5/sec (35mm/2° cone)
Loctite® 3534 Glob Top Encapsulant COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp..
Viscosity	70000 cP	70000 cP	dynamic
Dow Corning SILASTIC® M-3 RTV SILICONE RUBBER BASE & CURING AGENT Dow Corning Silastic® M-3 RTV Silicone Rubber is an addition cured (platinum catalyzed); high durometer silicone rubber developed for use in prototyping, architectural, and furniture applications w..
Viscosity	70000 cP	70000 cP	catalyzed with QM 260B
ACC QM 260 QSI Quantum Silicones 60 Durometer Addition Cure Moldmaking Material QM 260 is a two component, room temperature addition cure silicone material. The cured rubber has excellent mechanical properties and good shelf-life stability. This material is a good choice for th..
Viscosity	70000 - 6.00e+6 cP	70000 - 6.00e+6 cP
3M Scotch-Weld™ 183 B/A Green Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive 1838 B/A is a controlled flow product. This epoxy adhesives are two-part, room temperature curing structural adhesives with high shear strengths and excellent envir..
Viscosity	70000 cP	70000 cP	Base
3M Scotch-Weld™ DP8405NS Acrylic Adhesives 3M™ Scotch-Weld™ Acrylic Adhesive DP8405NS is a high performance, two-part acrylic adhesives that offer excellent shear, peel and impact performance. These toughened adhesives provide improved adh..
Viscosity	70000 cP	70000 cP	Base
3M Scotch-Weld™ DP820 Acrylic Adhesives 3M™ Scotch-Weld™ Acrylic Adhesive DP820 is a two-part, 1:1 mix ratio, toughened acrylic structural adhesives. They exhibit excellent shear and peel strengths along with good impact and durability ..
Viscosity	70000 cP	70000 cP	Thixotropic Gel
Dymax 9-20493 Voil Coil Assembly Disk Drive Adhesive Disk Drive AdhesivesLow Outgassing Multi-Cure® Memory Saver Disk Drive AdhesivesDescriptionDymax offers a range of advanced formula epoxy and acrylic adhesives for disk drive assembly. UV cures in ..