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Master Bond EP112FLAO-1 Toughened, Two component, Heat Curing Epoxy

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Master Bond Inc.
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Master Bond EP112FLAO-1 Toughened, Two component, Heat Curing Epoxy.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
Master Bond EP112FLAO-1 is a toughened two component, high performance epoxy resin system featuring very good temperature resistance, fine thermal conductivity and electrical insulation values with sound dimensional stability. This system passes NASA low outgassing testing. The mix ratio is 100:80 by weight. After mixing EP112FLAO-1 has a very long open time of a few days but requires oven curing. A typical cure schedule is 2-3 hours at 250°F followed by 5-8 hours at 300°F with a 2 hour post cure at 350°F, although, a number of variations are possible. Also EP112FLAO-1 is ideal for potting and encapsulation because of its lower viscosity and its advantageous flow properties.
Physical Properties Metric English Comments
Viscosity 25000 - 60000 cP
25000 - 60000 cP
Mixed, thixotropic
Mechanical Properties Metric English Comments
Hardness, Shore D >= 85
>= 85
Tensile Strength >= 75.8 MPa

@Temperature 23.9 °C
>= 11000 psi

@Temperature 75.0 °F
Compressive Strength >= 138 MPa
>= 20000 psi
Thermal Properties Metric English Comments
CTE, linear 25.0 - 30.0 µm/m-°C
13.9 - 16.7 µin/in-°F
Thermal Conductivity 1.30 - 1.44 W/m-K
9.00 - 10.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 260 °C
500 °F
Minimum Service Temperature, Air -51.1 °C
-60.0 °F
Electrical Properties Metric English Comments
Electrical Resistivity >= 3e+11 ohm-cm

@Temperature 150 °C
>= 3e+11 ohm-cm

@Temperature 302 °F
Volume Resistivity >= 3e+12 ohm-cm

@Temperature 100 °C
>= 3e+12 ohm-cm

@Temperature 212 °F
>= 3e+14 ohm-cm

@Temperature 25.0 °C
>= 3e+14 ohm-cm

@Temperature 77.0 °F
Dielectric Constant 4.3

@Frequency 60.0 Hz,
Temperature 23.0 °C
4.3

@Frequency 60.0 Hz,
Temperature 73.4 °F
Dissipation Factor 0.31

@Frequency 60.0 Hz,
Temperature 23.0 °C
0.31

@Frequency 60.0 Hz,
Temperature 73.4 °F
Processing Properties Metric English Comments
Shelf Life 6.00 Month
6.00 Month
unopened containers
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