Physical Properties | Metric | English | Comments |
---|---|---|---|
Viscosity | 25000 - 45000 cP @Temperature 25.0 °C |
25000 - 45000 cP @Temperature 77.0 °F |
|
Nanocyl EPOCYL™ NC E128-04 Master Batch Liquid Bisphenol-A Resin for Solvent Based Formulation Purposes EPOCYL™ NC E128-04 is a Mater Batch based on liquid Bisphenol-A (Bis-A) epoxy resin containing high concentration of Carbon Nanotubes (CNT) produced by Nanocyl. It is specifically developed for so.. |
|||
Viscosity | 25000 - 45000 cP @Temperature 25.0 °C |
25000 - 45000 cP @Temperature 77.0 °F |
|
Nanocyl EPOCYL™ NC R128-04 Master Batch Liquid Bisphenol-A Resin for Solvent Based Formulation Purposes: Dilution Factor 6 EPOCYL™ NC R128-04 is a Master Batch based on liquid Bisphenol-A (Bis-A) epoxy resin containing high concentration of Carbon Nanotubes (CNT) produced by Nanocyl, with a suggested dilution factor of.. |
|||
Viscosity | 25000 - 450000 cP | 25000 - 450000 cP | Average value: 242000 cP Grade Count:6 |
Overview of materials for Epoxy/Carbon Fiber Composite This property data is a summary of similar materials in the MatWeb database for the category "Epoxy/Carbon Fiber Composite". Each property range of values reported is minimum and maximum values of a.. |
|||
Viscosity | 25000 cP | 25000 cP | |
ACC QSil 30 QSI Quantum Silicones 50 Durometer Condensation Cure for Potting
(discontinued **) Part of the Amber Chemical Group. Data provided by manufacturer.Characteristics: self-leveling, variable cure speeds, excellent thermal properties, 100% solid. |
|||
Viscosity | 25000 cP | 25000 cP | Base |
ACC Stretch Effect QSI Quantum Silicones Stretch Effect 22 Durometer Addition Cure Translucent Moldmaking Material
& Part of the Amber Chemical Group. Data provided by manufacturer.Characteristics: low viscosity, fast demold time, high elongation, excellent flexibility. Applications: special effects, skin replicat.. |
|||
Viscosity | 25000 - 33000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
25000 - 33000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
Gwent Electronic Materials C2090415D1 Gold Ink Gold Ink C2090415D1 is a fritted system that has been designed as a screen printing paste for firing onto high temperature substrates. This Materials is suitable for single fire applications. This .. |
|||
Viscosity | 25000 cP | 25000 cP | |
Momentive Performance Materials RTV116 One Component Acetoxy Adhesive Sealant, Red RTV series one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. .. |
|||
Viscosity | 25000 cP @Temperature 25.0 °C |
25000 cP @Temperature 77.0 °F |
|
Momentive Performance Materials RTV31 Red Extreme High Temperature Potting/Encapsulating Compound Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate.. |
|||
Viscosity | 25000 cP | 25000 cP | |
Momentive Performance Materials RTV31 Silicone Rubber Compound for High Temperature, Red RTV31, RTV60 and RTV88 silicone rubber compounds are high temperature two-part silicone elastomers. They are supplied ready-to-use with a base compound and DEBT (deputy tin deflagrate) as the standa.. |
|||
Viscosity | 25000 - 40000 cP @Temperature 40.0 °C |
25000 - 40000 cP @Temperature 104 °F |
|
Taiwan PU Corporation PPG CPU-2172 Polyurethane Casting Elastomer A urethane elastomer that can be cured by reacting with a polyamine or a polyolhardener. The molding process is composed of pre-heating, degassing, maxing with a hardener, pouring into the mold, cu.. |
|||
Viscosity | 25000 cP | 25000 cP | Before Curing |
Silikony Polskie Gumosil T Silicone Rubber Hard, resistant to sudden and extensive temperature changes |
|||
Viscosity | 25000 - 30000 cP @Temperature 23.0 °C |
25000 - 30000 cP @Temperature 73.4 °F |
|
