Polymer Property : Minimum Service Temperature, Air = -453 °F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Minimum Service Temperature, Air	-269 - 15.6 °C	-453 - 60.0 °F	Average value: -62.8 °C Grade Count:115
Overview of materials for Epoxy Encapsulant, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Encapsulant, Unreinforced". Each property range of values reported is minimum and maximum values o..
Minimum Service Temperature, Air	-269 °C	-453 °F
Master Bond EP21TDCS Silver Filled Electrically Conductive Epoxy Compound Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidl..
Minimum Service Temperature, Air	-269 °C	-453 °F
Master Bond EP30FL Low Viscosity, Flexibilized Two Component Epoxy Master Bond Polymer System EP30FL is a low viscosity, flexibilized, two component epoxy resin system for high performance potting, casting, encapsulation as well as bonding and sealing. Master Bond ..
Minimum Service Temperature, Air	-269 °C	-453 °F
Master Bond EP37-3FLF Low Exotherm Highly Flexible Two Component Epoxy Master Bond Polymer System EP37-3FLF is a very flexible, low viscosity, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. The ..
Minimum Service Temperature, Air	-269 °C	-453 °F
Master Bond EP50-1.5 Fast Setting, Fast Curing Two Component Epoxy Adhesive Master Bond Polymer Adhesive EP50-1.5 is an exceptionally fast setting, fast curing two component epoxy. EP50-1.5, for general purpose bonding, is formulated to cure at room temperature with a one-t..
Minimum Service Temperature, Air	-269 °C	-453 °F
Master Bond EP51 Fast Curing High Bond Strength Epoxy Adhesive Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or..
Minimum Service Temperature, Air	-269 °C	-453 °F
Master Bond Supreme 10HT One Component, Low Outgassing, Toughened Epoxy System Master Bond Supreme 10HT features a unique blend of performance properties including both high shear and peel strengths along with convenient handling. Supreme 10HT is room temperature storable and ..
Minimum Service Temperature, Air	-269 °C	-453 °F
Master Bond Supreme 10HTF Fast Curing Toughened One Component Epoxy Adhesive Master Bond Polymer System Supreme 10HTF is a one part, no-mix system featuring a unique combination of properties including high shear and peel strength, exceptionally wide service temperature rang..
Minimum Service Temperature, Air	-269 °C	-453 °F
Master Bond Supreme 10HTS Silver Filled Electrically Conductive One Part Epoxy Master Bond Supreme 10HT/S is a one component, no mix high purity silver conductive system formulated to cure at elevated temperatures. Tensile shear strengths greater than 1,200 psi and T-peel stre..
Minimum Service Temperature, Air	-269 °C	-453 °F
Master Bond EP21TDC-2 Highly Flexible Cryogenic Epoxy Compound Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding, sealing, coating and encapsulation. It is formulated to cure fully at ambie..
Minimum Service Temperature, Air	-269 °C	-453 °F
Master Bond EP29LPSP Low Outgassing, Optically Clear Two Component Epoxy Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. EP29LPSP is serviceable at..
Minimum Service Temperature, Air	-269 °C	-453 °F
Master Bond EP30DP Abrasion Resistant Cryogenic Epoxy Urethane System Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, se..