Master Bond EP21FRSPLV Flame Resistant Two Component Epoxy Master Bond Polymer System EP21FRSPLV is a two component, room temperature curable, flame resistant compound for potting, encapsulating and casting. EP21FRSPLV has a one to one mix ratio, by weight... |
|||
Viscosity | 25000 - 45000 cP | 25000 - 45000 cP | |
Master Bond MasterSil 708FR One Part, Flame Resistant Silicone Description: MasterSil 708FR is a one component, high performance RTV silicone that is mainly used for its flame retardancy. It is UL listed with a flame classification for 94V.1 for thicknesses of .. |
|||
Viscosity | 25000 - 40000 cP | 25000 - 40000 cP | Part A |
Master Bond EP30QF Quartz Filled, Two Component Epoxy System Master Bond Polymer System EP30QF is a quartz filled, two component epoxy for high performance bonding, sealing, coating and casting that is formulated to cure at room temperature or more rapidly at.. |
|||
Viscosity | 25000 cP | 25000 cP | Mixed (cp #52, 10 rpm) |
Tra-Con Tra-Duct 2924 Conductive Silver Epoxy Adhesive TRA-DUCT 2924 is a two part electrically conductive composition developed for low shrinkage, low resistivity bonding applications where good electrical and physical properties over a wide temperatur.. |
|||
Viscosity | 25000 cP @Temperature 25.0 °C |
25000 cP @Temperature 77.0 °F |
Mixed |
Trelleborg Emerson & Cuming Eccobond® 45LV Two-Component General Purpose Epoxy Adhesive Emerson & Cuming 45LV Eccobond® Two-Component General Purpose Epoxy AdhesiveLow viscosity, filled, general purpose, room temperature curing, epoxy adhesive and sealant. Flexibility can be adjusted .. |
|||
Viscosity | 25000 cP | 25000 cP | mixing, dynamic |
Dow Corning SILASTIC® 9252/250P PARTS A&B Information provided by Dow Corning |
|||
Viscosity | 25000 cP | 25000 cP | |
Cotronics Duralco™ 4525 Electrically Resistant, Room Temperature Curing Epoxy High bond strength, high thermal stability, low moisture absorption, low shrinkage and excellent chemical, electrical, and radiation resistance.Chemical Resistance: resistant to hydrochloric, phosph.. |
|||
Viscosity | 25000 cP | 25000 cP | Thixotropic Gel |
Dymax 9-20512 Voil Coil Assembly Disk Drive Adhesive Disk Drive AdhesivesLow Outgassing Multi-Cure® Memory Saver Disk Drive AdhesivesDescriptionDymax offers a range of advanced formula epoxy and acrylic adhesives for disk drive assembly. UV cures in .. |
|||
Viscosity | 25000 cP | 25000 cP | Mixed |
Armstrong C-7/W Epoxy Adhesive, 2:3 Mix Ratio A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may .. |
|||
Viscosity | 25000 cP | 25000 cP | |
ACC MM925 Condensation Cure 2-Part Molding Rubber Part of the Amber Chemical Group. Data provided by manufacturer.Characteristics: high tear strength, picks up extremely fine details, low viscosity, good resistance to styrene attack, easy degassing.. |
|||
Viscosity | 25000 cP | 25000 cP | |
ACC MM928 Condensation Cure 2-Part Molding Rubber Part of the Amber Chemical Group. Data provided by manufacturer.Characteristics: high tear strength, picks up extremely fine details, low viscosity, good resistance to styrene attack, easy degassing.. |
|||
Viscosity | 25000 cP | 25000 cP | Accelerator |
3M Scotch-Weld™ DP8810NS Low Odor Acrylic Adhesives 3M™ Scotch-Weld™ Low Odor Acrylic Adhesives are high performance, two-part acrylic adhesives with lower odor than most acrylic adhesives. These toughened products offer excellent shear, peel, and .. |
|||
Viscosity | 25000 cP | 25000 cP | |
Dymax 9-3095-Gel Strain Relief, Wire and Parts Tacking Adhesive High Performance Light-Curing Adhesives and Coatings for Electronic AssemblyDymax 9-3095-Gel Strain Relief, Wire and Parts Tacking AdhesiveFor fastest curing, cure with UV and visible light Cure Typ.. |